Patents
Patents for G01R 1 - Details of instruments or arrangements of the types covered by groups  or (27,269)
12/2002
12/31/2002US6501343 Integrated circuit tester with high bandwidth probe assembly
12/31/2002US6501291 Testing base for semiconductor devices
12/27/2002WO2002103852A2 Method and apparatus for non-destructive testing of leaded packages
12/27/2002WO2002103848A2 Apparatus and methods to pre-stress anisotropic conductive elastomer meterials
12/27/2002WO2002103775A1 Probe contact system having plane adjusting mechanism
12/27/2002WO2002103373A1 Conductive contactor and electric probe unit
12/27/2002WO2002103372A1 Socket for semiconductor package
12/26/2002US20020197895 Electrical contractor, especially wafer level contactor, using fluid pressure
12/26/2002US20020197891 Socket for electrical parts
12/26/2002US20020196047 Method and system having switching network for testing semiconductor components on a substrate
12/26/2002US20020196046 Method and apparatus for wafer scale testing
12/26/2002US20020196043 Apparatus and method for testing semiconductor devices
12/26/2002US20020196041 Method and apparatus for testing bumped die
12/26/2002US20020196040 Device carrier and autohandler
12/26/2002US20020196039 Socket for testing a semiconductor package device
12/26/2002US20020196038 Press contact structure of probe unit
12/26/2002US20020196037 Method and apparatus to prevent damage to probe card
12/26/2002US20020196031 Parallel insulation fault detection system
12/26/2002US20020195614 Ball grid array chip packages having improved testing and stacking characteristics
12/26/2002US20020195265 High density planar electrical interface
12/26/2002US20020195122 Test carrier for temporarily packaging bumped semiconductor components in which contact balls on the components are protected during test procedures; made of wear resistant material
12/24/2002US6498998 Method and apparatus for testing a semiconductor device
12/24/2002US6498506 Spring probe assemblies
12/24/2002US6498505 Jigs for semiconductor components
12/24/2002US6498504 Wafer inspection device and wafer inspection method
12/24/2002CA2141128C Method and apparatus for sensing an input current with a bridge circuit
12/19/2002WO2002101830A2 Electronic components with plurality of contoured microelectronic spring contacts
12/19/2002US20020192987 Semiconductor device-socket
12/19/2002US20020192986 Probe card for tester head
12/19/2002US20020192939 Method of manufacturing a contract element and a multi-layered wiring substrate, and wafer batch contact board
12/19/2002US20020191406 Anisotropic conductive sheet, production process, contact structure, electronic device and inspection apparatus for operation test
12/19/2002US20020190759 Electrochemically accelerated self-assembly of molecular devices
12/19/2002US20020190743 Method of testing semiconductor integrated circuits and testing board for use therein
12/19/2002US20020190741 Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactor
12/19/2002US20020190740 Probe apparatus applicable to a wafer level burn-in screening
12/19/2002US20020190739 CSP BGA test socket with insert and method
12/19/2002US20020190738 Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
12/19/2002US20020190737 Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus
12/19/2002US20020190736 Substrate Testing apparatus and substrate testing method
12/19/2002US20020190706 Semiconductor device testing apparatus having timing hold function
12/19/2002US20020189648 Method and apparatus for cleaning electrical probes
12/19/2002US20020189364 Method and apparatus for non-destructive testing of leaded packages
12/19/2002DE10223502A1 Sockel für ein IC-Gehäuse Socket for an IC package
12/18/2002EP1266234A1 Testing device for printed boards
12/18/2002EP1266230A2 Method and apparatus for planarizing a semiconductor contactor
12/18/2002CN1386198A Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card
12/18/2002CN1386197A Conductive contact
12/18/2002CN1385888A Measurement, check, manufacturing method and check device for semiconductor device
12/18/2002CN1385709A Multiple virtual logic tester supported semiconductor test system
12/17/2002US6496261 Double-pulsed optical interferometer for waveform probing of integrated circuits
12/17/2002US6496026 Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground
12/17/2002US6496024 Probe holder for testing of a test device
12/17/2002US6496023 Semiconductor-device inspecting apparatus and a method for manufacturing the same
12/17/2002US6496014 Cable tester error compensation method and apparatus
12/17/2002US6496001 System and method for probe mechanism planarization
12/17/2002US6495856 Semiconductor device having a test pattern same as conductive pattern to be tested and method for testing semiconductor device for short-circuit
12/17/2002US6495379 Semiconductor device manufacturing method
12/17/2002US6494370 Electro-optic system controller and method of operation
12/12/2002WO2002099930A1 Socket connector and contact for use in a socket connector
12/12/2002US20020186189 Method and apparatus for predicting DC offset potential in a liquid crystal display (LCD) device
12/12/2002US20020186030 Contact probe and probe device
12/12/2002US20020186029 Circuit board test fixture with electrostatic discharge (ESD) protection
12/12/2002US20020186022 Method, system, and recording medium of testing a 1394 interface card
12/12/2002US20020186003 Semiconductor device testing apparatus having timing hold function
12/12/2002US20020186002 Method and apparatus of interconnecting with a system board
12/12/2002US20020185301 Method and apparatus for testing bumped die
12/12/2002DE10122036A1 Substrathaltevorrichtung für Prober zum Testen von Schaltungsanordnungen auf scheibenförmigen Substraten Substrate holder for Prober for testing circuits on disc substrates
12/11/2002EP1264187A2 Integrated circuit test socket lid assembly
12/11/2002CN2525531Y Chip test foot seat using surface adhesive technology
12/11/2002CN2525523Y Integrated circuit test socket with spring probe
12/11/2002CN2525522Y Electronic probe
12/11/2002CN2525521Y Factor regulator of industive electric power meter
12/11/2002CN1384922A Wafer-level burn-in and test cartridge and methods
12/11/2002CN1384921A Test probe for device for testing printed circuit boards
12/10/2002US6492829 Contactor for inspection
12/10/2002US6492827 Non-invasive electrical measurement of semiconductor wafers
12/10/2002US6492825 Socket and printed circuit board for semiconductor device, and method of testing semiconductor device
12/10/2002US6492824 Adapter base for receiving electronic test objects
12/10/2002US6492823 Customizable nest providing for adjustable audio isolation for testing wireless devices
12/10/2002US6492822 Wafer probe station for low-current measurements
12/10/2002US6492800 Electro-optic voltage sensor with beam splitting
12/10/2002US6492738 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
12/10/2002US6492599 Multilayer wiring board, manufacturing method thereof, and wafer block contact board
12/10/2002US6491968 Methods for making spring interconnect structures
12/05/2002WO2002097453A1 Probe card, probe, probe manufacturing method, and probe card manufacturing method
12/05/2002WO2002097452A1 Method for manufacture of probe pin, and method for manufacture of probe card
12/05/2002WO2002097451A1 14/42-volt automotive circuit tester
12/05/2002WO2002070789A3 Electrical potential-assisted assembly of molecular devices
12/05/2002WO2002050556A3 High-frequency probe-tip
12/05/2002US20020182919 Socket for electrical parts
12/05/2002US20020182916 IC socket
12/05/2002US20020182915 Socket for electrical parts
12/05/2002US20020182796 Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
12/05/2002US20020180478 Device power supply and IC test apparatus
12/05/2002US20020180473 Single-sided compliant probe apparatus
12/05/2002US20020180471 Signal launch connecting techniques
12/05/2002US20020180469 Reusable test jig
12/05/2002US20020180454 Inspection unit and method of manufacturing substrate
12/05/2002US20020180422 Method and apparatus of interconnecting with a system board
12/05/2002US20020179904 Contact structure production method