Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
07/2000
07/19/2000EP1019954A1 Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device
07/19/2000CN1260684A Copper foil with good chemicals-resisting and heat-resisting characteristicas for printed circuit board
07/18/2000US6091498 Semiconductor processing apparatus having lift and tilt mechanism
07/18/2000US6090711 Methods for controlling semiconductor workpiece surface exposure to processing liquids
07/18/2000US6090263 Process for coating an article with a conformable nickel coating
07/18/2000US6090261 Method and apparatus for controlling plating over a face of a substrate
07/14/2000CA2270845A1 A color coating method on surface of metal materials
07/13/2000WO2000040784A2 Methods for coating metallic articles
07/13/2000WO2000040779A1 Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece
07/13/2000CA2358105A1 Methods for coating metallic articles
07/12/2000EP1017884A2 Electro-plating process
07/12/2000EP1017881A1 Composition and method for priming substrate materials
07/11/2000US6086742 Successively electrodepositing a lead- or tin-based binary layer and a molybdenum-based running-layer
07/11/2000US6086731 Composite plating apparatus
07/06/2000DE19934298A1 Vorrichtung und Verfahren zum Behandeln von Substraten Apparatus and method for processing substrates
07/05/2000EP1017068A2 Process for forming device comprising metallized magnetic substrates
07/05/2000EP1016739A2 Copper foil having glossy surface with excellent oxidation resistance and method of manufacturing the same
07/05/2000EP1015669A1 Article, method, and apparatus for electrochemical fabrication
07/05/2000EP1015668A1 Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
07/05/2000EP1015666A1 Simplified process and apparatus for production of copper foil
07/04/2000US6083376 Inserting a second electrode into a hollow first electrode and immersing both electrodes in a reaction solution; inducing a charge; rotating at least one of said hollow first electrode and said second electrode
07/04/2000US6083375 Each pad includes a base pad which is encapsulated within a series of successively electroplated metal encapsulating films to produce a corrosion-resistant terminal metal pad.
06/2000
06/29/2000WO2000038218A2 Device and method for treating substrates
06/29/2000WO2000037716A1 Plating apparatus, plating system, method for plating using the same
06/29/2000WO2000000672A3 Galvanic bath, method for producing structured hard chromium layers and use thereof
06/28/2000EP0871798A4 Fine particle microencapsulation and electroforming
06/27/2000US6080291 Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member
06/22/2000WO2000036177A1 Steel wire with bright looking surface
06/21/2000EP1010781A1 Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
06/21/2000EP1010780A2 Cathode contact ring for electrochemical deposition
06/21/2000EP1010779A2 Method and apparatus for the continuous chromium-plating of elongated members
06/20/2000US6077815 Laminated material for sliding members, and process for the production thereof
06/20/2000US6077413 Preparing an implantable medical device having a radioactive metallic surface for use in preventing restenosis in atherosclerotic coronary arteries that have been subjected to percutaneous transluminal coronary angioplasty
06/20/2000US6077412 Processing chamber for depositing and/or removing material onto/from a semiconductor wafer
06/20/2000US6077411 Apparatus and process for forming zinc oxide film and process for producing photo-electricity generating device using the film
06/20/2000US6077405 Method and apparatus for making electrical contact to a substrate during electroplating
06/13/2000US6074544 Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
06/08/2000WO2000033625A1 Process for depositing conducting layer on substrate
06/08/2000WO2000033356A2 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
06/08/2000WO2000032850A1 Plating machine
06/08/2000WO2000032849A1 Equipment for inline plating
06/08/2000WO2000032848A2 An inflatable compliant bladder assembly
06/08/2000WO2000032835A2 Electro-chemical deposition system
06/08/2000CA2352942A1 Equipment for inline plating
06/08/2000CA2352160A1 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
06/08/2000CA2350506A1 Process for depositing conducting layer on substrate
06/07/2000EP1006763A2 Copper foil for printed wiring board having excellent chemical resistance and heat resistance
06/07/2000EP1006218A2 Plated metal part and method of manufacturing same
06/06/2000US6071814 Selective electroplating of copper for damascene process
06/06/2000US6071629 Facing adhesion for rustproofing, zinc or zinc alloy layer and organic resin
06/06/2000US6071388 Electroplating workpiece fixture having liquid gap spacer
06/06/2000US6071384 Arrangement for the electrogalvanic metal coating of strips
06/01/2000CA2292112A1 Method and apparatus for the continuous chromium-plating of elongated members
05/2000
05/31/2000EP1004689A2 Coated metal wire, wire-reinforced elastomeric article containing the same and method of manufacture
05/31/2000EP1004683A1 Bearing material
05/31/2000DE19854740A1 Iron, especially a steam iron, has a steel sole plate with a hard and scratch resistant electroplated metal layer
05/30/2000US6068755 Process for forming zinc oxide film and processes for producing semiconductor device plate and photo-electricity generating device using the film
05/30/2000CA2053798C Process for applying a copper layer to steel wire
05/30/2000CA2020638C Continuous electroplating of conductive foams
05/25/2000WO2000030188A1 Battery sheath made of a formed cold-rolled sheet and method for producing battery sheaths
05/25/2000WO2000029647A2 Stratified composite material for sliding elements and method for the production thereof
05/25/2000DE19853293A1 Verfahren zur Herstellung eines innenseitig mit einer Hartchromschicht versehenen Waffenrohres A process for the preparation of a inner side provided with a hard chromium layer gun barrel
05/25/2000DE19852202A1 Batteriehülse aus umgeformtem, kaltgewalztem Blech sowie Verfahren zur Herstellung von Batteriehülsen Battery shell made of formed sheet, cold rolled sheet and method for producing battery shells
05/25/2000CA2348924A1 Battery sheath made of a formed cold-rolled sheet and method for producing battery sheaths
05/24/2000EP1003230A1 Surface-treated steel plate for battery case, battery case and battery using the case
05/24/2000EP1003008A1 Method for manufacturing a gun barrel with an inner chromium liner
05/18/2000DE19852481A1 Schichtverbundwerkstoff für Gleitelemente und Verfahren zu seiner Herstellung Composite multilayer material for sliding elements and process for its preparation
05/18/2000DE19852271A1 Verfahren zur Herstellung verzinnter Drähte Process for the preparation of tinned wires
05/17/2000EP1001053A1 Method for manufacturing hot dip tinned wires
05/17/2000EP0910489B1 Element of a continuous metal casting ingot mould with a copper or copper alloy cooled wall comprising on its external surface a metal coating, and method of coating
05/17/2000EP0687405B1 Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture
05/17/2000CN1253376A Method for making semi-conductor device
05/16/2000US6063253 Apparatus and method for electroplating a metal onto a substrate
05/11/2000WO2000026444A1 Copper metallization structure and method of construction
05/11/2000WO2000026443A2 Method and apparatus for electrochemical mechanical deposition
05/11/2000WO2000025961A1 Component of printed circuit boards
05/11/2000DE19952273A1 Copper connection film, e.g. for an ultra large scale integration, is produced by high pressure grain growth heat treatment of a deposited film while suppressing pore formation
05/10/2000EP0999584A2 Method for manufacturing semiconductor device
05/10/2000EP0999295A2 Arrangement for the electrogalvanic metal coating of strips
05/10/2000CN1252458A Device for electroplating metal film of strip
05/09/2000US6059951 Steel wire
05/03/2000EP0997556A2 Coated article with identification mark
04/2000
04/27/2000WO2000010200A8 Wafer plating method and apparatus
04/27/2000DE19848876A1 Apparatus for the electrogalvanic metal coating of strips running through an acidic electrolyte enriched with metal has anode strips with protective current supply
04/26/2000CN1251624A Device for carrying out continuous electrolyting precipitation process
04/26/2000CN1251623A Device for producing foamed shaped parts, method for producing mould and foamed shaped parts
04/26/2000CN1251394A Method and apparatus for producing hot-rolled steel belt with electrolytic coating
04/25/2000CA2175597C Process and apparatus for in situ electroforming a structural layer of metal bonded to an internal wall of a metal tube
04/20/2000WO2000022193A2 Electrodeposition of metals in small recesses using modulated electric fields
04/20/2000CA2314109A1 Electrodeposition of metals in small recesses using modulated electric fields
04/19/2000EP0993512A1 Porous film and method of preparation thereof
04/18/2000US6051118 Compound electrode for electrolysis
04/18/2000US6049976 Method of mounting free-standing resilient electrical contact structures to electronic components
04/13/2000WO2000020663A1 Substrate plating device
04/13/2000WO2000020662A1 Submicron metallization using electrochemical deposition
04/13/2000WO2000019936A1 Method for producing prosthetic moulded parts for dental use and prosthetic moulded part
04/13/2000DE19846589A1 Coated sanitary fitting has an identification mark inserted into a part of the finely processed surface which is then galvanically coated
04/13/2000CA2345636A1 Method for producing prosthetic moulded parts for dental use and prosthetic moulded part
04/12/2000EP0992062A2 Electro-chemical deposition cell for face-up processing of single semiconductor substrates
04/12/2000EP0991795A1 Electro-chemical deposition system and method of electroplating on substrates