Patents
Patents for G01R 1 - Details of instruments or arrangements of the types covered by groups  or (27,269)
03/2004
03/25/2004US20040058470 Methods of forming a contact array in situ on a substrate and resulting substrate assemblies
03/25/2004US20040056689 Method and structure for integrated circuit interference isolation enhancement
03/25/2004US20040056676 Probe title for probing semiconductor wafer
03/25/2004US20040056674 Multi-point probe
03/25/2004US20040056673 Test method for semiconductor components using conductive polymer contact system
03/25/2004US20040056672 High resolution analytical probe station
03/25/2004DE10337033A1 Anschlussleitungsloser Sockel für ein aufgedecktes Halbleiterbauelement Connection cable-free base for a face-up semiconductor component
03/25/2004DE10320132A1 Verbinderkabel und Verfahren zum Sondieren von vakuumabdichtbaren elektronischen Knoten einer elektrischen Testvorrichtung Connector cable and method for probing vakuumabdichtbaren electronic nodes of an electrical tester
03/24/2004EP1400811A1 Support body assembly for conductive contactor
03/24/2004EP1399746A1 Image sensor utilizing a low fpn high gain capacitive transimpedance amplifier
03/24/2004CN2607579Y Trolley elecric meter for indicating eye-catching
03/24/2004CN1484768A Method and devices for dissolving hyperpolarised solid material for nmr analyses
03/24/2004CN1484033A Detection card and preparation, method thereof
03/24/2004CN1143334C Active earth fault turn-off electric detector
03/24/2004CN1143136C Test head for microstructures with interface
03/23/2004US6711057 Nonvolatile semiconductor memory device and method of retrieving faulty in the same
03/23/2004US6710798 Methods and apparatus for determining the relative positions of probe tips on a printed circuit board probe card
03/23/2004US6710615 Semiconductor element test apparatus, and method of testing semiconductor element using the apparatus
03/23/2004US6710612 CSP BGA test socket with insert and method
03/23/2004US6710610 Socket for testing of semiconductor device, and semiconductor device and method of manufacturing the semiconductor device
03/23/2004US6710609 Mosaic decal probe
03/23/2004US6710608 Contact probe and probe device
03/23/2004US6710369 Liquid metal socket system and method
03/23/2004US6710256 Apparatus for connecting high-frequency circuit boards provided with connecting electrodes formed on bar-shaped member
03/23/2004US6709279 Contact pin module and testing device provided with the same
03/23/2004US6708403 Angled flying lead wire bonding process
03/23/2004US6708399 Method for fabricating a test interconnect for bumped semiconductor components
03/18/2004WO2004023548A1 Probing method and probe
03/18/2004WO2004023547A1 Probing method, probe, and mechanism for reducing/plasma etching electrode
03/18/2004WO2003065055A3 Magnetic field detection system for an electricity meter
03/18/2004US20040054491 Apparatus and method for testing socket
03/18/2004US20040051546 Temperature compensated vertical pin probing device
03/18/2004US20040051544 Die carrier
03/18/2004US20040051541 Contact structure with flexible cable and probe contact assembly using same
03/18/2004US20040051536 Coaxial radio frequency adapter and method
03/18/2004US20040051519 Method of and apparatus for controlling probe tip sanding in semiconductor device testing equipment
03/18/2004US20040050656 Belt conveyer with power conduction for electrical test
03/17/2004EP1218757B1 Method for making a probe card with multiple contact tips for testing integrated circuits with microsphere contacts
03/17/2004CN1142445C Battery tester
03/16/2004US6707311 Contact structure with flexible cable and probe contact assembly using same
03/16/2004US6707310 Needle load measuring method, needle load setting method and needle load detecting mechanism
03/16/2004US6707309 Semiconductor device-socket
03/16/2004US6705876 Electrical interconnect assemblies and methods
03/11/2004WO2004021019A1 High density probe device
03/11/2004WO2004021018A1 Anisotropic, conductive sheet and impedance measuring probe
03/11/2004WO2003040734A3 Method and system for compensating thermally induced motion of probe cards
03/11/2004US20040048502 Socket for electrical parts
03/11/2004US20040047116 Modular housing for use with test equipment
03/11/2004US20040046583 Modular socket of integrated circuit
03/11/2004US20040046582 Contacting component, method of producing the same, and test tool having the contacting component
03/11/2004US20040046581 Socket for testing a semiconductor device and a connecting sheet used for the same
03/11/2004US20040046580 Probe card, and testing apparatus having the same
03/11/2004US20040046579 High performance probe system
03/11/2004US20040046568 Re-locatable partial discharge transducer head
03/11/2004DE10240489A1 Tweezers for handling miniature surface mounted electronic devices have instrumentation to indicate gripping condition
03/10/2004EP1396050A2 Apparatus and methods to pre-stress anisotropic conductive elastomer meterials
03/10/2004EP1395842A2 Electrical component measuring instrument
03/10/2004EP1216419B1 Measuring probe for measuring high frequencies
03/09/2004US6704670 Systems and methods for wideband active probing of devices and circuits in operation
03/09/2004US6703855 Structure of a probe
03/09/2004US6703853 Test contact mechanism
03/09/2004US6703852 Low-temperature semiconductor device testing apparatus with purge box
03/09/2004US6703851 Test socket interposer
03/09/2004US6703640 Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching
03/09/2004US6702609 IC socket contact medium having uniform contact force
03/09/2004US6702589 Leadless socket for decapped semiconductor device
03/04/2004WO2004018666A1 Expression vectors encoding epitopes of target-associated antigens
03/04/2004US20040043653 High density probe device
03/04/2004US20040041581 Method of measuring contact resistance of probe and method of testing semiconductor device
03/04/2004US20040041556 Planarity diagnostic system, E.G., for microelectronic component test systems
03/04/2004US20040041168 Test insert with electrostatic discharge structures and associated methods
03/04/2004CA2494806A1 Expression vectors encoding epitopes of target-associated antigens
03/03/2004EP1393154A2 Measuring device with dialog control occurring via dialog windows and corresponding method
03/03/2004EP1099247B1 Method for transferring solder to a device and/or testing the device
03/03/2004CN1480016A Housing for receiving measuring device
03/03/2004CN1479873A Socket for electronic component test and electronic component test apparatus using the socket
03/03/2004CN1140806C Voltage measurement instrument having transient overvoltage input protection
03/03/2004CN1140805C Automatic tester for plug
03/02/2004US6700397 Triaxial probe assembly
03/02/2004US6700396 Integrated micromachine relay for automated test equipment applications
03/02/2004US6700122 Wafer inspection system and wafer inspection process using charged particle beam
02/2004
02/26/2004WO2004017695A1 Shock absorber means for components and cards
02/26/2004WO2004017081A1 Electronic circuit testing method and apparatus
02/26/2004US20040038575 Zero insertion force mount for fixing and making contact with circuit subassemblies on a substrate
02/26/2004US20040038560 Methods of fabricating and using shaped springs
02/26/2004US20040038511 Methods of fabricating silicide pattern structures
02/26/2004US20040036493 High performance probe system
02/26/2004US20040036492 Method for controlling the temperature of an electronic component under test
02/26/2004US20040036491 Probe card
02/26/2004US20040036490 Selectively configurable probe structures, e.g., for testing microelectronic components
02/26/2004US20040036465 Connector cable and method for probing vacuum-sealable electronic nodes of an electrical testing device
02/26/2004US20040035841 Method and process of contact to a heat softened solder ball array
02/26/2004US20040035706 Method for manufacturing probes of a probe card
02/26/2004US20040034996 Fabricating fence configured for placement on surface of interposer, including receptacle configured to receive semiconductor device to align conductive elements protruding therefrom with corresponding contact pads, consolidating
02/26/2004DE4012839B4 Verfahren und Prüfvorrichtung zum Prüfen von elektrischen oder elektronischen Prüflingen The method and test device for testing of electrical or electronic test specimens
02/26/2004DE10101632B4 Oszilloskoptastkopf mit faseroptischem Sensor zur potentialfreien Erfassung elektrischer Größen Oscilloscope probe with fiber optic sensor for detection of electric potential sizes
02/26/2004CA2490045A1 Shock absorber means for components and cards
02/25/2004EP1391738A2 Probe card
02/25/2004EP1391265A1 Contactor cleaning sheet, and contactor cleaning method
02/25/2004EP1390766A1 14/42-volt automotive circuit tester