C25D 7 - Electroplating characterised by the article coated

Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
12/2002
12/05/2002	US20020179450 Selective shield/material flow mechanism
12/05/2002	US20020179437 Conducting roller assembly for an electroplating apparatus
12/05/2002	US20020179436 Distributed power supplies for microelectronic workpiece processing tools
12/04/2002	EP1262782A2 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
12/04/2002	EP1261759A1 Method for anodising the metallic inner surfaces of a capillar cavity
12/04/2002	EP1114207B1 Pellistor
12/03/2002	US6489035 Printed circuit boards; copper surface stabilization with layer of zinc oxide, chromium oxide or nickel oxide; vapor deposition metal, alloy, nitride, silicide or oxide electrical resistance material
12/03/2002	US6489034 Stabilizing copper surface with layer of zinc oxide, chromium oxide or nickel oxide; vapor depositing aluminum, nickel, chromium, copper, iron, indium, zinc, tantalum, vanadium, tin, tungsten, zirconium and/or molybdenum
12/03/2002	US6489014 Wiring board
11/2002
11/28/2002	US20020177305 Process of manufacturing semiconductor device
11/28/2002	US20020177006 Structure having flush circuitry features and method of making
11/28/2002	US20020176996 Method of electroplating
11/28/2002	US20020175419 Electropolishing metal layers on wafers having trenches or vias with dummy structures
11/28/2002	US20020175331 Structure and method for mounting a semiconductor element
11/28/2002	US20020175080 Plating a wafer by exposing to a first solution of a sulfur depolarizing compound to brighten and level; exposing to a metal compound solution, applying a current; elimination of depletion/monitoring of additives and defects (bumps)
11/28/2002	US20020175071 Copper interconnect seed layer treatment methods and apparatuses for treating the same
11/28/2002	US20020174742 Lightweight bearing and wave gear drive
11/27/2002	EP1261021A2 Method of production of circuit board, semiconductor device, and plating system
11/27/2002	EP1259661A1 Pad designs and structures for a versatile materials processing apparatus
11/27/2002	CN2522432Y Copper wire silver-electroplating tank
11/27/2002	CN1382306A Copper deposit process
11/27/2002	CN1382232A Method and device for electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
11/27/2002	CN1382231A Method and device for electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on surface of electrically insulating film materials and use of
11/27/2002	CN1094995C Method for electroplating alloy powder for H-Ni battery and its apparatus
11/26/2002	US6486533 Metallization structures for microelectronic applications and process for forming the structures
11/26/2002	US6485627 Method and apparatus for electroplating
11/21/2002	WO2002092242A1 Selective deposition of materials for the fabrication of interconnects and contacts on semiconductors devices
11/21/2002	US20020172808 Gas turbine airfoil protected by aluminide and platinum aluminide coatings, and its preparation
11/21/2002	US20020172535 Developing apparatus
11/21/2002	US20020170827 Electrodeposition layer is formed by circular oscillation electroplating on the inside wall surface of the hole and on the predetermined surface of the insulation resin layer
11/21/2002	US20020170173 Method of production of circuit board, semiconductor device, and plating system
11/20/2002	EP1257694A2 Conditioning of through holes and glass
11/20/2002	EP1257693A1 Composite copper foil and manufacturing method thereof
11/20/2002	CN1094526C Method for straightening warp of steel strip in electroplating line
11/20/2002	CN1094525C Device for electro-depositing of metal or alloy coating on one or both sides of metal strip
11/19/2002	US6482336 Non-lambertian glass diffuser and method of making
11/19/2002	US6482307 Applying potentials
11/19/2002	US6482302 Container-shaped physical vapor deposition targets
11/19/2002	US6482300 Cup shaped plating apparatus with a disc shaped stirring device having an opening in the center thereof
11/14/2002	WO2002090816A1 Multi-layer coated tube and method of manufacturing the coated tube
11/14/2002	WO2002090624A2 A process and apparatus for cleaning and/or coating metal surfaces
11/14/2002	US20020166773 Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings
11/14/2002	US20020166575 Solution processing apparatus and solution processing method
11/14/2002	DE10121937A1 Tensioning device used for engraved cylinders comprises holders with recesses for receiving one end of a cylinder arranged on a common axis
11/13/2002	EP1257004A1 Metal article with multilayer coating
11/13/2002	EP1256981A1 Metal article coated with near-surface doped tin or tin alloy
11/12/2002	US6478944 Functional Sn-Bi alloy plating using a substitute material for Pb
11/12/2002	US6478937 Substrate holder system with substrate extension apparatus and associated method
11/12/2002	US6478936 Anode assembly for plating and planarizing a conductive layer
11/12/2002	US6478935 Semiconductor device plating apparatus
11/07/2002	WO2002088592A1 Multi-layer coating tube and production method therefor
11/07/2002	WO2002088431A1 Anode assembly and process for supplying electrolyte to a planar substrate surface
11/07/2002	US20020163770 Supercapacitors and method for fabricating the same
11/07/2002	US20020163086 Semiconductor device and manufacturing method thereof
11/07/2002	US20020162751 Cleaning and activating workpiece; exposing to a galvanic chrome plating bath to formhard chromium plating having a pearl or columnar structure type surface, and filling in and smoothing surface with galvanically applied silver layer
11/07/2002	US20020162750 Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs
11/07/2002	DE10121966A1 Verfahren und Vorrichtung zum Verschieben von auf Kontaktbalken hängenden Metall-Anodenplatten oder Metall-Anodenstäben in Elektrolyttanks Method and apparatus for moving contact bars hanging on metal anode plates or metal anode rods in electrolyte tanks
11/07/2002	DE10121593A1 Verfahren zur Beschichtung von Werkstücken mit einem Lagermetall A method of coating workpieces with a bearing metal
11/06/2002	EP1254974A1 Method and apparatus for shifting of metal anode plates or bars hanging on contact beams
11/06/2002	EP1254973A1 Method of coating of workpieces with a bearing metal
11/05/2002	US6476333 Raised contact structures (solder columns)
11/05/2002	US6475646 Electrocleaning, electropolishing, removing inclusions, rinsing, and forming multi-plated layers on the surface of a thin plate
11/05/2002	US6475640 A brass coated metallic wire for use as a reinforcing component in an elastomeric article, such as a motor vehicle tire.
11/05/2002	US6475638 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof
11/05/2002	US6475369 Method for electrochemical fabrication
11/05/2002	US6475367 Electrodeposition method
11/05/2002	US6475357 Inflatable compliant bladder assembly
11/05/2002	US6475321 Method of manufacturing electrode substrate
10/2002
10/31/2002	WO2002086961A1 Electropolishing metal layers on wafers having trenches or vias with dummy structures
10/31/2002	US20020157960 Electro-chemical deposition cell for face-up processing of single semiconductor substrates
10/31/2002	US20020157959 Process for electroplating a work piece coated with an electrically conducting polymer
10/31/2002	US20020157957 Adding water insoluble inorganic or organic fine particles to a metal plating bath by dispersing the fine particles in a watery medium with the help of an aromatic azo surfactant, effecting electrolysis to form composite plating film
10/31/2002	US20020157610 Method for forming a copper thin film
10/30/2002	EP1253220A1 Sliding member
10/30/2002	EP1252650A1 Substrate processing apparatus
10/30/2002	CN1376625A Surface treatment device
10/30/2002	CN1376624A Surface treatment device
10/29/2002	US6472086 Multilayer; steel support; alloy overcoating; lead-free
10/29/2002	US6471848 Uniformly forming such as zinc oxide film on stainless steel beltlike plate suitable for reflective layer of solar cells by preventing drying along transporting path using a water rinse
10/24/2002	WO2002084714A2 Method and apparatus for electrochemically depositing a material onto a workpiece surface
10/24/2002	WO2002083995A1 Method of and apparatus for controlling fluid flow
10/24/2002	WO2002083968A2 Coated article having a stainless steel color
10/24/2002	US20020153913 Probe for the probe card
10/24/2002	US20020153596 Lead frame and semiconductor package formed using it
10/24/2002	US20020153260 For use in electroplating printed circuit boards and other electronic packaging devices
10/24/2002	US20020153256 Method and apparatus for depositing and controlling the texture of a thin film
10/24/2002	US20020153210 Plated wear surface for alloy components and methods of manufacturing the same
10/24/2002	US20020152603 Method of manufacturing honeycomb extrusion die and die manufactured according to this method
10/24/2002	CA2410450A1 Coated article having a stainless steel color
10/23/2002	CN1376216A An improved process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology
10/23/2002	CN1376214A Method for electrodeposition of emtallic multilayers
10/23/2002	CN1093179C Foil with controlled properties for printed circuit board and procedures and electrolyte bath solutions for preparing same
10/22/2002	US6469386 Lead frame and method for plating the same
10/22/2002	US6467213 Method of providing a weapon barrel with an internal hard chromium layer
10/17/2002	WO2002081783A1 Workpiece wet processing
10/17/2002	WO2002081782A1 Back-end metallisation process
10/17/2002	US20020150797 Heterocyclic compound produced by the condensation of a 5- or 6-membered ring with a 5- to 7-membered ring; can emit light having a high color purity at a low driving voltage, a high luminescence and a high efficiency
10/17/2002	US20020149090 Lead frame and semiconductor package
10/17/2002	US20020148732 Method and apparatus for electrochemically depositing a material onto a workpiece surface
10/16/2002	EP1249861A2 A multi-step method for metal deposition

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