Patents
Sitemap › G01 - Measuring; Testing › G01R - Measuring electric variables; Measuring magnetic variables › G01R 1 - Details of instruments or arrangements of the types covered by groups  or
Patents for G01R 1 - Details of instruments or arrangements of the types covered by groups  or (27,269)
08/2003
08/06/2003EP1333493A2 Interconnect structure
08/06/2003EP1332375A1 Method for making a block for testing components
08/06/2003EP0898712B1 Wafer-level burn-in and test
08/05/2003US6603891 Oscilloscope probe with fiber optic sensor for measuring floating electrical signals
08/05/2003US6603325 Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactor
08/05/2003US6603324 Special contact points for accessing internal circuitry of an integrated circuit
08/05/2003US6603323 Closed-grid bus architecture for wafer interconnect structure
08/05/2003US6603322 Probe card for high speed testing
08/05/2003US6603297 Probe tip adapter for a measurement probe
07/2003
07/31/2003WO2003062841A1 Vertical probe card and method for using the same
07/31/2003WO2003062837A1 Probe card and method for manufacturing probe card
07/31/2003WO2003062836A1 Probe with trapezoidal contactor and device based on application thereof, and method of producing them
07/31/2003WO2003062322A1 Apparatus and method for cleaning test probes
07/31/2003US20030143889 Electrical signal taking-out method and device therefor
07/31/2003US20030143877 Contact elements
07/31/2003US20030143764 Silicon carbide interconnect for semiconductor components and method of fabrication
07/31/2003US20030143762 Interconnect structure
07/31/2003US20030141889 Vertical probe card and method for using the same
07/31/2003US20030141888 Method for in-line testing of flip-chip semiconductor assemblies
07/31/2003US20030141886 Semiconductor test board for fine ball pitch ball grid array package
07/31/2003US20030141885 Interposer and methods for fabricating same
07/31/2003US20030141884 Contactor having conductive particles in a hole as a contact electrode
07/31/2003US20030141883 Multiple contact vertical probe solution enabling kelvin connection benefits for conductive bump probing
07/31/2003US20030141861 Probe station
07/31/2003DE19549647C2 High-density packaging multi-chip semiconductor module
07/30/2003EP1330659A1 Methods and devices for dissolving hyperpolarised solid material for nmr analyses
07/30/2003EP1330333A1 Method of retrofitting a probe station
07/30/2003EP1330182A1 Methods and devices for polarised nmr samples
07/30/2003CN2563578Y Density plate structure
07/30/2003CN2563577Y New meter pen of multimeter
07/30/2003CN1433059A Semiconductor device test system
07/30/2003CN1116709C Assembling device for semiconductor components
07/30/2003CN1116613C Method and apparatus for probing, testing, burning, repairing and programming of integrated circuits in closed environment using single apparatus
07/29/2003US6600335 Method for ball grid array chip packages having improved testing and stacking characteristics
07/29/2003US6600330 Probe head holder
07/29/2003US6600202 Compact sensing apparatus having reduced cross section and methods of mounting same
07/29/2003US6599832 Silicide pattern structures and methods of fabricating the same
07/29/2003US6599822 Methods of fabricating semiconductor substrate-based BGA interconnection
07/29/2003US6599776 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
07/29/2003US6598290 Method of making a spring element for use in an apparatus for attaching to a semiconductor
07/29/2003CA2217591C Wireless test fixture
07/24/2003WO2003060530A1 Probe for electrical measurement methods and use of a flexible probe for production of a rigid probe
07/24/2003WO2003060529A1 Test probe system and method for the production thereof
07/24/2003WO2003021281A3 Semiconductor wafer positioning system and method
07/24/2003WO2002103852A3 Method and apparatus for non-destructive testing of leaded packages
07/24/2003US20030138980 Method of temporarily securing a die to a burn-in carrier
07/24/2003US20030138808 Polypeptides wherein epitopes correspond to proteosome cleavage product of tyrosinase and major histocompatability complex; vaccine
07/24/2003US20030138644 Apparatus and method for cleaning test probes
07/24/2003US20030137317 Test systems for semiconductor devices
07/24/2003US20030137316 Microcontactor probe and electric probe unit
07/24/2003US20030137315 Testing integrated circuits
07/24/2003US20030137310 Remote viewing screen for test instrument
07/24/2003US20030136813 Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same
07/23/2003EP1329730A1 Eddy current probe on a flexible substrat
07/23/2003EP1018023A4 Probe card and system for testing wafers
07/23/2003CN1431693A Wafer class probe card and its mfg. method
07/23/2003CN1431518A Contactor for detecting small device and parts
07/22/2003US6597192 Test method of semiconductor device
07/22/2003US6597190 Method and apparatus for testing electronic devices
07/22/2003US6597189 Socketless/boardless test interposer card
07/22/2003US6597187 Special contact points for accessing internal circuitry of an integrated circuit
07/22/2003US6595794 Electrical contact method and apparatus in semiconductor device inspection equipment
07/17/2003WO2003058768A1 Socket for inspection
07/17/2003WO2003058264A1 Cooling assembly with direct cooling of active electronic components
07/17/2003WO2003058262A1 Insert for electronic component handler, tray and electronic component handler
07/17/2003WO2003058260A1 Electrical feedback detection system for multi-point probes
07/17/2003WO2001048471A3 Electro-optic system controller and method of operation
07/17/2003US20030134526 Chip test device used for testing a chip packaged by ball grid array (BGA) technology
07/17/2003US20030132776 Method for in-line testing of flip-chip semiconductor assemblies
07/17/2003US20030132773 Apparatus and method for testing high current circuit assemblies
07/17/2003US20030132771 IC socket and spring means of IC socket
07/17/2003US20030132770 Hinged heat sink burn-in socket
07/17/2003US20030132769 Probe card for high speed testing
07/17/2003US20030132768 Apparatus and methods for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer
07/17/2003US20030132767 Membrane probing system
07/17/2003US20030132759 Low loss integration of wafer probes with microwave tuners
07/17/2003US20030132744 Probe head holder
07/17/2003US20030132743 Modular test adapter for rapid action engagement interface
07/17/2003US20030132027 Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor
07/16/2003EP1327889A2 A probe head holder
07/16/2003CN1430256A Device and method for identifying working position of device conveying system in semiconductor device testing treatment machine
07/16/2003CN1430065A Detector and detection head of multi-channel, low input capacitance signal
07/15/2003US6593764 Test socket and methods
07/15/2003US6593763 Module test socket for test adapters
07/15/2003US6593762 Apparatus for testing electronic components
07/15/2003US6593753 System and method for monitoring substances and reactions
07/10/2003WO2003056623A1 Method and apparatus for inspecting and packing chips
07/10/2003WO2003056577A2 Roller contact with conductive brushes
07/10/2003WO2003056346A1 Contact probe
07/10/2003WO2002013261A3 Heat spreading die cover
07/10/2003US20030129861 Contact base with detachable contacts for making electrical contact with an electronic component, in particular a multipin electronic component, and module carrier
07/10/2003US20030128044 Method for producing a wafer interposer for use in a wafer interposer assembly
07/10/2003US20030128042 Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer
07/10/2003US20030128041 Apparatus to prevent damage to probe card
07/10/2003US20030128040 Contactor assembly for common grid array devices
07/10/2003US20030128024 Apparatus for recognizing working position of device transfer system in semiconductor device test handler and method thereof
07/10/2003US20030128023 Deskew fixture
07/10/2003US20030127246 Contactor for testing miniaturized devices and components
07/10/2003US20030126735 Probe for a wire inserting detection jig
07/09/2003EP1326079A2 Probe card
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