| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 07/10/2002 | CN1358409A Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 07/10/2002 | CN1358408A Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 07/10/2002 | CN1358407A Surface treated copper foil and method for preparing the same and copper-cload laminate using the same |
| 07/09/2002 | US6416647 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 07/09/2002 | CA2041121C High speed electroplating of tinplate |
| 07/04/2002 | WO2002052116A1 Method for producing at least two types of handles made of plastic material with different surfaces |
| 07/04/2002 | WO2002015245A3 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 07/04/2002 | US20020084193 Contacting a metal seed layer with a copper colloid composition including a minor amount of ionizable palladium compound |
| 07/04/2002 | US20020084192 Depositing a phosphorus doped seed layer on a conductive substrate, and then depositing a conductive metal layer on the phosphorus doped seed layer to form a conductive film. |
| 07/04/2002 | US20020084191 Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same |
| 07/04/2002 | US20020084190 Method and arrangement for the galvanic deposition of nickel, cobalt, nickel alloys or cobalt alloys with periodic current pulses |
| 07/04/2002 | US20020084189 Immersing the plating surface into an electrolyte solution and mechanically enhancing the concentration of metal ions in the electrolyte solution in the features, especially by mechanical vibration |
| 07/04/2002 | US20020084183 Apparatus and method for electrochemically processing a microelectronic workpiece |
| 07/03/2002 | EP1219729A1 Electrolytic copper plating solution and method for controlling the same |
| 07/03/2002 | EP1218937A2 Novel chip interconnect and packaging deposition methods and structures |
| 07/03/2002 | EP1218569A1 Galvanizing solution for the galvanic deposition of copper |
| 07/03/2002 | EP0975826B1 Method for electroplating metallic and non-metallic endless products and device for carrying out said method |
| 07/03/2002 | CN1356407A Process for plating Cr on iner cavity of cylinder sleeve |
| 07/02/2002 | US6413584 Electrodepositing platinum on a nickel superalloy, vapor depositing aluminum to form aluminide, and allowing interdiffusion; improved durability |
| 07/02/2002 | US6413405 Active carbon electro-deposited with Ag-I system having sterilizing effect |
| 07/02/2002 | US6413404 Method of forming bumps by electroplating |
| 07/02/2002 | US6413403 Controlling electrolyte flow and distribution of electric, magnetic or electromagnetic field; depositing, removing, polishing, and/or modifying conductive material; uniformity; chemical mechanical polishing |
| 07/02/2002 | US6413390 Plating system with remote secondary anode for semiconductor manufacturing |
| 07/02/2002 | US6413388 Pad designs and structures for a versatile materials processing apparatus |
| 07/02/2002 | US6413271 Method of making a radioactive stent |
| 06/27/2002 | WO2002050336A2 Integrated mutli-step gap fill and all feature planarization for conductive materials |
| 06/27/2002 | WO2002049773A1 Bond enhancement antitarnish coatings |
| 06/27/2002 | US20020080588 Probe card assembly and kit, and methods of making same |
| 06/27/2002 | US20020079232 Seed layer deposition |
| 06/27/2002 | US20020079230 Method and apparatus for controlling thickness uniformity of electroplated layer |
| 06/27/2002 | US20020079229 Anode inserted in a hole of a work, and a member for rotating the work about its center axis and supplying a plating current; plating a ring shaped bonded magnet |
| 06/27/2002 | US20020079228 Rectifiers that pulse direct current several hundred times per second in order to repeatedly and intermittently establish an electric field between a supply of plating material and the gravure cylinder |
| 06/27/2002 | US20020079215 Workpiece processor having processing chamber with improved processing fluid flow |
| 06/27/2002 | US20020079133 Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same |
| 06/27/2002 | DE10111803A1 Arrangement for contacting a semiconductor substrate comprises a substrate, a conducting layer, a conducting layer arranged on the conducting layer, and a contact needle inserted through the insulating layer up to the conducting layer |
| 06/26/2002 | EP1217102A2 Plating apparatus and method of managing plating liquid composition |
| 06/26/2002 | EP1216486A1 Methods and apparatus for treating seed layer in copper interconnections |
| 06/25/2002 | USRE37765 Pretreating the material with a carbon black dispersion followed by a graphite dispersion before the electroplating step. |
| 06/25/2002 | US6410985 Silver metallization by damascene method |
| 06/25/2002 | US6410178 Separator of fuel cell and method for producing same |
| 06/25/2002 | US6410098 Process for preparing copper-film-plated steel cord for vehicle tire |
| 06/25/2002 | US6409904 Method and apparatus for depositing and controlling the texture of a thin film |
| 06/25/2002 | US6409903 Multi-step potentiostatic/galvanostatic plating control |
| 06/25/2002 | US6409892 Reactor vessel having improved cup, anode, and conductor assembly |
| 06/20/2002 | WO2002049077A2 Barrier layer for electrical connectors and methods of applying the layer |
| 06/20/2002 | US20020076515 Heat resistant resin film with metal thin film, manufacturing method of the resin film, endless belt, manufacturing method of the belt, and image forming apparatus |
| 06/20/2002 | US20020074662 Substrate for manufacturing a semiconductor device with three element alloy |
| 06/20/2002 | US20020074242 Via removal of oxidized metal from the seed layers prior to metallization; electronics; integrated circuits |
| 06/20/2002 | US20020074234 Immersing the wafer, under bias, in a plating solution at forward current density of 10-30 mA/cm2 and a duration of 2-60 seconds followed by reverse current and bulk fill plating |
| 06/20/2002 | US20020074233 Altering the structure of each deposited copper layer by annealing |
| 06/20/2002 | US20020074231 Bottom-up fill of recesses increasing the rotation speed of a substrate and contacting with a soluble copper salt and electrolyte until a desired thickness is achieved |
| 06/19/2002 | EP1214739A2 Copper deposit process |
| 06/19/2002 | EP1214191A1 Treated copper foil and process for making treated copper foil |
| 06/19/2002 | CN2495660Y Electroforming cell for continuous prodn. of foamed nickel |
| 06/19/2002 | CN1354588A Honeycomb telephone shell |
| 06/18/2002 | US6406609 Semiconductor wafers, dielectric layers and copper |
| 06/13/2002 | WO2002047139A2 Methode of forming a copper film on a substrate |
| 06/13/2002 | WO2002045476A2 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| 06/13/2002 | WO2000045625A3 Method for the direct electroplating of through-holes in printed circuit boards |
| 06/13/2002 | US20020072335 Cellular phone housing |
| 06/13/2002 | US20020071961 Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components |
| 06/13/2002 | US20020071207 Thin film magnetic head having gap layer made of nip and method of manufacturing the same |
| 06/13/2002 | US20020070434 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication |
| 06/13/2002 | US20020070126 Polishing method, polishing apparatus, plating method, and plating apparatus |
| 06/12/2002 | EP1213372A2 Process and arrangement for the galvanic deposition of nickel, cobalt, nickel alloys or cobalt alloys with periodic current pulses and use of the process |
| 06/12/2002 | EP0716240B1 Sliding bearing |
| 06/12/2002 | CN1353779A System for electrochemically processing workpiece |
| 06/12/2002 | CN1353778A Workpiece processor having processing chamber with improved processing fluid flow |
| 06/11/2002 | US6403234 Plated material for connectors |
| 06/11/2002 | US6402925 Prevent accumulation by polishing |
| 06/11/2002 | US6402923 Using electrochemical reactors; activating shield |
| 06/11/2002 | US6402922 Pulse plating |
| 06/11/2002 | US6402909 Plating system with shielded secondary anode for semiconductor manufacturing |
| 06/06/2002 | US20020068438 Method for fabricating semiconductor devices |
| 06/06/2002 | US20020067181 Probe card assembly and kit, and methods of making same |
| 06/06/2002 | US20020066673 Method for plating copper conductors and devices formed |
| 06/06/2002 | US20020066665 Cup - type plating apparatus |
| 06/06/2002 | US20020066664 Method and apparatus for supplying electricity uniformly to a workpiece |
| 06/06/2002 | DE10049113A1 Badvorrichtung für Tiefdruckzylinder Badvorrichtung for gravure cylinders |
| 06/05/2002 | EP1211011A1 Solder coating material and production method therefor |
| 06/04/2002 | US6400491 Fast-switching reversible electrochemical mirror (REM) |
| 06/04/2002 | US6400037 Method of marking on metallic layer, metallic layer with marks thereon and semiconductor device having the metallic layer |
| 06/04/2002 | US6399479 Processes to improve electroplating fill |
| 06/04/2002 | US6399220 Conformable nickel coating and process for coating an article with a conformable nickel coating |
| 06/04/2002 | US6399150 Rare earth metal-based permanent magnet, and process for producing the same |
| 06/04/2002 | US6398935 Method for manufacturing pcb's |
| 06/04/2002 | US6398926 Electroplating apparatus and method of using the same |
| 05/30/2002 | WO2002006884A3 Fast-switching reversible electrochemical mirror (rem) |
| 05/30/2002 | WO2001032951A9 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates |
| 05/30/2002 | US20020064729 Selective electroplating method employing annular edge ring cathode electrode contact |
| 05/30/2002 | US20020064677 Electric connector |
| 05/30/2002 | US20020064591 Substrate plating method and apparatus |
| 05/30/2002 | US20020064019 Cathode electrode material and rotating cathode drum for electrolytic copper foil production using the same |
| 05/30/2002 | US20020063097 For forming an interconnection by embedding copper in fine interconnection groove defined in surface of semiconductor substrate through copper sulfate plating |
| 05/30/2002 | US20020063064 Connecting electronically resistive substrate to a negative terminal of electrical power source; disposing substrate and an anode in solution comprising metal compound and supporting electrolyte; electrodepositing metal onto substrate |
| 05/30/2002 | US20020063063 Non-cyanide-type gold-tin alloy plating bath |
| 05/30/2002 | US20020063062 Depositing a copper seed layer over dielectric layer and into etched features of dielectric layer having a barrier layer; treating copper seed layer to remove oxidized layer from over copper seed layer; electroplating copper fill layer |
| 05/29/2002 | EP0956600B1 PREPARATION OF Cu x In y Ga z Se n (x=0-2, y=0-2, z=0-2, n=0-3) PRECURSOR FILMS BY ELECTRODEPOSITION FOR FABRICATING HIGH EFFICIENCY SOLAR CELLS |
| 05/29/2002 | CN1351531A Method and apparatus for plating and polishing a semiconductor substrate |
| 05/29/2002 | CN1351530A Method and apparatus for deposition on and polishing of a semiconductor surface |