| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 06/26/2001 | US6252175 Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate |
| 06/26/2001 | US6251692 Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces |
| 06/26/2001 | US6251528 Method to plate C4 to copper stud |
| 06/26/2001 | US6251251 Anode isolator including at least one curvilinear surface that faces the anode and a surface that faces the cathode |
| 06/26/2001 | US6251250 Method of and apparatus for controlling fluid flow and electric fields involved in the electroplating of substantially flat workpieces and the like and more generally controlling fluid flow in the processing of other work piece surfaces as well |
| 06/26/2001 | US6251238 Anode having separately excitable sections to compensate for non-uniform plating deposition across the surface of a wafer due to seed layer resistance |
| 06/26/2001 | US6251236 Cathode contact ring for electrochemical deposition |
| 06/21/2001 | WO2001045144A1 A vertically configured chamber used for multiple processes |
| 06/21/2001 | US20010004048 For the production of electrical contact components, by applying a film of tin or tin alloy to a strip of electroconductive base material, and subsequently depositing a silver film |
| 06/20/2001 | EP1108804A2 Process and apparatus for forming zinc oxide film, and process and apparatus for producing photovoltaic device |
| 06/20/2001 | EP1108494A2 Ultrasonic vibration cutting tool and production method thereof |
| 06/19/2001 | US6248222 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 06/14/2001 | WO2001042537A1 Surface treated steel sheet for battery case, battery case using it, and battery using the case |
| 06/13/2001 | EP0882145B1 Method of producing layered material for sliding bearings and an electroplating bath for carrying out this method |
| 06/13/2001 | CN1298781A Ultrasonic vibration cutting tools and mfg. method therefor |
| 06/12/2001 | US6246247 Probe card assembly and kit, and methods of using same |
| 06/12/2001 | US6245676 Method of electroplating copper interconnects |
| 06/12/2001 | US6245213 Concentrated solution is usable for isotopic etching, |
| 06/09/2001 | CA2327563A1 Ultrasonic vibration cutting tool and production method thereof |
| 06/07/2001 | WO2001041191A2 Method and apparatus for forming an oxidized structure on a microelectronic workpiece |
| 06/07/2001 | US20010003008 Measuring an electrical resistance of the metal layer via connections on a starting layer provided under the metal layer and determining layer thickness from the resistance measurement |
| 06/07/2001 | US20010002624 Tip structures. |
| 06/05/2001 | US6242803 Semiconductor devices with integral contact structures |
| 06/05/2001 | US6241869 Apparatus and method for electroplating |
| 06/05/2001 | US6241868 Providing electrical contact between contact plate and contact pads on underside of substrate, wherein both contact plate and contact pads are isolated from electroplating solution |
| 06/05/2001 | US6240934 Method and device for treating holes or recesses extending into workpieces with liquid treatment media |
| 05/31/2001 | WO2001039250A2 Conductive interconnection |
| 05/31/2001 | WO2001038748A2 Sliding bearing having multilayer lead-free overplate and method of manufacture |
| 05/31/2001 | WO2001038604A1 Accelerator solution for direct plating and method for direct plating |
| 05/31/2001 | DE10058440A1 Mold for continuous casting of steel has alloy plating of tungsten and one or both of nickel and cobalt coated on section of its molten steel contact surface |
| 05/31/2001 | DE10054461A1 Mehrschichtgleitlager Multilayer plain bearings |
| 05/30/2001 | EP1103639A2 Plating apparatus and method |
| 05/30/2001 | EP0975825B1 Device for carrying out continuous electrolytic precipitation processes |
| 05/30/2001 | EP0883699B1 Method and devices for the electrolytic formation of a deposit on an assembly of selected electrodes |
| 05/29/2001 | US6238529 Device for electrolytic treatment of printed circuit boards and conductive films |
| 05/25/2001 | WO2001036696A1 Galvanically deposited bearing alloy, galvanic bath and galvanic deposition method |
| 05/23/2001 | EP1101839A2 Methods and apparatus for forming metal layers on substrates |
| 05/23/2001 | EP1100983A1 Reactor vessel having improved cup, anode and conductor assembly |
| 05/23/2001 | EP1100638A1 Casting steel strip |
| 05/23/2001 | DE10007108C1 Galvanically producing microstructures on substrate comprises immersing substrate in electrolyte solution and forming contact sites on surface of substrate |
| 05/23/2001 | CN1296375A Method for filling through hole |
| 05/23/2001 | CN1296088A Steel wire spring clamp head, wire-guiding frame conveying belt and electroplating system |
| 05/22/2001 | US6235412 Multilayer electroplated metal film |
| 05/22/2001 | US6235405 Electrodeposited alloy layer, in particular an overlay of a plain bearing |
| 05/22/2001 | US6235179 Electroplated structure for a flat panel display device |
| 05/22/2001 | US6235178 Method and device for coating a metal strip |
| 05/22/2001 | US6234678 Plain bearing |
| 05/17/2001 | WO2001034881A2 Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 05/17/2001 | WO2001034880A1 Electrolytic copper foil with carrier foil and method for manufacturing the same |
| 05/17/2001 | US20010001192 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head |
| 05/16/2001 | EP1100122A2 Die used for resin-sealing and molding an electronic component |
| 05/16/2001 | EP1099781A2 Conductive biasing member for metal layering |
| 05/16/2001 | EP1099012A1 Method and apparatus for copper plating using electroless plating and electroplating |
| 05/16/2001 | EP1099011A1 Method for producing a nickel foam and a nickel foam thus obtainable |
| 05/16/2001 | CN1295631A Articles having colored metallic coating with special properties |
| 05/15/2001 | US6231743 Method for forming a semiconductor device |
| 05/15/2001 | US6231728 Electroplating apparatus |
| 05/10/2001 | WO2001033089A1 Sliding bearing having multilayer lead-free overplate and method of manufacture |
| 05/10/2001 | WO2001032951A2 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates |
| 05/10/2001 | WO2001032362A1 Method and apparatus for deposition on and polishing of a semiconductor surface |
| 05/10/2001 | US20010000891 Method of plating semiconductor wafer and plated semiconductor wafer |
| 05/10/2001 | DE19951325A1 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitenden Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens Method and apparatus for electrolytic treatment of electrically mutually insulated, electrically conductive structures on surfaces of electrically insulating foil material, as well as applications of the method |
| 05/09/2001 | EP1097261A2 Galvanic bath, method for producing structured hard chromium layers and use thereof |
| 05/09/2001 | EP0839215B1 Roll forming structural steel profiles with galvanised coating |
| 05/08/2001 | US6228242 Steels |
| 05/08/2001 | US6228233 Inflatable compliant bladder assembly |
| 05/08/2001 | US6228232 Reactor vessel having improved cup anode and conductor assembly |
| 05/08/2001 | US6228231 Electroplating workpiece fixture having liquid gap spacer |
| 05/03/2001 | WO2001031095A1 Process and apparatus for the manufacture of high peel-strength copper foil |
| 05/03/2001 | WO2001031092A2 Method, chemistry, and apparatus for noble metal electroplating a on a microelectronic workpiece |
| 05/03/2001 | US20010000739 Non-lambertian glass diffuser and method of making |
| 05/03/2001 | DE19951324A1 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Oberflächen von gegeneinander vereinzelten Platten- und Folienmaterialstücken sowie Anwendung des Verfahrens Method and apparatus for electrolytic treatment of electrically conductive surfaces of mutually isolated sheet and film material properties as well as application of the method |
| 05/02/2001 | CN1293719A Apparatus and method for electrolytically depositing copper on semiconductor workpiece |
| 05/01/2001 | US6224737 Immersing semiconductor into electroplating solution containing predetermined concentration of brighteners and levelers |
| 05/01/2001 | US6224722 Method and apparatus for sequentially metalizing polymeric films and products made thereby |
| 05/01/2001 | US6224670 Cup-type plating method and cleaning apparatus used therefor |
| 04/26/2001 | WO2001029290A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 04/26/2001 | WO2001029289A1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method |
| 04/26/2001 | WO2001028726A1 Solder coating material and production method therefor |
| 04/26/2001 | US20010000396 Apparatus for depositing a metal film, comprising a holder that positions the substrate so seed layer contacts an electrolyte solution, and electric contact which contacts second side or edge of substrate; uniform current density |
| 04/26/2001 | DE19955297C1 Galvanically deposited bearing lead alloy contains alloying additions of tin, antimony and copper |
| 04/26/2001 | DE10032624A1 Gleitlager und sein Herstellungsverfahren Bearings and its production method |
| 04/26/2001 | CA2384249A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 04/26/2001 | CA2384244A1 Method and device for the electrolytic treatment of electrolytically conducting structures which are insulated from each other |
| 04/25/2001 | CN1292834A Electrolytic copper foil having modified shiny side |
| 04/24/2001 | US6221765 Method for manufacturing a semiconductor device |
| 04/24/2001 | US6221437 Metal layer |
| 04/24/2001 | CA2041870C Process for electrodepositing a metallic coating of a nickel-cobalt alloy on an object and electrolyte solution used therein |
| 04/19/2001 | WO2001027357A1 Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station |
| 04/19/2001 | WO2001026498A1 Die manufacturing |
| 04/18/2001 | EP1092790A2 Electroplating of copper from alkanesulfonate electrolytes |
| 04/18/2001 | EP1092338A1 Assembly of an electronic component with spring packaging |
| 04/17/2001 | US6217735 Applying megasonic energy to transducer to create transverse ridge of electrolyte, orienting substrate horizontally and face down so transverse ridge contacts face of substrate, applying plating current between anode and moving substrate |
| 04/17/2001 | US6217734 Electrodeposition apparatus for depositing material on surface of substrate, comprising contact for laterally contacting and providing electrical connection to substrate, which does not obscure surface but wraps around substrate, voltage source |
| 04/17/2001 | US6217727 Electroplating apparatus and method |
| 04/17/2001 | US6217725 Method and apparatus for anodizing |
| 04/17/2001 | CA2025337C Process for directly metallizing circuit boards |
| 04/14/2001 | CA2322726A1 Electroplating of copper from alkanesulfonate electrolytes |
| 04/12/2001 | WO2001026145A1 Seed layers for interconnects and methods and apparatus for their fabrication |
| 04/12/2001 | WO2000022193A3 Electrodeposition of metals in small recesses using modulated electric fields |