Patents
Patents for G01R 1 - Details of instruments or arrangements of the types covered by groups  or (27,269)
08/2001
08/30/2001US20010017549 Probe and method for examining electrical characteristics of devices
08/30/2001DE10109506A1 Method for connecting integrated circuit test head to automatic handling device, with improved pipe connection, allowing low temperature testing of ICs by supply of carbon dioxide vapor to test head
08/30/2001DE10008885A1 Kupplung oder Stecker für eine Steckverbindung zur Anwendung in der Messtechnik, insbesondere in der Umweltmesstechnik Coupling or connector for a connector for use in measuring technology, particularly in the environmental monitoring
08/29/2001EP1128484A2 Coupling or connector for a connection for use in measurement technique, particularly in environmental measurement technique
08/29/2001EP1128479A2 Interconnect contact
08/29/2001EP1128186A1 Test apparatus for wire harnesses
08/29/2001CN2445332Y Digital multimeter mechanical anti-misoperation
08/28/2001US6282594 Pallet, system and method for use in testing and/or installing software onto a personal computer system unit
08/28/2001US6281695 Integrated circuit package pin indicator
08/28/2001US6281694 Monitor method for testing probe pins
08/28/2001US6281693 Semiconductor device test board and a method of testing a semiconductor device
08/28/2001US6281692 Interposer for maintaining temporary contact between a substrate and a test bed
08/28/2001US6281691 Tip portion structure of high-frequency probe and method for fabrication probe tip portion composed by coaxial cable
08/28/2001US6281690 Coaxial radio frequency test probe
08/28/2001US6281029 Probe points for heat dissipation during testing of flip chip IC
08/28/2001US6280219 Socket apparatus for IC packages
08/28/2001US6280202 Board-to-board alignment and securement device
08/28/2001US6279227 Method of forming a resilient contact structure
08/28/2001CA2321623A1 Interconnect contact
08/23/2001WO2001061368A1 Tester and holder for tester
08/23/2001WO2001061365A1 Voltage sensor
08/23/2001WO2001061364A2 Semiconductor component test socket
08/23/2001US20010016938 Inspection method and inspection system using charged particle beam
08/23/2001US20010016437 Electrical connection apparatus
08/23/2001US20010016435 IC socket for surface-monuting semiconductor device
08/23/2001US20010015773 Special contact points for accessing internal circuitry of an integrated circuit
08/23/2001US20010015655 Removable electrical interconnect apparatuses and removable engagement probes
08/23/2001US20010015652 Probe card assembly and kit, and methods of making same
08/23/2001US20010015650 Probe card for testing semiconductor integrated circuit and method of manufacturing the same
08/23/2001US20010015641 Circuit board testing apparatus
08/22/2001EP1126280A1 A press assembly for electrically testing a printed circuit board
08/22/2001EP1125330A1 Method of creating an electrical interconnect device bearing an array of electrical contact pads
08/22/2001EP0975979B1 Method for making cards with multiple contact tips for testing semiconductor chips
08/22/2001CN2444243Y Circuit of protector of electric source and ammeter for ion pump
08/22/2001CN1309772A Residual current detection device
08/21/2001US6278596 Active ground fault disconnect
08/21/2001US6278286 Interconnect and system for making temporary electrical connections to semiconductor components
08/21/2001US6278285 Configuration for testing integrated components
08/21/2001US6278284 Testing IC socket
08/21/2001US6277660 Method and apparatus for testing chips
08/21/2001US6277218 Conducting a thermal treatment on the probe needles, wherein the temperature of the thermal treatment is about 60 degrees celsius to about 100 degrees celsius and rapidly cooling the probe needles
08/21/2001US6276956 Dual point test probe for surface mount type circuit board connections
08/21/2001US6276949 Socket for IC package
08/16/2001US20010014556 Packaging and interconnection of contact structure
08/16/2001US20010013787 Needle load measuring method, needle load setting method and needle load detecting mechanism
08/16/2001US20010013783 Circuit board testing apparatus and method
08/16/2001US20010013773 Configuration with a plurality of sensor groups and method of determining its intactness
08/16/2001US20010013772 Chuck device and chuck method
08/16/2001EP1123512A1 High density printed circuit board
08/16/2001EP1123465A1 Fluid thrust bearing - indicator with an assembling
08/16/2001DE10105876A1 Anschlußstruktur und zugehöriges Herstellungsverfahren Terminal structure and manufacturing method thereof
08/16/2001DE10006023A1 Clip-on measurement terminals making row of closely-adjacent connections, indicate signal state on upper- and rear illuminated displays
08/15/2001CN1308728A Current detector and current measurement apparatus including such detector
08/15/2001CN1308727A Conductive contact
08/15/2001CN1308387A Interconnected contacts
08/14/2001US6275056 Prober device having a specific linear expansion coefficient and probe pitch and method of probing thereof
08/14/2001US6275054 Electrical contact system
08/14/2001US6275052 Probe card and testing method for semiconductor wafers
08/14/2001US6275051 Segmented architecture for wafer test and burn-in
08/14/2001US6274823 Interconnection substrates with resilient contact structures on both sides
08/09/2001WO2001057545A1 Inspection apparatus and method adapted to a scanning technique employing a rolling wire probe
08/09/2001WO2001057541A1 Adapter for testing printed circuit boards and testing needle for such an adapter
08/09/2001US20010012739 Composite microelectronic spring structure and method for making same
08/09/2001US20010012725 System for testing bare IC chips and a socket for such chips
08/09/2001US20010012707 Integrated circuit socket with contact pad
08/09/2001US20010012704 Interconnect assemblies and methods
08/09/2001US20010011907 Test interconnect for bumped semiconductor components and method of fabrication
08/09/2001US20010011906 Method of testing semiconductor integrated circuits and testing board for use therein
08/09/2001US20010011902 Low-current probe card
08/09/2001US20010011899 Method for testing semiconductor wafers
08/09/2001US20010011898 IC socket, a test method using the same and an IC socket mounting mechanism
08/09/2001US20010011897 Metal buckling beam probe
08/09/2001US20010011896 Contact probe arrangement
08/09/2001US20010011888 Voltage detection stick
08/09/2001US20010011762 Integrated circuit package alignment feature
08/09/2001DE10101961A1 Trägeridentifizierungssystem, Trägeridentifizierungsverfahren und Speichermedium Carrier identification system, vehicle identification method and storage medium
08/09/2001DE10004974A1 Adapter for testing circuit boards comprises testing needles and two guide plate units which are laterally movable relative to one another for alignment of the respective guide holes for testing needles
08/08/2001EP1122546A2 Scan test machine for densely spaced test sites
08/08/2001CN1307793A Assembly of an electronic component with spring packaging
08/08/2001CN1069448C Self-aligning low profile socket for connecting ball grid array devices through dendritic interposer
08/07/2001US6271673 Probe for measuring signals
08/07/2001US6271672 Biased BGA contactor probe tip
08/07/2001US6271659 Integrated circuit sample package for checking electrical functionality and alignment of checking devices and corresponding checking method
08/07/2001US6271657 Test head positioner for semiconductor device testing apparatus
08/07/2001US6270357 Mounting for high frequency device packages
08/02/2001WO2001004642A3 Kinematic coupling
08/02/2001US20010010971 Silicide pattern structures and methods of fabricating the same
08/02/2001US20010010462 Carrier identification system, carrier identification method and storage media
08/02/2001DE19945178A1 Meßspitze zur Hochfrequenzmessung und Verfahren zu deren Herstellung Probe head for high-frequency measurement and process for their preparation
08/02/2001DE10102177A1 Mit Anschlußvorsprüngen versehene Anschlußstruktur Provided with terminal projections terminal structure
08/02/2001DE10101538A1 Anschlußstruktur Terminal structure
08/02/2001DE10064515A1 Measurement signal output device for testing integrated circuit, has electro-optical probe which is connected to input/output unit by cables, and signal measurement unit connected to input/output unit by connector
08/01/2001EP1120657A1 Test connector with high interconnection density for integrated circuits
08/01/2001CN1306322A Socket for electrical components
07/2001
07/31/2001US6268740 System for testing semiconductor device formed on semiconductor wafer
07/31/2001US6268719 Printed circuit board test apparatus
07/31/2001US6268015 Method of making and using lithographic contact springs
07/31/2001US6267603 Burn-in test socket
07/26/2001WO2001054186A1 Failure analysis method using emission microscope and system thereof and production method for semiconductor device
07/26/2001US20010009724 Depositing coating on elongate member to give a coated elongate member, coating comprising at least one metal and at least one additive, the additive capable of codepositing with the metal, heat treating; electronics packaging