| Patents for G01R 1 - Details of instruments or arrangements of the types covered by groups or (27,269) |
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| 01/24/2002 | US20020008966 Microelectronic contacts with asperities and methods of making same |
| 01/24/2002 | US20020008535 Probe structure and manufacturing method thereof |
| 01/24/2002 | US20020008534 Prober and low-temperature test equipment having same incorporated therein |
| 01/24/2002 | US20020008530 Micro cantilever style contact pin structure for wafer probing |
| 01/24/2002 | US20020008529 High density, area array probe card apparatus |
| 01/22/2002 | US6340896 Test socket and methods |
| 01/22/2002 | US6340894 Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect |
| 01/22/2002 | US6340893 Printed circuit board test apparatus and method |
| 01/22/2002 | US6340838 Apparatus and method for containing semiconductor chips to identify known good dies |
| 01/22/2002 | US6340302 Apparatus for establishing an electrical connection with a wafer to facilitate wafer-level burn-in and methods |
| 01/17/2002 | WO2002005606A2 Closed-grid bus architecture for wafer interconnect structure |
| 01/17/2002 | WO2002004968A2 Universal burn-in socket for testing integrated circuit chip |
| 01/17/2002 | WO2002004966A2 An apparatus and method for testing a socket on a burn-in board using a flex strip probe |
| 01/17/2002 | WO2002004965A2 Load board feeder |
| 01/17/2002 | WO2002004961A2 Self-retained spring probe |
| 01/17/2002 | US20020006696 Protective structures for bond wires, methods for forming same, and test apparatus including such structures |
| 01/17/2002 | US20020005729 Method and system for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| 01/17/2002 | US20020005728 Micro probe and method of fabricating same |
| 01/17/2002 | US20020005725 Measurement by concentration of a material within a structure |
| 01/17/2002 | US20020005714 Low compliance tester interface |
| 01/17/2002 | US20020005569 Contact terminal element, contact terminal device, manufacture thereof, and method of measuring semiconductor device |
| 01/16/2002 | EP1172658A2 Probe and test socket assembly |
| 01/16/2002 | CN1331805A Lead frame structure for testing integrated circuits |
| 01/16/2002 | CN1078013C Pallet installation table for processor |
| 01/15/2002 | US6338629 Electrical connecting device |
| 01/10/2002 | WO2002003085A1 Automated protection of ic devices from eos (electro over stress) damage due to an undesired dc transient |
| 01/10/2002 | WO2002003045A2 Probe, systems and methods for integrated circuit board testing |
| 01/10/2002 | WO2001036990A3 Wafer level interposer |
| 01/10/2002 | US20020004339 System level test socket |
| 01/10/2002 | US20020004320 Attaratus for socketably receiving interconnection elements of an electronic component |
| 01/10/2002 | US20020003434 Method for in-line testing of flip-chip semiconductor assemblies |
| 01/10/2002 | US20020003432 Semiconductor wafer test and burn-in |
| 01/10/2002 | US20020003431 Method and device for supporting flip chip circuitry in analysis |
| 01/10/2002 | US20020003429 Contamination-tolerant electrical test probe |
| 01/10/2002 | US20020003424 Test apparatus improved test connector |
| 01/10/2002 | US20020003100 Magazine for semiconductor device |
| 01/10/2002 | DE10125345A1 Planarization mechanism for test contact system, includes distance sensor which detects the gap between the contact substrate and a semiconductor wafer or a reference plate |
| 01/09/2002 | CN1330435A Connecting component and its assembling mechanism |
| 01/09/2002 | CN1330401A Integrated micro-contact pin and production method thereof |
| 01/08/2002 | US6337577 Interconnect and system for testing bumped semiconductor components with on-board multiplex circuitry for expanding tester resources |
| 01/08/2002 | US6337575 Methods of testing integrated circuitry, methods of forming tester substrates, and circuitry testing substrates |
| 01/08/2002 | US6337574 Method and apparatus for testing bumped die |
| 01/08/2002 | US6337572 Electric contact probe unit |
| 01/08/2002 | US6337571 Ultra-high-frequency current probe in surface-mount form factor |
| 01/08/2002 | US6337565 Electro-optic probe |
| 01/08/2002 | US6337218 Method to test devices on high performance ULSI wafers |
| 01/08/2002 | US6336269 Method of fabricating an interconnection element |
| 01/03/2002 | WO2002001232A1 Conductive contact |
| 01/03/2002 | WO2002000394A1 Vacuum chuck with integrated electrical testing points |
| 01/03/2002 | US20020002008 Kinematic coupling |
| 01/03/2002 | US20020001179 Standardized test board for testing custom chips |
| 01/03/2002 | US20020000829 Test insert containing vias for interfacing a device containing contact bumps with a test substrate |
| 01/03/2002 | US20020000821 Contact probe and fabrication method thereof |
| 01/03/2002 | US20020000820 Test probe and connector |
| 01/03/2002 | US20020000819 High resolution analytical probe station |
| 01/03/2002 | US20020000818 Circuit probing methods |
| 01/03/2002 | US20020000815 Methods and structures for electronic probing arrays |
| 01/03/2002 | US20020000048 Alignment device for electrically connecting a testing device to a sliding plate on a conveyer |
| 01/03/2002 | DE10101633A1 Optoelectronic oscilloscope probe head gives potential free measurement of electrical parameters. |
| 01/03/2002 | DE10101632A1 Oscilloscope probe head with fibre-optic sensor for galvanically separated detection of electric size |
| 01/03/2002 | DE10060585A1 Vorrichtung und Verfahren zur Untersuchung einer integrierten Halbleiterschaltung Apparatus and method for examining a semiconductor integrated circuit |
| 01/02/2002 | EP1165433A1 Method and apparatus for amplifying electrical test signals from a micromechanical device |
| 01/02/2002 | EP0664925B1 Interconnection structure for integrated circuits and method for making same |
| 01/02/2002 | CN1329753A Wafer prober |
| 01/02/2002 | CN1329749A A method and apparatus for transport and tracking of electronic component |
| 01/02/2002 | CN1329721A Photoetching contact elements |
| 01/01/2002 | US6335629 Test fixture having an opening for exposing the back of a semiconductor chip and testing module comprising the same |
| 01/01/2002 | US6335628 Wafer probe station for low-current measurements |
| 01/01/2002 | US6335226 Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers |
| 01/01/2002 | US6334247 High density integrated circuit apparatus, test probe and methods of use thereof |
| 01/01/2002 | CA2249040C Clamping mechanism for mounting circuit condition monitoring devices on cables of various diameters |
| 12/27/2001 | WO2001099232A2 Electrically shielded connector |
| 12/27/2001 | WO2001099189A1 Method and apparatus for edge connection between elements of an integrated circuit |
| 12/27/2001 | WO2001098793A2 Systems for testing integraged circuits during burn-in |
| 12/27/2001 | US20010055905 TAB, probe card, TAB handler and method for measuring IC chip |
| 12/27/2001 | US20010055900 Contact pin |
| 12/27/2001 | US20010054907 High density cantilevered probe for electronic devices |
| 12/27/2001 | US20010054906 Probe card and a method of manufacturing the same |
| 12/27/2001 | US20010054905 Probe card assembly and kit |
| 12/27/2001 | US20010054710 System and method for inspecting semiconductor device |
| 12/27/2001 | US20010054510 Integrated microcontact pin and method for manufacturing the same |
| 12/26/2001 | CN1328644A Probe card for probing wafers with raised contact elements |
| 12/25/2001 | US6333635 Probe card for testing an integrated circuit chip |
| 12/25/2001 | US6332270 Method of making high density integral test probe |
| 12/20/2001 | WO2001096894A1 Compliant probe apparatus |
| 12/20/2001 | WO2001096891A1 Device and method for inspecting circuit board |
| 12/20/2001 | WO2001096885A1 Connector apparatus |
| 12/20/2001 | WO2001096883A2 Microcontactor probe and electric probe unit |
| 12/20/2001 | US20010053628 Socket for electrical parts |
| 12/20/2001 | US20010053620 Method and apparatus for interconnecting devices using an adhesive |
| 12/20/2001 | US20010053567 Method of forming a test insert for interfacing a device containing contact bumps with a test substrate |
| 12/20/2001 | US20010053565 Method and apparatus for edge connection between elements of an integrated circuit |
| 12/20/2001 | US20010052786 Special contact points for accessing internal circuitry of an integrated circuit |
| 12/20/2001 | US20010052785 Test carrier for testing semiconductor components including interconnect with support members for preventing component flexure |
| 12/20/2001 | US20010052782 BGA on-board tester |
| 12/20/2001 | US20010052780 Integrated circuit leadframes patterned for measuring the accurate amplitude of changing currents |
| 12/20/2001 | US20010052422 Structure for supporting connecting member |
| 12/20/2001 | US20010052180 Socket test probe and method of making |
| 12/20/2001 | DE10129282A1 Integrated circuit modules connection method involves connecting interlocking edge, by aligning teeth and recesses of edge of integrated circuit with adjacent edge |
| 12/19/2001 | EP1164379A1 Voltage tester for electric socket and housing for the same |