Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
02/1999
02/17/1999CN1208368A Fabricating interconnects and tips using sacrificial substrates
02/16/1999US5871630 Preparation of copper-indium-gallium-diselenide precursor films by electrodeposition for fabricating high efficiency solar cells
02/16/1999US5871629 Pins and grids for conductive contactors
02/16/1999US5871626 Flexible continuous cathode contact circuit for electrolytic plating of C4, TAB microbumps, and ultra large scale interconnects
02/11/1999WO1998048083A3 Device for carrying out continuous electrolytic precipitation processes
02/11/1999WO1998048081A3 Method for electroplating metallic and non-metallic endless products and device for carrying out said method
02/10/1999EP0895549A1 Electrochemical fluidized bed coating of powders
02/09/1999US5869139 Apparatus and method for plating pin grid array packaging modules
02/03/1999EP0859674A4 Continuous casting mold and method of making
02/03/1999CN1206753A Device for electroplating steel band coating
02/02/1999US5865979 Uniform coating
02/02/1999US5865894 Megasonic plating system
02/02/1999US5864946 Method of making contact tip structures
01/1999
01/26/1999US5863816 Fabrication method for chip size semiconductor package
01/26/1999US5863615 Plating jig and plating method using the plating jig
01/26/1999US5863410 Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
01/20/1999EP0839215A4 Roll forming structural steel profiles with galvanised coating
01/20/1999EP0832545B1 Process and device for treating holes or recesses in workpieces with liquid treatment agents
01/20/1999EP0776385A4 High fatigue ductility electrodeposited copper foil
01/19/1999US5861217 Composite material having anti-wear property and process for producing the same
01/13/1999EP0890658A2 Megasonic plating system
01/13/1999CN2303855Y Steel-pipe electrogalvanizing apparatus
01/13/1999CN1204702A Process for depositing layer of material on substrate and plating system
01/07/1999WO1999000536A2 Porous film and method of preparation thereof
01/07/1999EP0889147A1 Tin plating method and bath having wide optimum current density range
01/06/1999CN1204419A Preparation of CuxInyGazSen (x=0-2,Y=0-2,z=0-2,n=0-3) precursor films by electrodeposition for fabricating high efficiency solar cell
12/1998
12/30/1998WO1998059095A1 Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
12/30/1998EP0887441A1 Compound electrode for electrolysis
12/30/1998EP0886894A2 Contact carriers (tiles) for populating larger substrates with spring contacts
12/29/1998US5853559 Apparatus for electroplating a semiconductor substrate
12/29/1998US5852871 Method of making raised contacts on electronic components
12/29/1998CA2141122C Method for manufacturing tin-coated strips or sheets from copper or a copper alloy
12/16/1998EP0884404A2 Rotogravure cylinder electroplating apparatus using ultrasonic energy
12/16/1998EP0883699A1 Method and devices for the electrolytic formation of a deposit on an assembly of selected electrodes
12/16/1998CN1202008A Lead frame and method for manufacturing the same
12/10/1998WO1998038355A3 Method and device for coating a metal strip
12/09/1998EP0883331A2 Electroplating process
12/09/1998EP0883167A2 Forming preferred orientation-controlled platinum film using oxygen
12/09/1998EP0882817A2 Apparatus and method for electroplating rotogravure cylinder using ultrasonic energy
12/09/1998EP0882145A1 Method of producing layered material for sliding bearings and an electroplating bath for carrying out this method
12/09/1998EP0868223A4 Radiation-cured edge-masking process for high speed electrogalvanizing
12/09/1998CN1201080A Method for preventing carbon-steel cooling apparatus from corrosion by sea water and apparatus thereof
12/02/1998EP0760873B1 Electrolytic method and device for the continuous and uniform metallization or etching of metal surfaces
11/1998
11/24/1998US5839496 Casting low melting tin alloy, cooling
11/18/1998EP0878834A2 A method for preventing electroplanting of copper on an exposed surface at the edge exclusion of a semiconductor wafer
11/18/1998CN1199104A Method and apparatus for plating lead frame
11/17/1998US5837109 Apparatus for treating a strip
11/12/1998WO1998050954A1 Stacked semiconductor devices, particularly memory chips
11/11/1998EP0877419A2 Methods of electroplating solder bumps of uniform height on integrated circuit substrates
11/11/1998EP0876519A1 Apparatus and method for electroplating a metal onto a substrate
11/11/1998EP0859686A4 Fabricating interconnects and tips using sacrificial substrates
11/10/1998US5833838 Prevention of coking and carburization during hydrocarbon catalytic cracking by coating steel reactor tube with nonpeeling coating of nonoxidized chromium bonded to surface with carbide intermediate layer
11/10/1998US5833820 Gas shielding to prevent metal plating on contacts; reduces particle contamination and increases thickness uniformity
11/10/1998US5833819 Copper foil for a printed circuit board, a process and an apparatus for producing the same
11/10/1998US5833816 Apparatus for treating printed circuit boards
11/10/1998US5832601 Method of making temporary connections between electronic components
11/05/1998WO1998049374A2 Device for electrolytic treatment of printed circuit boards and conductive films
11/05/1998CA2287274A1 Apparatus for electrolytically treating printed circuit boards and conductor foils
11/04/1998EP0875605A2 Arrangement for the electrogalvanic metal coating of strips
11/04/1998EP0874921A1 Process and system for electrochemical treatment of long stretched-out items
11/04/1998CN1198293A Copper foil for manufacture of printed circuits and method of producing same
11/03/1998US5829128 Method of mounting resilient contact structures to semiconductor devices
10/1998
10/29/1998WO1998048083A2 Device for carrying out continuous electrolytic precipitation processes
10/29/1998WO1998048081A2 Method for electroplating metallic and non-metallic endless products and device for carrying out said method
10/29/1998DE19803490A1 Electrodeposition unit for semiconductor wafer coating
10/29/1998DE19717512A1 Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen Apparatus for electroplating of printed circuit boards under constant conditions in continuous flow systems
10/28/1998EP0741804B1 Process and device for the electrolytic metal coating or etching of articles
10/28/1998CN2295766Y Shaft sleeve with internal wear-resistant composite coating
10/28/1998CN1197123A Method and appts. of producing steet-metal strip
10/27/1998US5827419 Continuous process for the electrogalvanizing of metal strip in a chloride-based plating solution in order to obtain coatings with low rugosity at high current densities
10/27/1998US5827410 Device for the electrolytic treatment of plate-shaped workpieces
10/22/1998WO1998046811A1 Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
10/22/1998WO1998038354A3 Method and device for coating a metal strip
10/22/1998DE19716493A1 Verfahren zum elektrolytischen Beschichten von metallischen oder nichtmetallischen Endlosprodukten und Vorrichtung zur Durchführung des Verfahrens A method for electrolytic coating of metallic or non-metallic continuous products and apparatus for carrying out the method
10/22/1998DE19716369A1 Vorrichtung zum Durchführen kontinuierlicher elektrolytischer Abscheidungsprozesse A device for performing continuous electrolytic deposition processes
10/21/1998EP0871798A1 Fine particle microencapsulation and electroforming
10/15/1998WO1998045504A1 Article, method, and apparatus for electrochemical fabrication
10/15/1998CA2572786A1 Method for electrochemical fabrication including etching to remove flash
10/15/1998CA2572503A1 Method for electrochemical fabrication including enhanced data manipulation
10/15/1998CA2572499A1 Method for electrochemical fabrication including use of multiple structural and/or sacrificial materials
10/14/1998CN1196161A Process for producing through-connected printed circuit board and multilayered printed circuit board
10/13/1998US5821686 Inner-shield material to be attached inside a color cathode ray tube
10/13/1998US5820721 Manufacturing particles and articles having engineered properties
10/08/1998WO1998044171A1 Device for producing foamed shaped parts, method for the production of a form tool and method for the production of a shaped foamed parted
10/08/1998DE19713566A1 Vorrichtung zum Herstellen von Formschaumteilen, Verfahren zum Herstellen eines Formwerkzeuges und Verfahren zum Herstellen eines Formschaumteils Device for producing foam moldings, method for producing a molding tool and method for producing a shaped foam part
10/08/1998CA2285303A1 Device for producing foamed shaped parts, method for the production of a form tool and method for the production of a shaped foamed parted
10/07/1998EP0869549A2 Solder bump formation
10/07/1998EP0868223A1 Radiation-cured edge-masking process for high speed electrogalvanizing
10/07/1998CN2293570Y Wire rod continuous electroplating apparatus with meshed anode
10/07/1998CN1195034A Strip composite material and its producing method and device
09/1998
09/30/1998EP0867529A1 A method and apparatus for sequentially metalizing polymeric films and products made thereby
09/30/1998EP0866891A1 Coating particles in a centrifugal bed
09/30/1998CN1194673A Method for straightening warp of steel strip in electroplating line
09/29/1998US5814202 Electrolytic tin plating process with reduced sludge production
09/23/1998EP0729522B1 Metal tube having a section with an internal electroplated structural layer
09/22/1998US5810990 Method for plating and finishing a cylinder bore
09/22/1998CA2110547C Slide surface construction formed of aggregate of metal crystals having face-centered cubic structure
09/17/1998WO1998040539A1 Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations
09/17/1998WO1998040537A1 Graded metal hardware component for an electrochemical cell
09/15/1998US5807469 For integrated circuits