| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 10/18/2001 | WO2001077420A1 Laser hole drilling copper foil |
| 10/18/2001 | WO2001077416A2 Thin copper foil, and process and apparatus for the manufacture thereof |
| 10/18/2001 | US20010030101 Modular semiconductor workpiece processing tool |
| 10/17/2001 | EP1100638A4 Casting steel strip |
| 10/17/2001 | CN1317825A Electroplating appts. |
| 10/16/2001 | US6303401 Method for producing a metal layer with a given thickness |
| 10/16/2001 | US6303014 Electrodeposition of metals in small recesses using modulated electric fields |
| 10/16/2001 | US6303010 Methods and apparatus for processing the surface of a microelectronic workpiece |
| 10/16/2001 | US6301784 Method of fabricating plain bearings |
| 10/11/2001 | US20010029099 Thick copper layer is deposited by disproportionation caused by water which is added to the stabilized cuprous ion solution, hydration energy of cupric ions increased causing cuprous ion disproportionate into cupric and solid copper |
| 10/11/2001 | DE10113767A1 Elektrolytisches Plattierungsverfahren und Vorrichtung für eine Leiterbahnplatine Electrolytic plating method and apparatus for a printed wiring board |
| 10/10/2001 | EP1143029A1 Method for manufacturing a body featuring very high mechanical properties, forming by drawing from a rolled steel sheet, in particular hot rolled and coated sheet |
| 10/10/2001 | EP1142456A1 Process for depositing conducting layer on substrate |
| 10/10/2001 | EP1142041A1 Battery sheath made of a formed cold-rolled sheet and method for producing battery sheaths |
| 10/10/2001 | EP1141436A1 Steel wire with bright looking surface |
| 10/09/2001 | US6299932 Lead frame processing method and apparatus |
| 10/09/2001 | US6299753 A fluid delivery system with particular application to electroplating. |
| 10/09/2001 | US6299751 Apparatus and method for plating wafers, substrates and other articles |
| 10/04/2001 | US20010027035 Electrical connector |
| 10/04/2001 | US20010027013 Method for forming conductor members, manufacturing method of semiconductor element and manufacturing method of thin-film magnetic head |
| 10/04/2001 | US20010026877 Used in gas turbines blades, jet engines, boilers; durability |
| 10/04/2001 | US20010025962 Field emmision type cold cathode device, manufacturing method thereof and vacuum micro device |
| 10/04/2001 | EP1138807A2 Perforated anode for uniform deposition of a metal layer |
| 10/04/2001 | EP1138806A2 Electroplating apparatus having a non-dissolvable anode |
| 10/03/2001 | CN1316023A Method and apparatus for copper plating using electroless plating and electroplating |
| 10/03/2001 | CN1315894A Structure and method for jointing metal members |
| 10/03/2001 | CN1315591A Forming method of plating chrome on copper layer of printed circuit board |
| 10/03/2001 | CN1072280C Method for preventing cooling pipe of carbon-steel cooler from corrosion by sea water and apparatus thereof |
| 10/03/2001 | CN1072047C Element of continuous metal casting ingot mould with copper or copper alloy cooled wall comprising on its external surface metal coating, and method of coating |
| 10/02/2001 | US6297157 Time ramped method for plating of high aspect ratio semiconductor vias and channels |
| 10/02/2001 | US6297155 Method for forming a copper layer over a semiconductor wafer |
| 10/02/2001 | US6297154 Process for semiconductor device fabrication having copper interconnects |
| 10/02/2001 | US6297140 Method to plate C4 to copper stud |
| 10/02/2001 | US6296753 Immersing in plating bath in contact with adjustable anode; bending to change electrostatic field |
| 09/27/2001 | WO2001072096A1 Treatment of circuit supports with impulse excitation |
| 09/27/2001 | WO2001071780A2 Apparatus and method for electrochemically processing a microelectronic workpiece |
| 09/27/2001 | WO2001071066A1 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
| 09/27/2001 | US20010024691 Semiconductor substrate processing apparatus and method |
| 09/27/2001 | US20010023830 Electrolytic plating method and device for a wiring board |
| 09/27/2001 | US20010023829 Method for anisotropic etching of structures in conducting materials |
| 09/27/2001 | US20010023821 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| 09/27/2001 | CA2397078A1 Treatment of circuit circuit carriers with pulse like excitation |
| 09/26/2001 | CN1314958A 接触元件 Contact element |
| 09/25/2001 | US6294425 Methods of forming integrated circuit capacitors by electroplating electrodes from seed layers |
| 09/25/2001 | US6294059 Substrate plating apparatus |
| 09/20/2001 | WO2001068952A1 Method and apparatus for electroplating |
| 09/20/2001 | WO2001068951A1 Electro-plating apparatus and a method of electro-plating |
| 09/20/2001 | WO2001068949A1 Electro-plating apparatus and method |
| 09/20/2001 | WO2001068942A1 Spring steel wire |
| 09/20/2001 | DE10013298A1 Applying metal layer to surfaces of light metals comprises electrolytically depositing iron from deposition bath containing iron (II) compounds formed during oxidation of iron (II) compounds at anodes |
| 09/20/2001 | CA2403122A1 Electro-plating apparatus and method |
| 09/20/2001 | CA2403116A1 Electro-plating apparatus and a method of electro-plating |
| 09/19/2001 | EP1133786A2 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 09/19/2001 | EP1133588A2 Stratified composite material for sliding elements and method for the production thereof |
| 09/18/2001 | US6291081 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof |
| 09/18/2001 | US6291080 Thin copper foil, and process and apparatus for the manufacture thereof |
| 09/18/2001 | US6290833 Providing electroplating bath including copper sulfate, ammonium sulfate, complexing agenta and ethylene glycol; exposing workpiece surface on which microelectronic devices are to be formed; applying electroplating power to deposit |
| 09/13/2001 | WO2001066831A1 Composite plating method |
| 09/13/2001 | WO2001066830A2 Method for applying a metal layer to a light metal surface |
| 09/13/2001 | WO2001031092A3 Method, chemistry, and apparatus for noble metal electroplating a on a microelectronic workpiece |
| 09/13/2001 | WO2001011098A3 Copper deposit process |
| 09/13/2001 | US20010020583 Reactor vessel having improved cup, anode and conductor assembly |
| 09/13/2001 | US20010020546 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 09/13/2001 | US20010020545 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 09/13/2001 | DE10009935A1 Anodic oxidation of metallic inner surfaces of hollow chamber comprises passing electrolyte through chamber, connecting surfaces to anode, and immersing electrode connected to cathode in electrolyte |
| 09/12/2001 | EP1133220A2 Copper foil with low profile bond enhancement |
| 09/12/2001 | EP1132502A2 Method and apparatus for supplying electricity uniformly to a workpiece |
| 09/12/2001 | EP1132500A2 Method for electrochemical deposition of metal using modulated waveforms |
| 09/12/2001 | EP1132499A2 Alloy coating, method for forming the same, and member for high temperature apparatuses |
| 09/12/2001 | EP1051543B1 Method for electroplating metal coating(s) on particulates at high coating speed with high current density |
| 09/12/2001 | CN1312670A Formation of metal interconnection structure |
| 09/11/2001 | US6288449 Integrated circuit device with aspect ratio of up to about 15:1 and a metal stack within made of layers of tantalum, tantalum nitride, titanium nitride and copper; at least one of the layers is formed by chemical vapor deposition |
| 09/11/2001 | US6287445 Coating particles in a centrifugal bed |
| 09/11/2001 | US6287444 Method for producing very small metal ball |
| 09/11/2001 | US6287443 Plating, drying using gases |
| 09/07/2001 | WO2001064974A1 Method for anodising the metallic inner surfaces of a capillar cavity |
| 09/07/2001 | WO2001064433A1 Carrier foil-pasted metal foil and production method thereof |
| 09/06/2001 | US20010019888 Metal deposit process |
| 09/06/2001 | US20010019780 Preventing wrinkling |
| 09/05/2001 | EP1129237A2 Method and apparatus for electrochemical mechanical deposition |
| 09/05/2001 | CN1311721A Casting steel strip |
| 09/04/2001 | US6284120 Method of electroplating and electrodeposit structure |
| 08/30/2001 | WO2001063019A1 Pad designs and structures with improved fluid distribution |
| 08/30/2001 | WO2001063018A1 Pad designs and structures for a versatile materials processing apparatus |
| 08/30/2001 | WO2001063016A1 Composite copper foil and manufacturing method thereof |
| 08/30/2001 | US20010018299 Electrical connector and method of preparing same for soldering |
| 08/30/2001 | US20010017258 Wafer plating apparatus |
| 08/30/2001 | US20010017105 Wafer plating apparatus |
| 08/28/2001 | US6280596 Electrolytic tinplating of steel substrate and apparatus |
| 08/28/2001 | US6280583 Reactor assembly and method of assembly |
| 08/28/2001 | US6280582 Reactor vessel having improved cup, anode and conductor assembly |
| 08/28/2001 | US6280581 Method and apparatus for electroplating films on semiconductor wafers |
| 08/28/2001 | US6279227 Method of forming a resilient contact structure |
| 08/23/2001 | WO2001061079A1 Process for electroplating a work piece coated with an electrically conducting polymer |
| 08/23/2001 | WO2001061078A1 Glass reinforcement structure |
| 08/23/2001 | US20010016267 Composite multilayer material for plain bearings |
| 08/23/2001 | US20010015652 Probe card assembly and kit, and methods of making same |
| 08/23/2001 | DE10007435A1 Verfahren zum Galvanisieren eines mit einem elektrisch leitenden Polymer beschichteten Werkstücks A method for electroplating a substrate coated with an electrically conductive polymer workpiece |
| 08/23/2001 | CA2369687A1 Process for electroplating a work piece coated with an electrically conducting polymer |
| 08/22/2001 | EP1126512A2 Wafer plating method and apparatus |