| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 01/16/2003 | US20030012885 Horizontally transporting vertically oriented wafers into a process cell; carrier is rotated from a horizontal orientation to a vertical orientation; cathode assembly secures the wafer and couples the wafer to a power source |
| 01/16/2003 | US20030010646 Comprising enhanced brightener concentrations which accelerate the plating rate in recesses and microvias as carrier molecules become incorporated into the plating deposit; computer printed circuits; semiconductors |
| 01/16/2003 | US20030010645 Barrier enhancement process for copper interconnects |
| 01/16/2003 | US20030010644 Apparatus and process for producing zinc oxide film |
| 01/16/2003 | US20030010643 Transporting an article-mounted carrier into a process cell horizontally through an inlet opening, performing a process on said planar article and transporting said carrier horizontally out; automatic processing and plating system |
| 01/16/2003 | US20030010641 An annular conductive support of the substrate having a pin receiving pocket for an electrical contact pin having the part in the pocket brazed; the contact pin adapted to bias electrically the substrate; filling integrated circuits |
| 01/16/2003 | US20030010640 Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process |
| 01/16/2003 | US20030010632 Method for manufacturing a semiconductor device and a plating apparatus and a sputtering apparatus therefor |
| 01/16/2003 | US20030010626 System for plating planar articles |
| 01/16/2003 | US20030010625 Processing cells for wafers and other planar articles |
| 01/16/2003 | US20030010585 Braking member and method of manufacturing same |
| 01/16/2003 | US20030010449 Automatic wafer processing and plating system |
| 01/16/2003 | US20030010406 Carburizing slide surfaces of iron or steel, plating with chromium, and impulsing by shot peening for lubricant retaining cavities; wear resistance |
| 01/15/2003 | CN2530960Y Device for preparing bandy composite conductive material |
| 01/14/2003 | US6506668 Utilization of annealing enhanced or repaired seed layer to improve copper interconnect reliability |
| 01/09/2003 | WO2003002786A1 Electroplating method and printed wiring board manufacturing method |
| 01/09/2003 | US20030008602 Method and apparatus of sealing wafer backside for full-face electrochemical plating |
| 01/09/2003 | US20030008075 ULSI wiring and method of manufacturing the same |
| 01/09/2003 | US20030006135 Plating apparatus and plating method, and method of manufacturing semiconductor device |
| 01/09/2003 | US20030006133 Electroplating apparatus using a non-dissolvable anode and ultrasonic energy |
| 01/09/2003 | DE19937271C2 Verfahren zur Herstellung von tiefzieh- oder abstreckziehfähigem, veredeltem Kaltband, sowie Kaltband, vorzugsweise zur Herstellung von zylindrischen Behältern und insbesondere Batteriebehältern A process for the production of deep-drawing or abstreckziehfähigem, refined cold rolled strip, and cold-rolled strip, preferably for the production of cylindrical containers and in particular containers battery |
| 01/08/2003 | EP1273682A1 Laser hole drilling copper foil |
| 01/08/2003 | EP1272692A1 Electro-plating apparatus and method |
| 01/08/2003 | CN1390268A Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 01/08/2003 | CN1390099A Die manufacturing |
| 01/08/2003 | CN1098376C Collector ringless conductor roll |
| 01/08/2003 | CN1098375C Device for processing flat workpieces in particular printed circuit boards |
| 01/07/2003 | US6503642 Hard-chrome plated layer |
| 01/07/2003 | US6503382 Method of electrodepositing a porous film |
| 01/07/2003 | US6503376 Electroplating apparatus |
| 01/07/2003 | US6503375 Electroplating apparatus using a perforated phosphorus doped consumable anode |
| 01/03/2003 | WO2003001250A1 Method for achieving a mirror surface and mirror with such a mirror surface |
| 01/03/2003 | WO2003000937A2 Heat treatment method for a cold-rolled strip with an ni and/or co surface coating, sheet metal producible by said method and battery can producible by said method |
| 01/02/2003 | US20030003320 Plating film onto an object at a first current density in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. |
| 01/02/2003 | US20030003319 Coated metal wire, wire-reinforced elastomeric article containing the same and method of manufacture |
| 01/02/2003 | US20030000893 For providing substrate such as a semiconductor wafer solution treatment |
| 01/02/2003 | US20030000843 Immersing a planar substrate in an electrolyte that contains the catalytically active metallic; applying an electrical voltage; depositing a layer of catalytically active metallic material by electrochemical deposition on the planar substrate |
| 01/02/2003 | US20030000841 For deposition of a metal layer onto a wafer or other substrate |
| 01/02/2003 | US20030000840 Electroplating apparatus and method |
| 01/02/2003 | US20030000832 Roller assembly for an electroplating apparatus |
| 01/02/2003 | US20030000831 Conducting roller for an electroplating apparatus |
| 01/02/2003 | EP1272017A1 Copper-clad laminated sheet |
| 01/02/2003 | EP1271566A2 Thin-film resistor and method for manufacturing the same |
| 01/02/2003 | EP1270764A1 Surface treated tin-plated steel sheet and chemical treatment solution |
| 01/02/2003 | EP1268881A1 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
| 01/01/2003 | CN1388841A Laser hole drilling copper foil |
| 01/01/2003 | CN1388840A Cathode electrode material and rotating cathode drum for producing electrolytic copper foil using the cathode electrode material |
| 01/01/2003 | CN1097644C Ornament |
| 12/31/2002 | US6500325 Method of plating semiconductor wafer and plated semiconductor wafer |
| 12/31/2002 | US6500324 Process for depositing a layer of material on a substrate |
| 12/27/2002 | WO2002103782A2 Barrier enhancement process for copper interconnects |
| 12/27/2002 | WO2002103457A1 Method for producing a protective hologram |
| 12/27/2002 | WO2002103165A1 Method for forming abrasion-resistant layer for moving blade, abrasion-resistant layer and method for regeneration thereof, and gas turbine |
| 12/27/2002 | WO2002103086A1 Connector wire, and manufacturing method thereof |
| 12/27/2002 | WO2002103085A1 Method and electrode for defining and replicating structures in conducting materials |
| 12/27/2002 | WO2002022321A3 Multiple blade robot adjustment apparatus and associated method |
| 12/27/2002 | CA2462098A1 Method and electrode for defining and replicating structures in conducting materials |
| 12/27/2002 | CA2450654A1 Method of forming abrasion-resistant layer on rotor blade, an abrasion-resistant layer and a method of regenerating the same, and a gas turbine |
| 12/26/2002 | US20020197854 Selective deposition of materials for the fabrication of interconnects and contacts on semiconductor devices |
| 12/26/2002 | US20020197811 Thin-film resistor and method for manufacturing the same |
| 12/26/2002 | US20020197504 Laminated hard Cr plating layer comprising a plurality of hard Cr plating layers laminated on the sliding sliding surface; micro-cracks of each plating layer forming independent micro-pores in the film forming direction |
| 12/26/2002 | US20020195352 Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements |
| 12/26/2002 | US20020195351 Copper electroplating composition for integrated circuit interconnection |
| 12/26/2002 | US20020195347 Process for depositing a layer of material on a substrate and a plating system |
| 12/26/2002 | US20020194716 Modular semiconductor workpiece processing tool |
| 12/25/2002 | CN1387239A Circuit board, semiconductor device mfg. method, and electroplating system |
| 12/24/2002 | US6498097 Apparatus and method of forming preferred orientation-controlled platinum film using oxygen |
| 12/24/2002 | US6497805 Method for shorting pin grid array pins for plating |
| 12/24/2002 | US6497801 Electroplating apparatus with segmented anode array |
| 12/24/2002 | US6497800 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
| 12/24/2002 | US6497164 Ultrasonic vibration cutting tool and production method thereof |
| 12/19/2002 | US20020192503 Thin film magnetic head and method of fabricating the head |
| 12/19/2002 | US20020192492 Protective coating of tin/tin alloy having an outer surface doped for wisker-growth inhibition; e.g., gold or palladium dopes; used as an electrical connector or lead frame for integrated circuits; solderability; corrosion resistance |
| 12/18/2002 | EP1266546A1 Treatment of circuit supports with impulse excitation |
| 12/18/2002 | EP1266052A1 Electro-plating apparatus and a method of electro-plating |
| 12/18/2002 | CN1386146A Electrolytic copper-plated R-T-B magnet and method thereof |
| 12/18/2002 | CN1386044A Roughened copper foil and making method thereof |
| 12/17/2002 | US6495018 A single delivery channel is formed by, and between, inner wall 2 and baffle 3. electrolyte 5 is pumped up the interior of channel 1 and is directed onto substrate 4 being a cathode maintained at -10 volts. the upper part of the inner wall 2 of |
| 12/17/2002 | US6495007 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplaces |
| 12/17/2002 | US6495005 Electroplating apparatus |
| 12/17/2002 | US6495004 Substrate plating apparatus |
| 12/17/2002 | US6495001 For the production of electrical contact components, by applying a film of tin or tin alloy to a strip of electroconductive base material, and subsequently depositing a silver film |
| 12/12/2002 | WO2002100136A1 Composite copper foil with copper or copper alloy support body, and printed circuit board using the composite copper foil |
| 12/12/2002 | WO2002068727A3 Copper-plating solution, plating method and plating apparatus |
| 12/12/2002 | US20020187599 Process and manufacturing tool architecture for use in the manufacture of one or more protected metallization structures on a workpiece |
| 12/12/2002 | US20020187364 Electrodeposition; electronics |
| 12/12/2002 | US20020185716 Metal article coated with multilayer finish inhibiting whisker growth |
| 12/12/2002 | US20020185371 Electroplating apparatus with conducting nets for distributing evenly anode current |
| 12/12/2002 | US20020185065 Electrolyte-spraying casing for an electroplating apparatus |
| 12/11/2002 | EP1264009A2 Method for applying a metal layer to a light metal surface |
| 12/11/2002 | CN1384782A Treated copper foil and process for making treated copper foil |
| 12/11/2002 | CN1095882C Electrolytic treating device for plate-like workpieces, in particular print circuit boards |
| 12/10/2002 | US6492262 Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies |
| 12/10/2002 | US6492039 Composite multilayer material for plain bearings |
| 12/10/2002 | US6491806 Electroplating bath composition |
| 12/10/2002 | CA2233703C Continuous casting mold and method of making same |
| 12/05/2002 | WO2002098194A1 Copper plated circuit layer-carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer-carrying copper clad laminated sheet |
| 12/05/2002 | WO2002097165A2 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 12/05/2002 | US20020182434 Copper clad laminate with copper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with copper-plated circuit layer |
| 12/05/2002 | US20020182432 Laser hole drilling copper foil |