| Patents for G01R 1 - Details of instruments or arrangements of the types covered by groups or (27,269) |
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| 05/27/2004 | US20040101666 Inspection contact sheet and method of fabricating the same |
| 05/27/2004 | US20040100300 Test probe for electrical devices having low or no wedge depression |
| 05/27/2004 | US20040100295 Air interface apparatus for use in high-frequency probe device |
| 05/27/2004 | US20040100292 Socketless/boardless test interposer card |
| 05/27/2004 | US20040099641 Probe array and method of its manufacture |
| 05/26/2004 | EP1422530A2 Inspection jig for radio frequency device, and contact probe incorporated in the jig |
| 05/26/2004 | CN1500213A Probe substrate and method of mfg. probe substrate |
| 05/26/2004 | CN1499209A Mechanism for fixing probe card |
| 05/26/2004 | CN1151009C Fabricating interconnects and tips using sacrificial substrates |
| 05/25/2004 | US6741091 Test method for electronic modules using contractors and conductive polymer contacts |
| 05/25/2004 | US6741090 Holding device for electronic part test, and device and method for electronic part test |
| 05/25/2004 | US6741089 Hinged heat sink burn-in socket |
| 05/25/2004 | US6741088 Semiconductor testing device having a nest with a detachable anvil |
| 05/25/2004 | US6741087 Voltage-applying probe, apparatus for manufacturing electron source using the probe, and method for manufacturing electron source using the apparatus |
| 05/25/2004 | US6741086 Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus |
| 05/25/2004 | US6741085 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 05/25/2004 | US6740984 Ball grid array chip packages having improved testing and stacking characteristics |
| 05/25/2004 | US6740983 Efficient burn in |
| 05/25/2004 | US6740578 Methods of fabricating semiconductor substrate-based BGA interconnections |
| 05/25/2004 | US6739894 Socket for IC package |
| 05/25/2004 | US6739202 Method and apparatus for non-destructive testing of leaded packages |
| 05/25/2004 | CA2192507C Molten metal inclusion sensor probes |
| 05/20/2004 | US20040097009 Method for packaging flip-chip semiconductor assemblies |
| 05/20/2004 | US20040096994 Method of assembling and testing an electronics module |
| 05/20/2004 | US20040096643 Cleaning sheet and method for a probe |
| 05/20/2004 | US20040095735 Spring element fixture |
| 05/20/2004 | US20040095158 Apparatuses configured to engage a conductive pad |
| 05/20/2004 | US20040095157 Inspection jig for radio frequency device, and contact probe incorporated in the jig |
| 05/20/2004 | US20040095156 Probe for combined signals |
| 05/19/2004 | EP0764352B1 Microelectronic contacts and assemblies |
| 05/19/2004 | DE10229117B4 Nullsteckkraft-Fassung zur Befestigung und Kontaktierung von Schaltbaugruppen auf einem Substrat Zero insertion force socket for mounting and contacting of switching modules on a substrate |
| 05/19/2004 | CN1497794A Contact pointed structure of sharp and orientation |
| 05/19/2004 | CN1150605C Probe card for testing integrated circuit chip |
| 05/18/2004 | US6737882 Method for universal wafer carrier for wafer level die burn-in |
| 05/18/2004 | US6737879 Method and apparatus for wafer scale testing |
| 05/18/2004 | US6737878 Probe applied to semiconductor package test and method for testing semiconductor package |
| 05/18/2004 | US6737873 Electronic part inspection device |
| 05/18/2004 | US6736665 Contact structure production method |
| 05/18/2004 | US6736361 Semiconductor wafer positioning system and method |
| 05/18/2004 | US6735855 Methods for electrical connector |
| 05/13/2004 | WO2004040321A1 Probe card |
| 05/13/2004 | US20040090238 Probe for combined signals |
| 05/13/2004 | US20040090223 Mechanism for fixing probe card |
| 05/13/2004 | US20040088855 Substrate having a coefficient of thermal expansion the same as that of the semiconductor of the chip-scale package and including apertures formed at locations corresponding to bond pads of the semiconductor device |
| 05/13/2004 | DE202004003164U1 Messgerät Gauge |
| 05/13/2004 | DE19844428B4 Prüfsonde für einen Fingertester, ein Verfahren zum Ansteuern einer Prüfsonde, Fingertester zum Prüfen von Leiterplatten und ein Verfahren zum Prüfen von Leiterplatten mit einem Fingertester Test probe for a finger tester, a method for driving a test probe, finger tester for testing circuit boards and a method of testing of circuit boards with a finger tester |
| 05/13/2004 | DE10206756B4 Schalt-Federkontaktstift Switching spring pin |
| 05/12/2004 | EP1418436A2 Electrical contactor, especially wafer level contactor, using fluid pressure |
| 05/12/2004 | EP1123512B1 High density printed circuit board |
| 05/12/2004 | EP0792463B1 Mounting spring elements on semiconductor devices |
| 05/12/2004 | CN1496597A Anisotropic conductive connector, its mfg. method and probe member |
| 05/12/2004 | CN1496482A 接触探头 Contact probe |
| 05/12/2004 | CN1495870A Composite intermediate connection element of microelectronic component and its making method |
| 05/11/2004 | US6734698 Radio frequency oscillation detector |
| 05/11/2004 | US6734692 Inspection apparatus and sensor |
| 05/11/2004 | US6734691 Substrate for a probe card having conductive layers for supplying power to IC devices |
| 05/11/2004 | US6734690 Back pressure test fixture to allow probing of integrated circuit package signals |
| 05/11/2004 | US6734689 Measurement probe providing signal control for an EOS/ESD protection module |
| 05/11/2004 | US6734688 Low compliance tester interface |
| 05/11/2004 | US6734683 Method and apparatus for in-circuit testing of sockets |
| 05/06/2004 | WO2004038433A1 Sheet-form connector and production method and application therefor |
| 05/06/2004 | WO2004008492A3 Mosaic decal probe |
| 05/06/2004 | US20040087046 Method for testing chips on flat solder bumps |
| 05/06/2004 | US20040085081 High density, high frequency, board edge probe |
| 05/06/2004 | US20040085060 Method and apparatus for testing BGA-type semiconductor devices |
| 05/06/2004 | US20040083568 Device for cleaning tip and side surfaces of a probe |
| 05/06/2004 | EP1416285A2 Mechanism for fixing probe card |
| 05/05/2004 | CN1494659A Universal test interface between device undr test and test head |
| 05/05/2004 | CN1148581C Connector apparatus for microelectronic apparatus and its probe device |
| 05/04/2004 | US6731123 Probe device |
| 05/04/2004 | US6731104 Measurement probe system with EOS/ESD protection |
| 05/04/2004 | US6729027 Method of forming recessed socket contacts |
| 05/04/2004 | US6729019 Method of manufacturing a probe card |
| 04/29/2004 | WO2004036641A1 Probe device that controls temperature of object to be inspected and probe inspection method |
| 04/29/2004 | WO2004036232A1 Electric connector |
| 04/29/2004 | US20040083073 Probe testing method and apparatus for determining acceptable/defective end shape of contact probe through image analysis |
| 04/29/2004 | US20040081234 Electronic device including image forming apparatus |
| 04/29/2004 | US20040080332 Connecting projections; fixing substrates using epoxy resins; in situ electrical testing |
| 04/29/2004 | US20040080328 Methods and structures for electronic probing arrays |
| 04/29/2004 | DE202004002099U1 Test pin for electrical or electronic components, has test head and contact pin that make connection at several contact points, and flexible contact elements, e.g. wire springs, lamellas or similar in bush |
| 04/29/2004 | DE10296944T5 Prüfkontaktsystem, das eine Planaritätseinstellmechanismus besitzt Prüfkontaktsystem having a Planaritätseinstellmechanismus |
| 04/28/2004 | EP1414118A1 Contact for spiral contactor and spiral contactor |
| 04/28/2004 | CN2613761Y Casing for current and voltage meter |
| 04/27/2004 | US6727720 Probe having a microstylet |
| 04/27/2004 | US6727717 Integrated circuit chip test adapter |
| 04/27/2004 | US6727716 Probe card and probe needle for high frequency testing |
| 04/27/2004 | US6727715 Test system and test contactor for electronic modules having beam spring contacts |
| 04/27/2004 | US6727714 Probe card |
| 04/27/2004 | US6727579 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 04/27/2004 | US6725536 Methods for the fabrication of electrical connectors |
| 04/22/2004 | WO2004034068A2 Contact structure and production method thereof and probe contact assembly using same |
| 04/22/2004 | WO2003065055B1 Magnetic field detection system for an electricity meter |
| 04/22/2004 | US20040077200 Electronic component testing socket and electronic component testing apparatus using the same |
| 04/22/2004 | US20040075455 Mosaic decal probe |
| 04/22/2004 | US20040075454 Contact probe, method of manufacturing the contact probe, and device and method for inspection |
| 04/22/2004 | US20040075091 Semiconductor package device testing apparatus |
| 04/22/2004 | US20040074288 Method of manufacturing the multi-tip probe, a multi-tip probe, and surface characteristic analysis apparatus |
| 04/22/2004 | DE10196368T5 Kontaktstruktur und Verfahren zu dessen Herstellung und eine Prüfkontaktanordnung, die diese verwendet Contact structure and method for its preparation and a test contact, which uses this |
| 04/21/2004 | EP1411363A2 Prober |
| 04/21/2004 | EP1411360A2 Method and probe card for testing semiconductor system |