Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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03/04/2003 | US6527926 Electroplating reactor including back-side electrical contact apparatus |
03/04/2003 | US6527925 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
02/27/2003 | WO2003016182A1 Belt apparatus for carrying elements during treatment |
02/27/2003 | WO2003015870A2 Radioactive implantable devices and their production methods |
02/27/2003 | WO2002077327A3 Mask plate design |
02/27/2003 | US20030039745 Electristrical oxidation |
02/27/2003 | US20030038161 Method for manufacturing a multiple walled tube |
02/27/2003 | US20030038038 Using a no-contact process with electrochemical deposition, followed by a contact process with electrochemical mechanical deposition |
02/27/2003 | US20030038037 Electroplating apparatus and four mask TFT array process with electroplated metal |
02/27/2003 | US20030038036 Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewith |
02/27/2003 | US20030038035 Actively changing the first current distribution to produce a second current distribution different from the first in the electrolytic fluid while the microelectronic workpiece is in contact therewith |
02/27/2003 | US20030038033 Process for fabricating high aspect ratio embossing tool and microstructures |
02/26/2003 | EP1286576A2 Method for manufacturing copper-resin composite material |
02/26/2003 | EP1218569B1 Galvanizing solution for the galvanic deposition of copper |
02/25/2003 | US6524463 Transporting an article-mounted carrier into a process cell horizontally through an inlet opening, performing a process on said planar article and transporting said carrier horizontally out; automatic processing and plating system |
02/25/2003 | US6524462 Electroplating electroconductive regions with tool |
02/20/2003 | WO2003015483A1 Printed wiring board-use copper foil and copper clad laminated sheet using the printed wiring board-use copper foil |
02/20/2003 | WO2003014426A1 Method for producing electroconductive particles |
02/20/2003 | WO2003014425A1 Copper on invar composite and method of making |
02/20/2003 | WO2001081657A3 Elastic contact element |
02/20/2003 | US20030036269 Method of removing smear from via holes |
02/20/2003 | US20030035977 Barrier layer for electrical connectors and methods of applying the layer |
02/20/2003 | US20030034252 Process for electrochemical treatment of a continuous web |
02/20/2003 | US20030034251 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
02/20/2003 | US20030034250 Reverse voltage bias for electro-chemical plating system and method |
02/19/2003 | CN1397468A Brake and its mfg. method |
02/18/2003 | US6521114 Prevention of marine encrustation on bronze propellers |
02/18/2003 | US6521102 Perforated anode for uniform deposition of a metal layer |
02/13/2003 | WO2003012845A1 Semiconductor fabrication device and semiconductor fabrication method |
02/13/2003 | WO2003012175A2 Method for selectively electroplating a strip-shaped, metal support material |
02/13/2003 | WO2003012174A1 Electrolytic process for depositing a layer of copper on a steel wire |
02/13/2003 | WO2002045476A3 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
02/13/2003 | US20030031294 X-ray coating thickness gauge |
02/13/2003 | US20030029732 Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas |
02/13/2003 | US20030029731 Making electrical contact to workpiece frontal surface by pressing electrical contacts against frontal surface of workpiece; applying electrical potential between electrode and electrical contacts; moving workpiece and electrical contacts |
02/13/2003 | US20030029730 Copper on INVAR® composite |
02/13/2003 | US20030029717 Treatment of circuit support with impulse excitation |
02/13/2003 | US20030029607 Black layer coated heat exchanger |
02/13/2003 | US20030029275 Ultrasonic vibration cutting tool and production method thereof |
02/13/2003 | DE10129900C1 Verfahren zur Wärmebehandlung eines Kaltbandes mit einer Oberflächenbeschichtung aus Ni und/oder Co, durch das Verfahren herstellbares Blech und durch das Verfahren herstellbarer Batteriebecher A method of heat treatment of a cold strip with a surface coating of Ni and / or Co, producible by the method and sheet producible by the method of battery cans |
02/12/2003 | EP1283282A1 A method for Cu electroplating in integrated circuit fabrication |
02/12/2003 | EP1283254A1 Hydrocarbon cracking process in which a protective layer for a steel portion of the reactor is used |
02/12/2003 | CN1396313A Electrolytic processing method for wire and electrolytic processing device for wire |
02/11/2003 | US6518668 Multiple seed layers for metallic interconnects |
02/11/2003 | US6518182 Via-filling process |
02/11/2003 | US6517894 Method for plating a first layer on a substrate and a second layer on the first layer |
02/11/2003 | US6517893 Method of manufacture of printed wiring boards having multi-purpose finish |
02/11/2003 | US6517690 Roller assembly for an electroplating apparatus |
02/06/2003 | WO2003010368A1 Method and apparatus for sealing a substrate surface during an electrochemical deposition process |
02/06/2003 | WO2003010365A1 Plating method and plating apparatus |
02/06/2003 | WO2003010364A2 Dynamic pulse plating for high aspect ratio features |
02/06/2003 | WO2003010359A1 Foreign matter removing mechanism, fluid flow processing equipment, and foreign matter removing method |
02/06/2003 | WO2002069380A3 Atomically thin highly resistive barrier layer in a copper via |
02/06/2003 | WO2002057514A3 Method and apparatus for electrodeposition or etching of uniform film with minimal edge exclusion on substrate |
02/06/2003 | US20030024819 Method of providing conductive tracks on a printed circurt and apparatus for use in carrying out the method |
02/06/2003 | US20030024733 Lead-free solder, and connection lead and electrical component using said lead-free solder |
02/05/2003 | CN1100894C Compound electrode for electrolysis |
02/05/2003 | CN1100893C Laminated material for sliding components and method for preparing through and its reagent |
02/04/2003 | US6514400 Method for producing a fuel cell separator |
02/04/2003 | US6514393 Adjustable flange for plating and electropolishing thickness profile control |
02/04/2003 | US6514392 Conducting roller for an electroplating apparatus |
02/04/2003 | US6514391 Electroplating apparatus with conducting nets for distributing evenly anode current |
01/30/2003 | WO2003009361A2 Planar metal electroprocessing |
01/30/2003 | WO2003009343A2 Plating apparatus |
01/30/2003 | WO2003008671A1 Composite foil and its manufacturing process |
01/30/2003 | WO2003008660A1 Depositing a tantalum film |
01/30/2003 | WO2002088592A9 Multi-layer coating tube and production method therefor |
01/30/2003 | US20030022493 Cooling the copper electrolyte solution to below room temperature to increase the rate of self annealing grain growth, reducing the final resistivity of the copper lines |
01/30/2003 | US20030019755 Metal electrodeposition with at least one time interval pulses of zero electrical voltage or current, gradually decreased pulses to provide a void-free and seam-free coatings |
01/30/2003 | US20030019741 Method and apparatus for sealing a substrate surface during an electrochemical deposition process |
01/30/2003 | US20030019653 Intermetallic contact surface structure and connector |
01/30/2003 | CA2454377A1 Composite foil and its manufacturing process |
01/29/2003 | EP1278899A1 Method and device for the electrolytic coating of a metal strip |
01/29/2003 | EP1278898A1 Textured metal article |
01/29/2003 | EP1097261B1 Galvanic bath, method for producing structured hard chromium layers and use thereof |
01/28/2003 | US6512910 Developing apparatus |
01/28/2003 | US6512667 Supercapacitor using iron oxide as active material of electrodes formed on current collector which is portion of peripheral surface of case, chassis, compartment, cover, frame or housing of appliance or vehicle |
01/28/2003 | US6512281 Method of forming a semiconductor device and an improved deposition system |
01/28/2003 | US6511588 Semiconductors, additive which hinders growth of plating metal film to a plating solution |
01/23/2003 | WO2003006718A1 Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process |
01/23/2003 | WO2003006193A1 Continuous casting roll for casting molten baths and method for producing one such continuous casting roll |
01/23/2003 | US20030015435 An electro-etching process for a semiconductor wafer |
01/23/2003 | US20030015432 Container-shaped physical vapor deposition targets |
01/23/2003 | DE10134074C1 Casting roller used for casting molten metal, especially molten steel, comprises a metallic rolling body having a metallic layer which is harder than the material of the rolling body |
01/23/2003 | CA2450564A1 Continuous casting roll for casting molten baths and method for producing one such continuous casting roll |
01/22/2003 | EP1277983A1 Brake device & method using Ni-W alloy plating |
01/22/2003 | EP1276919A2 Electroplating bath composition and method of using |
01/22/2003 | EP1276578A1 Mold wall, especially a broadside wall of a continuous casting mold for steel |
01/22/2003 | EP1042539A4 Printed circuit manufacturing process using tin-nickel plating |
01/22/2003 | CN2532085Y Edge cover shielding fabric for horizontal electroplating tank |
01/22/2003 | CN1392572A Thin film resistor element and its producing method |
01/22/2003 | CN1099334C Component of printed circuit boards |
01/21/2003 | US6509650 Electronic device, and method of patterning a first layer |
01/21/2003 | US6509275 Method of manufacturing thin film and pretreating method thereof |
01/21/2003 | US6508926 Method and device for partial electrochemical treatment of bar-shaped objects |
01/21/2003 | US6508925 Automated brush plating process for solid oxide fuel cells |
01/21/2003 | US6508924 Control of breakdown products in electroplating baths |
01/21/2003 | US6508920 Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device |
01/16/2003 | WO2003005430A2 Method and apparatus for controlling a plating process |
01/16/2003 | US20030012975 Composite copper foil and manufacturing method thereof |