| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 04/06/2000 | WO1999060189A3 Method for metal coating of substrates |
| 04/06/2000 | WO1999054920A3 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 04/06/2000 | DE19845506A1 Verfahren zur Herstellung von prothetischen Formteilen für den Dentalbereich und prothetisches Formteil Process for the preparation of prosthetic moldings for the dental field and Prosthetic molding |
| 04/05/2000 | EP0990423A1 Method of manufacturing prosthetic elements for the dental field and prosthetic element |
| 04/04/2000 | US6045678 Formation of nanofilament field emission devices |
| 03/29/2000 | EP0989209A2 Electroplating apparatus |
| 03/29/2000 | EP0583426B2 Improved process for preparing a nonconductive substrate for electroplating |
| 03/28/2000 | US6042891 Roll forming structural steel profiles with galvanised coating |
| 03/28/2000 | US6042712 Apparatus for controlling plating over a face of a substrate |
| 03/23/2000 | WO1999064647A9 Method and apparatus for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipolar electrode assembly |
| 03/23/2000 | WO1999054527A3 Electro-chemical deposition system and method of electroplating on substrates |
| 03/22/2000 | EP0987931A2 Composite foil of aluminum and copper |
| 03/22/2000 | CN1050730C Method of manufacturing printed circuit board |
| 03/16/2000 | WO2000014308A1 Substrate plating device |
| 03/16/2000 | WO2000014307A1 Pellistor |
| 03/16/2000 | WO2000014306A1 Method for plating substrate and apparatus |
| 03/16/2000 | CA2341033A1 Pellistor |
| 03/14/2000 | US6036834 Selective electroplating of supported electrodes, then charging yields miniaturized biosensors |
| 03/14/2000 | US6036826 Titanium electrodeposition drum |
| 03/14/2000 | US6036822 Thin-film solar cell manufacturing apparatus and manufacturing method |
| 03/07/2000 | US6033548 Rotating system and method for electrodepositing materials on semiconductor wafers |
| 03/07/2000 | US6033540 Plating apparatus for plating a wafer |
| 03/07/2000 | US6032356 Wafer-level test and burn-in, and semiconductor process |
| 03/02/2000 | WO2000011679A2 Contact element |
| 03/02/2000 | WO2000011245A2 Device for partial electrochemical treatment of bar-shaped objects |
| 03/02/2000 | WO2000010797A1 Non-lambertian glass diffuser and method of making |
| 03/02/2000 | DE19839479A1 Chemical or electrochemical treatment of an axisymmetric hollow component involves holding the component in a rotating unit so that a circumferential section of the component is dipped into the treatment bath |
| 03/02/2000 | CA2341218A1 Contact element |
| 03/01/2000 | EP0982771A1 Process for semiconductor device fabrication having copper interconnects |
| 02/29/2000 | US6030512 Device for forming bumps by metal plating |
| 02/29/2000 | US6029344 Composite interconnection element for microelectronic components, and method of making same |
| 02/24/2000 | WO2000010200A1 Wafer plating method and apparatus |
| 02/23/2000 | EP0980918A1 Product conveyance mechanism of electroplating apparatus |
| 02/22/2000 | US6027630 Method for electrochemical fabrication |
| 02/17/2000 | WO2000007753A1 Casting steel strip |
| 02/17/2000 | WO1999061183A3 Coated metal powder and method for producing the same |
| 02/16/2000 | EP0979688A1 Method of manufacturing copper tubes |
| 02/16/2000 | CN1244460A Composite foil of aluminium and copper |
| 02/15/2000 | US6025205 Apparatus and methods of forming preferred orientation-controlled platinum films using nitrogen |
| 02/15/2000 | US6024856 Copper metallization of silicon wafers using insoluble anodes |
| 02/15/2000 | US6024849 Conducting roller for an electroplating apparatus |
| 02/15/2000 | US6024846 Installation for coating a metallic band by guiding the latter through an electrolytic bath |
| 02/10/2000 | WO2000007229A1 A system and a method for plating of a conductive pattern |
| 02/10/2000 | WO1999066106A3 Method and apparatus for electroplating |
| 02/09/2000 | EP0978575A1 Process and device for removing dendrites |
| 02/09/2000 | EP0788728B1 Process for coating electrically non-conducting surfaces with connected metal structures |
| 02/08/2000 | US6022468 Electrolytic hardening process |
| 02/08/2000 | US6022467 Electrolytic tin plating process with reduced sludge production |
| 02/08/2000 | US6022465 For customizing electrode contact placement on a semiconductor wafer while depositing and/or removing a material on semiconductor wafer |
| 02/03/2000 | WO2000005775A1 Bipolar collector for fuel cell |
| 02/03/2000 | WO2000005747A2 Metallization structures for microelectronic applications and process for forming the structures |
| 02/03/2000 | WO2000005436A1 Circumferential cell device for electrodeposition with differentiated flows |
| 02/03/2000 | DE19926102A1 Production of electrolytically coated hot-rolled strip comprises continuous single line feeding hot-rolled strip into a chemical pickling section and then into a coating section |
| 02/03/2000 | DE19834759A1 Verfahren und Vorrichtung zum Entfernen von Dendriten Method and apparatus for removing dendrites |
| 02/03/2000 | CA2337319A1 Bipolar collector for fuel cell |
| 02/02/2000 | EP0975826A2 Method for electroplating metallic and non-metallic endless products and device for carrying out said method |
| 02/02/2000 | EP0975825A2 Device for carrying out continuous electrolytic precipitation processes |
| 02/01/2000 | US6019886 Comparator for monitoring the deposition of an electrically conductive material on a leadframe to warn of improper operation of a leadframe electroplating process |
| 02/01/2000 | US6019884 Method of correcting warpage of steel strip in electroplating line |
| 01/26/2000 | EP0974686A2 Electroplating process for oldham ring and scroll member type compressor comprising the same |
| 01/26/2000 | EP0973960A1 Device for producing foamed shaped parts, method for the production of a form tool and method for the production of a shaped foamed parted |
| 01/25/2000 | US6017820 Integrated vacuum and plating cluster system |
| 01/25/2000 | US6017437 Process chamber and method for depositing and/or removing material on a substrate |
| 01/20/2000 | WO2000003072A1 Method and apparatus for copper plating using electroless plating and electroplating |
| 01/20/2000 | WO2000003071A1 Electroplating reactor including back-side electrical contact apparatus |
| 01/20/2000 | WO2000003067A1 Reactor vessel having improved cup, anode and conductor assembly |
| 01/20/2000 | DE19837973C1 Apparatus for electrochemical treatment of parts of bar-shaped workpieces in immersion bath installations |
| 01/19/2000 | EP0973195A1 Silver metallization by damascene method |
| 01/19/2000 | CN1241650A Method of electromolding tridimensional metal structure directly on silicon substrate and the special fixture thereof |
| 01/18/2000 | US6015482 Printed circuit manufacturing process using tin-nickel plating |
| 01/18/2000 | US6015462 Semiconductor processing workpiece position sensing |
| 01/17/2000 | CA2277319A1 Electroplating process for oldham ring and scroll member type compressor comprising the same |
| 01/12/2000 | EP0874921B1 Process and system for electrochemical treatment of long stretched-out items |
| 01/06/2000 | WO2000001208A1 Assembly of an electronic component with spring packaging |
| 01/06/2000 | WO2000000673A1 Method for producing a nickel foam and a nickel foam thus obtainable |
| 01/06/2000 | WO2000000672A2 Galvanic bath, method for producing structured hard chromium layers and use thereof |
| 01/06/2000 | WO1999057342A8 Method and device for plating substrate |
| 01/06/2000 | CA2334708A1 Galvanic bath, method for producing structured hard chromium layers and use thereof |
| 01/05/2000 | EP0969124A1 Process and apparatus for the deposition of a zinc-nickel alloy on a substrate |
| 01/04/2000 | US6010610 Stirring, sedimentation, electroplating cycles |
| 01/04/2000 | US6009904 Diverter tub spout body |
| 12/29/1999 | WO1999067448A1 Freely detachable insoluble anode |
| 12/29/1999 | EP0967303A1 Apparatus and method for electrolytically treating the inside surface of a portion of a vessel |
| 12/29/1999 | EP0966556A1 Graded metal hardware component for an electrochemical cell |
| 12/28/1999 | US6007866 Swelling, treating with alkaline permanganate, rinsing with water and acidic aqueous solution and water, neutralizing manganese dioxide layer with alkaline solution, rinsing with water and ethylene-3,4-dioxythiophene, acid, then coppering |
| 12/28/1999 | US6007758 Using conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent, firing of the substrate onto which the ink has been coated, and plating of copper thereon |
| 12/23/1999 | WO1999066106A2 Method and apparatus for electroplating |
| 12/21/1999 | US6004828 Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces |
| 12/21/1999 | US6004440 Cathode current control system for a wafer electroplating apparatus |
| 12/16/1999 | WO1999064647A1 Method and apparatus for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipolar electrode assembly |
| 12/15/1999 | EP0964080A1 Electrolysis apparatus having liquid squeezer out of contact with strip |
| 12/15/1999 | CN1238394A Process of controlling grain growth in metal films |
| 12/14/1999 | US6001235 Rotary plater with radially distributed plating solution |
| 12/14/1999 | US6001234 Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot |
| 12/14/1999 | US6000853 Multi-layer engine bearings and method of manufacture |
| 12/07/1999 | US5998864 Stacking semiconductor devices, particularly memory chips |
| 12/07/1999 | US5998228 Method of testing semiconductor |
| 12/07/1999 | US5997710 Copper foil for a printed circuit board, a process and an apparatus for producing the same |
| 12/02/1999 | WO1999061183A2 Coated metal powder and method for producing the same |
| 12/02/1999 | DE19823341A1 Beschichtetes Metallpulver und Verfahren zu seiner Herstellung A coated metal powder and process for its preparation |