Patents
Patents for G01R 1 - Details of instruments or arrangements of the types covered by groups  or (27,269)
04/2003
04/03/2003WO2003027694A2 Method and apparatus for in-circuit testing of sockets
04/03/2003WO2003027689A1 Electrical test probes and methods of making the same
04/03/2003WO2003027687A1 Tester and testing method
04/03/2003WO2003027686A2 Method and apparatus for temperature control of a device during testing
04/03/2003WO2002073220A3 Method and apparatus for retaining a spring probe
04/03/2003US20030065904 Programmable array for efficient computation of convolutions in digital signal processing
04/03/2003US20030062927 Programmable delay indexed data path register file for array processing
04/03/2003US20030062915 Probe card with contact apparatus and method of manufacture
04/03/2003US20030062914 Surface mating compliant contact assembly with fixed signal path length
04/03/2003US20030062886 Current sensor assembly
04/03/2003US20030062398 Method for manufacturing raised electrical contact pattern of controlled geometry
04/02/2003EP1297346A2 Device for measuring an electric current that flows through a strip conductor
04/02/2003EP0746772B1 Reusable die carrier for burn-in and burn-in process
04/02/2003CN1407612A 探测器装置 Detector device
04/02/2003CN1104647C Method for testing electronic devices attached to leadframe
04/01/2003US6541991 Interface apparatus and method for testing different sized ball grid array integrated circuits
04/01/2003US6541990 Systems for testing integrated circuits
04/01/2003US6541989 Testing device for semiconductor components and a method of using the device
04/01/2003US6541988 Circuit board test fixture with electrostatic discharge (ESD) protection
04/01/2003US6541956 Carrier identification system, carrier identification method and storage media
04/01/2003US6541955 Clamp for measuring an electrical current flowing in conductors
04/01/2003US6541365 Insulating interposer between two electronic components and process thereof
04/01/2003US6541289 Semiconductor-package measuring method, measuring socket, and semiconductor package
04/01/2003US6540565 Coupling or plug for a connector for use in metrology, specifically in environmental metrology
04/01/2003US6540537 IC socket with two point-contacts
04/01/2003US6540524 Contact structure and production method thereof
03/2003
03/27/2003WO2003025601A1 Method and system for designing a probe card
03/27/2003WO2003025589A1 Contact structure, method of manufacturing the structure, and contact assembly using the structure
03/27/2003WO2003025588A1 Contact structure, method of manufacturing the structure, and contact assembly using the structure
03/27/2003US20030060131 Method of cleaning a probe card
03/27/2003US20030060092 Systems and methods for measuring properties of conductive layers
03/27/2003US20030060064 Spiral contactor and manufacturing method for this apparatus, and a semiconductor inspecting equipment and electronical parts using this apparatus
03/27/2003US20030057985 Test socket and methods
03/27/2003US20030057983 Integrated circuit chip test adapter
03/27/2003US20030057981 Method and apparatus for in-circuit testing of sockets
03/27/2003US20030057980 Socket apparatus particularly adapted for lga type semiconductor devices
03/27/2003US20030057979 Wafer probe station for low-current measurements
03/27/2003US20030057978 Substrate for a probe card having conductive layers for supplying power to IC devices
03/27/2003US20030057976 Probe card
03/27/2003US20030057975 Segmented contactor
03/27/2003US20030057971 Inspection method using a charged particle beam and inspection device based thereon
03/27/2003US20030057957 Method for chemically etching photo-defined micro electrical contacts
03/27/2003US20030057956 Portable diagnostic device
03/27/2003US20030057770 Battery sensor device
03/26/2003EP1296145A1 Conductive contact
03/26/2003EP1295137A1 Automated protection of ic devices from eos (electro over stress) damage due to an undesired dc transient
03/26/2003EP0792519B1 Interconnection elements for microelectronic components
03/26/2003CN1405890A Nonvolatile semiconductor memory device and its imperfect repairing method
03/26/2003CN1405873A Electronic device measuring device and method
03/25/2003US6538463 Semiconductor die and retaining fixture
03/25/2003US6538460 Method and apparatus for enhancing a system board
03/25/2003US6538424 Notched electrical test probe tip
03/25/2003US6538421 Apparatus with separated conductors
03/25/2003US6538214 Method for manufacturing raised electrical contact pattern of controlled geometry
03/25/2003US6537842 Methods for fabricating protective structures for bond wires
03/25/2003US6537093 Socket for a semiconductor device
03/20/2003WO2003023902A1 Integrated circuit device socket
03/20/2003WO2003023427A2 Method of assembling and testing an electronics module
03/20/2003US20030055736 Method and system for designing a probe card
03/20/2003US20030054676 Burn-in test socket
03/20/2003US20030054675 Socket for removably mounting electronic packages
03/20/2003US20030054587 Method for manufacturing flip-chip semiconductor assembly
03/20/2003US20030052703 Probe unit and its manufacture
03/20/2003US20030052693 Analyzer sensor
03/19/2003EP1293016A2 Electrically shielded connector
03/19/2003EP1292834A2 Systems for testing integrated circuits during burn-in
03/19/2003EP1292429A1 Vacuum chuck with integrated electrical testing points
03/19/2003CN1403828A Measurer of high-speed memory bus
03/19/2003CN1403824A Check terminal for testing electronic chip element, checking method and verifying attachment thereof
03/19/2003CN1103452C Test section for integrated circuit processor
03/18/2003US6535097 Transformer system provided with a decoupling system
03/18/2003US6535012 Universal wafer carrier for wafer level die burn-in
03/18/2003US6535010 Checker head and a method of manufacturing the same
03/18/2003US6535007 Component holder for testing devices and component holder system microlithography
03/18/2003US6535006 Test socket and system
03/18/2003US6535003 Contact structure having silicon finger contactor
03/18/2003US6535002 IC socket, a test method using the same and an IC socket mounting mechanism
03/18/2003US6534856 Sockets for “springed” semiconductor devices
03/18/2003US6534710 Packaging and interconnection of contact structure
03/13/2003WO2003021281A2 Semiconductor wafer positioning system and method
03/13/2003WO2003020467A1 Optical testing device
03/13/2003WO2000072339A8 Current sensor with two assembly positions
03/13/2003US20030049953 Integrated circuit device socket
03/13/2003US20030049951 Microelectronic contact structures, and methods of making same
03/13/2003US20030049873 Method of assembling and testing an electronics module
03/13/2003US20030048110 Wafer probe station having environment control enclosure
03/13/2003US20030048109 Test pin unit
03/13/2003US20030048108 Structural design and processes to control probe position accuracy in a wafer test probe assembly
03/12/2003EP1292045A2 Analyzer sensor
03/12/2003EP1290454A2 Microcontactor probe and electric probe unit
03/12/2003EP1290453A2 Measurement method and device, in particular for the high-frequency measurement of electric components
03/12/2003CN1103052C Probe card having vertical type needles
03/11/2003US6531876 Apparatus for voltage measurement
03/11/2003US6531774 Chip scale electrical test fixture with isolation plate having a recess
03/11/2003US6531769 Semiconductor integrated circuit package, semiconductor apparatus provided with a plurality of semiconductor integrated circuit packages, method of inspecting semiconductor integrated circuit package and method of fabricating semiconductor integrated circuit
03/11/2003US6531327 Method for manufacturing semiconductor device utilizing semiconductor testing equipment
03/11/2003US6530805 Contact pin holder assembly
03/11/2003US6530148 Method for making a probe apparatus for testing integrated circuits
03/06/2003WO2003019221A1 Magnetic resonance apparatus with excitation antennae system
03/06/2003WO2003019212A1 Insert and electronic component handler comprising it