| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 02/13/2002 | EP1179615A2 Method for electrochemically treating articles and apparatus and method for cleaning articles |
| 02/13/2002 | EP1179612A1 Cathode for electrolytic cells |
| 02/13/2002 | CN1335898A Electrolytic copper foil with carrier foil and method for manufacturing the same |
| 02/13/2002 | CN1335419A Electroplating method using with combination of electroplating liquid vibrating flow and pulse type electroplating current |
| 02/13/2002 | CN1335418A Electronic element, method for producing electronic element and circuit board |
| 02/07/2002 | US20020015856 Bearing material |
| 02/07/2002 | US20020015782 Multi-purpose finish for printed wiring boards and method of manufacture of such boards |
| 02/07/2002 | US20020014289 Physical vapor deposition targets |
| 02/07/2002 | US20020014255 Disposing an array of dedicated cells which includes an array of electrochemical processing cells; moving tubings relative to the array of dedicated cells, disposing electrolytic fluid in electrode chamber, performing electrolysis |
| 02/06/2002 | EP1178128A1 Method of forming chromium coated copper for printed circuit boards |
| 02/06/2002 | EP0840654A4 Manufacturing particles and articles having engineered properties |
| 02/06/2002 | CN1335045A Process for depositing conducting layer on substrate |
| 02/05/2002 | US6344129 Method for plating copper conductors and devices formed |
| 02/05/2002 | US6344126 Electroplating apparatus and method |
| 02/05/2002 | US6344125 Deposits metal in a pattern that is either the duplicate of a first conductive pattern under the dielectric or the inverse image of the first conductive pattern, depending on the first conductive pattern shape. |
| 02/05/2002 | US6343793 Dual channel rotary union |
| 02/01/2002 | CA2314783A1 A method of making a high reflectivity micro mirror and a micro mirror |
| 01/31/2002 | WO2001050505A3 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 01/31/2002 | US20020011673 Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies |
| 01/31/2002 | US20020011421 Reactive ion etching of an article having polymeric surface layer and metallic features by exposing to plasma reactive with the polymer while applying voltage adjacent to metallic features; semiconductors |
| 01/31/2002 | US20020011419 Electrodeposition bath is formed of metal and the inside of the tank is kept electrically floating; which can form a uniform zinc oxide film on the substrate (stainless steel, alloys) |
| 01/31/2002 | US20020011417 Method and apparatus for plating and polishing a semiconductor substrate |
| 01/31/2002 | US20020011416 Plating solution is mixture od copper salt and polyether |
| 01/31/2002 | US20020011415 Positioning electroconductive substrate in a chamber containing electrochemical bath, applying a plating bias to the substrate while immersing into bath, and depositing third conductive material in situ to fill; pulsation |
| 01/31/2002 | US20020011414 Bearing having multilayer overlay and method of manufacture |
| 01/30/2002 | EP1176000A1 Carrier foil-pasted metal foil and production method thereof |
| 01/30/2002 | CN1333389A Electroplating device |
| 01/29/2002 | US6342308 Copper foil bonding for printed circuits |
| 01/29/2002 | US6342137 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| 01/29/2002 | US6341998 Integrated circuit (IC) plating deposition system and method |
| 01/24/2002 | WO2002006884A2 Fast-switching reversible electrochemical mirror (rem) |
| 01/24/2002 | US20020009872 Fabrication process of a semiconductor device including a CVD process of a metal film |
| 01/24/2002 | US20020008236 Electronic device, and method of patterning a first layer |
| 01/24/2002 | US20020008037 System for electrochemically processing a workpiece |
| 01/24/2002 | US20020008036 Multilayer; substrates, barrier on anode rod in tube, cyliner walls |
| 01/24/2002 | US20020008034 Using alkaline electrolyte bath; uniform overcoatings |
| 01/24/2002 | US20020008026 Cathode cartridge of testing device for electroplating and testing device for electroplating |
| 01/24/2002 | DE10033934A1 Galvanic formation of conducting structures of highly pure copper on semiconductor substrates used in the production of integrated circuits uses a copper bath contains a copper ion source, and an additive compound |
| 01/24/2002 | CA2416540A1 Fast-switching reversible electrochemical mirror (rem) |
| 01/23/2002 | EP1174912A1 Semiconductor wafer processing apparatus and processing method |
| 01/22/2002 | US6340422 Method for electroplating metallic and non-metallic endless products and device for carrying out said method |
| 01/17/2002 | WO2002004715A2 Deposition uniformity control for electroplating apparatus, and associated method |
| 01/17/2002 | WO2002004714A1 Electrolytic copper-plated r-t-b magnet and plating method thereof |
| 01/17/2002 | WO2002004712A2 Flow diffuser to be used in electro-chemical plating system |
| 01/17/2002 | WO2002004711A2 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 01/17/2002 | WO2002004704A2 Method and apparatus for patching electrochemically deposited layers using electroless deposited materials |
| 01/17/2002 | WO2001032951A3 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates |
| 01/17/2002 | WO2001020647A3 Novel chip interconnect and packaging deposition methods and structures |
| 01/17/2002 | US20020005359 Connecting multilayers; fine grooves |
| 01/17/2002 | DE10061186C1 Electroplating of nickel, cobalt, and their alloys onto rocket engine components, uses differing current densities and pulsed charge ratios at anode and cathode |
| 01/16/2002 | EP1171304A1 Improved gravure printing rollers |
| 01/16/2002 | EP1171239A1 Method for producing a catalyst |
| 01/16/2002 | EP1171238A1 Method for producing a catalyst by means of electrodeposition |
| 01/10/2002 | US20020004320 Attaratus for socketably receiving interconnection elements of an electronic component |
| 01/10/2002 | US20020003084 Cathode current control system for a wafer electroplating apparatus |
| 01/09/2002 | EP1170402A1 Coated anode system |
| 01/09/2002 | EP1170400A1 Electrolytic copper foil with carrier foil and method for manufacturing the same |
| 01/09/2002 | EP1169162A1 Method and apparatus for plating and polishing a semiconductor substrate |
| 01/09/2002 | CN1330726A Steel wire with bright looking surface |
| 01/08/2002 | US6337145 Electroplating on overlay of lead-tin-copper from a ternary fluoroborate-free electroplating bath without brighteners and with non-ionic wetting agent and free alkyl sulfonic acid; heat treating galvanic overlay |
| 01/08/2002 | US6336269 Method of fabricating an interconnection element |
| 01/03/2002 | WO2002001610A2 Apparatus and method for electro chemical deposition |
| 01/03/2002 | WO2001041191A3 Method and apparatus for forming an oxidized structure on a microelectronic workpiece |
| 01/03/2002 | WO2000061837A9 Workpiece processor having processing chamber with improved processing fluid flow |
| 01/03/2002 | US20020001712 Electronic component, method for producing electronic component, and circuit board |
| 01/03/2002 | US20020000383 Placing the substrate surface within an enclosure, introducing liquid material into enclosure, and directing the liquid angularly toward substrate surface flowing rotationally upon contact; semiconductors |
| 01/03/2002 | US20020000382 Contacting metal seed layer on substrate with acidic electrolyte bath containing acids, copper compounds, suppressors and water, then subjecting to current |
| 01/03/2002 | US20020000381 Process for galvanic depositing of a dispersion layer on a work piece surface |
| 01/03/2002 | US20020000380 Electroplating solution provides ions or complex of noble metals for electroplating the surface of the workpiece; semiconductor wafers; integrated circuits |
| 01/03/2002 | US20020000379 Electroplating apparatus and electroplating method |
| 01/03/2002 | US20020000378 Electroplating solution containing tin compounds and lead compounds, methane sulfonic acid, water, and an organic additive; used for soldering |
| 01/03/2002 | US20020000372 Dry contact assemblies, methods for making dry contact assemblies, and plating machines with dry contact assemblies for plating microelectronic workpieces |
| 01/03/2002 | US20020000271 Filling recessed microstructures on semiconductor surface with copper metallization; particle sizes; annealing; electroplating; robotics |
| 01/02/2002 | EP1167583A2 Copper-plating liquid, plating method and plating apparatus |
| 01/02/2002 | EP1167582A1 Metal alloy compositions and plating method related thereto |
| 01/02/2002 | EP1165863A1 Method of manufacturing of copper tubes with their internal surface tin plated by electrolysis |
| 01/02/2002 | EP1042092A4 Component of printed circuit boards |
| 01/02/2002 | CN1329681A Method and apparatus for electrochemical mechanical deposition |
| 01/01/2002 | US6335107 Useful as an electrical connector |
| 01/01/2002 | US6334943 Electroplating installation, electrode and support device for this installation and electroplating process |
| 01/01/2002 | US6334942 Providing resist on support so as to leave openings where metallic features are to be formed, depositing principal metal in openings, removing resist immediately adjacent metal, forming gaps, depositing cover metal |
| 01/01/2002 | US6334937 Apparatus for high deposition rate solder electroplating on a microelectronic workpiece |
| 12/27/2001 | US20010054905 Probe card assembly and kit |
| 12/27/2001 | US20010054558 Formation of voids in the via plug is suppressed; particularly high reliability. |
| 12/26/2001 | CN1328434A Method for producing prosthetic moulded parts for dental use and prosthetic moulded part |
| 12/25/2001 | US6333560 Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies |
| 12/25/2001 | US6332963 Cup-type plating apparatus and method for plating wafer using the same |
| 12/20/2001 | WO2001096632A2 A method and apparatus for conditioning electrochemical baths in plating technology |
| 12/20/2001 | WO2001038748A3 Sliding bearing having multilayer lead-free overplate and method of manufacture |
| 12/20/2001 | US20010052465 Electrolyte cell configured to receive a substrate to have a metal film deposited thereon; a porous, rigid diffuser positioned between where the substrate is to be and the anode; uniform coating; pressure removes bubbles |
| 12/20/2001 | US20010052464 For electrodeposition, etching, or polishing uniformily; retaining semiconductor substrates on moving cathode immersed in reaction solution wherein a wire mesh anodes rotates about the moving cathode during electrochemical reaction |
| 12/20/2001 | US20010052457 Electroplating reactor including back-side electrical contact apparatus |
| 12/20/2001 | DE10051140A1 Method of forming cylindrical elevations on surface of substrate for integrated circuits, involves filling openings formed in screening material with pure copper or with high-melting point metal by galvanizing |
| 12/20/2001 | DE10028192A1 Device used for sealing piston pin bores of cylinders used in combustion engines comprises a longitudinal cylindrical sealing element with a diameter which enlarges after insertion |
| 12/19/2001 | EP1164209A2 Cathode cartridge of testing device for electroplating and testing device for electroplating |
| 12/19/2001 | EP1164208A2 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse |
| 12/19/2001 | CN2466167Y Rim electroplating device |
| 12/18/2001 | US6331237 Method of improving contact reliability for electroplating |
| 12/13/2001 | WO2001039250A3 Conductive interconnection |
| 12/13/2001 | US20010050233 Method for enhancing the uniformity of electrodeposition or electroetching |