| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 04/11/2001 | EP1091024A1 Method and device for plating substrate |
| 04/11/2001 | EP1091023A2 Alloy composition and plating method |
| 04/11/2001 | EP1089843A2 Coated metal powder and method for producing the same |
| 04/11/2001 | CN1291243A Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 04/11/2001 | CN1290963A Lead frame and its electroplating method |
| 04/11/2001 | CN1290771A Electroplating device and process for electroplating parts using said device |
| 04/11/2001 | CN1290580A Method for producing product mounted with member and product mounted with member |
| 04/10/2001 | US6215670 Method for manufacturing raised electrical contact pattern of controlled geometry |
| 04/10/2001 | US6214193 Semiconductor wafers |
| 04/10/2001 | US6214180 Method for shorting pin grid array pins for plating |
| 04/10/2001 | US6213474 Chromium carbide steel formed by nitriding surface treatment; facilitated bending work during manufacture which prevents ring breakage; for internal combustion engines, and/or large diesel engines |
| 04/05/2001 | WO2001024257A1 Methods and apparatus for treating seed layer in copper interconnctions |
| 04/05/2001 | WO2001024239A1 Integrated circuit plating using highly-complexed copper plating baths |
| 04/05/2001 | WO2001023645A1 Method for electrodeposition of metallic multilayers |
| 04/05/2001 | CA2382481A1 Method for electrodeposition of metallic multilayers |
| 04/04/2001 | EP1089603A2 Copper foil bonding treatment with improved bond strength and resistance to undercutting |
| 04/04/2001 | EP1088122A2 Method and apparatus for electroplating |
| 04/04/2001 | EP1088121A2 Method for metal coating of substrates |
| 04/04/2001 | CN1290310A Plating apparatus and method |
| 04/03/2001 | US6210554 Supplying plating solution onto plating surface of wafer so solution flows from center of plating surface of wafer toward periphery; generating electric field between wafer and annular anode to obtain non-uniformly distributed coating that |
| 03/29/2001 | DE19944349A1 Pressure injection mold plate with electroplated areas, is mounted for plating on model frame with model penetrating mold- and model frames |
| 03/28/2001 | EP1087648A2 Multi-purpose finish for printed wiring boards and method of manufacture of such boards |
| 03/28/2001 | EP1087039A1 Plating jig of wafer |
| 03/28/2001 | EP1086807A2 Metal article coated with multilayer surface finish for porosity reduction |
| 03/28/2001 | EP0898659B1 Thin-walled bearings |
| 03/28/2001 | CN1289225A Electro-deposition copper foil through surface-processing, its mfg. method and use thereof |
| 03/27/2001 | US6207298 Connector surface-treated with a Sn-Ni alloy |
| 03/27/2001 | US6207219 Method for manufacturing thin-film solar cell |
| 03/27/2001 | US6207035 Method for manufacturing a metallic composite strip |
| 03/27/2001 | US6207034 Method of manufacture of polymer transistors with controllable gap |
| 03/22/2001 | WO2001020647A2 Novel chip interconnect and packaging deposition methods and structures |
| 03/22/2001 | WO2001019606A1 Treated copper foil and process for making treated copper foil |
| 03/22/2001 | DE19938409C1 Anordnung zum gleichmäßigen Umströmen einer Oberfläche einer Probe mit Flüssigkeit und Verwendung der Anordnung Arrangement for uniform flow around a surface of a sample with liquid and use of the arrangement |
| 03/20/2001 | US6203685 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head |
| 03/20/2001 | US6203582 Interchangable modules |
| 03/15/2001 | WO2001018859A1 Magnetic pole fabrication process and device |
| 03/15/2001 | DE19941605A1 Galvanisierungslösung für die galvanische Abscheidung von Kupfer Electroplating solution for the electrodeposition of copper |
| 03/14/2001 | EP1083249A2 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof |
| 03/14/2001 | EP1083248A2 Electrodeposited copper foil with its surface prepared, process for producing the same and use therof |
| 03/14/2001 | EP1083245A2 Fluid delivery systems for electronic device manufacture |
| 03/14/2001 | CN1287469A Electro-deposition copper foil through surface processing and its producing method and use |
| 03/13/2001 | US6201942 Developer-carrying member, and developing device and image forming apparatus including the member |
| 03/13/2001 | US6200692 A nickel layer (0.5-50 mu m thick) plated on an inside wall and having a nickel purity of >99% by weight, and coated with nickel oxide (50-400 ang. thick); storage stability; metal-free; used in producing semiconductors and liquid crystals |
| 03/13/2001 | US6200452 Method and apparatus for the continuous chromium-plating of elongated members |
| 03/13/2001 | US6200436 Recycling consistent plating system for electroplating |
| 03/08/2001 | WO2001016404A1 Method for enhanced selective plating of non-uniform objects by lowering the distribution factor |
| 03/08/2001 | WO2001016403A1 Galvanizing solution for the galvanic deposition of copper |
| 03/07/2001 | EP1081753A2 Process to improve filling of contact holes by electroplating |
| 03/07/2001 | EP1081253A2 Double pressure vessel chemical dispenser unit |
| 03/07/2001 | EP1081252A1 Selective plating method |
| 03/07/2001 | CN2422292Y Terminal connecting belt structure |
| 03/07/2001 | CN1286734A Printed circuit mfg. process using tin-mickel plating |
| 03/06/2001 | US6197688 Interconnect structure in a semiconductor device and method of formation |
| 03/06/2001 | US6197664 Method for electroplating vias or through holes in substrates having conductors on both sides |
| 03/06/2001 | US6197182 Providing cathode electrode not in physical contact with second region of article, second region is electrically connected to first region; providing non-plating electrically conductive liquid; separating liquid from plating solution |
| 03/06/2001 | US6197171 Pin contact mechanism for plating pin grid arrays |
| 03/06/2001 | US6197170 Ringless-collector conductor roll |
| 03/06/2001 | US6197169 Apparatus and method for electroplating rotogravure cylinder using ultrasonic energy |
| 03/01/2001 | WO2001014618A2 Apparatus and method for electroplating a material layer onto a wafer |
| 03/01/2001 | WO2001014135A1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil |
| 03/01/2001 | DE19939144A1 Process for metallically coating high temperature superconductors comprises galvanically applying copper and a metallic copper sample as anode, and partially covering between the anode and the high temperature superconductor |
| 02/27/2001 | US6195248 Comprising tin and at least one additive metal selected from the group consisting of bismuth, nickel, silver, zinc, and cobalt; lead-free; capacitors |
| 02/27/2001 | US6194777 Leadframes with selective palladium plating |
| 02/27/2001 | US6194087 Composite multilayer bearing material |
| 02/27/2001 | US6194086 Nickel and cobalt superalloy substrate; low pressure plasma spraying of abrasives |
| 02/27/2001 | US6193863 Product conveyance mechanism for electroplating apparatus |
| 02/27/2001 | US6193861 Apparatus and method to enhance hole fill in sub-micron plating |
| 02/27/2001 | US6193860 Method and apparatus for improved copper plating uniformity on a semiconductor wafer using optimized electrical currents |
| 02/27/2001 | US6193859 Electric potential shaping apparatus for holding a semiconductor wafer during electroplating |
| 02/22/2001 | WO2001013416A1 Method and apparatus for depositing and controlling the texture of a thin film |
| 02/22/2001 | WO2001012882A1 Arrangement enabling a liquid to flow evenly around a surface of a sample and use of said arrangement |
| 02/22/2001 | WO2000040779A8 Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece |
| 02/22/2001 | WO2000005747A3 Metallization structures for microelectronic applications and process for forming the structures |
| 02/21/2001 | EP1077484A2 Barrier layer for electroplating processes |
| 02/20/2001 | US6190789 Slide member |
| 02/20/2001 | US6190529 Method for plating gold to bond leads on a semiconductor substrate |
| 02/15/2001 | WO2001011114A1 Method for producing improved cold rolled strip that is capable of being deep drawn or ironed, and cold rolled strip, preferably used for producing cylindrical containers and, in particular, battery containers |
| 02/15/2001 | WO2001011098A2 Copper deposit process |
| 02/15/2001 | DE19937271A1 Verfahren zur Herstellung von tiefzieh- oder abstreckziehfähigem, veredeltem Kaltband, vorzugsweise zur Herstellung von zylindrischen Behältern und insbesondere Batteriebehältern A process for the production of deep-drawing or abstreckziehfähigem, refined cold rolled strip, preferably for the production of cylindrical containers and in particular containers battery |
| 02/15/2001 | CA2381503A1 Copper deposit process |
| 02/14/2001 | EP1076116A1 Components having a partial platinum coating thereon, and preparation thereof |
| 02/14/2001 | EP1075606A1 Multi-layer engine bearings and method of manufacture |
| 02/13/2001 | US6187166 Integrated solution electroplating system and process |
| 02/13/2001 | US6187153 Comparator for monitoring the deposition of an electrically conductive material on a leadframe to warn of improper operation of a leadframe electroplating process |
| 02/13/2001 | US6187152 Multiple station processing chamber and method for depositing and/or removing material on a substrate |
| 02/08/2001 | WO2001009410A1 An improved process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology |
| 02/07/2001 | CN2418137Y Ac.-dc. superpositioned aluminium-foil strip anode oxygenation apparatus |
| 02/07/2001 | CN2418136Y Composite conductive roller for electroplating tin |
| 02/07/2001 | CN1283144A Component of printed circuit boards |
| 02/06/2001 | US6184613 Electrode assembly, cathode device and plating apparatus including a gap configured to eliminate a concentration of a line of electrical force at a boundary between a cathode and plate forming surface of an object |
| 02/06/2001 | US6184587 Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components |
| 02/06/2001 | US6183880 Composite foil of aluminum and copper |
| 02/06/2001 | US6183611 Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrate |
| 02/06/2001 | US6183610 Apparatus for composite plating the inner surface of a cylindrical body |
| 02/06/2001 | US6183607 Anode structure for manufacture of metallic foil |
| 02/01/2001 | WO2001007687A1 Plating method and device, and plating system |
| 02/01/2001 | WO2001007685A2 Method for continuous nickel-plating of an aluminium conductor and corresponding device |
| 01/31/2001 | EP1072176A1 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| 01/31/2001 | CN1281908A Collecting roller and its manufacturing method |
| 01/30/2001 | US6181057 Electrode assembly, cathode device and plating apparatus including an insulating member covering an internal circumferential edge of a cathode member |