| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 10/16/2002 | EP1249518A1 Use of substantially oxygen-free, dendritic and uncoated copper for galvanic plating of printing cylinders |
| 10/16/2002 | EP1249517A1 Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating |
| 10/16/2002 | EP0729652B1 Method for fabricating a contact structure for interconnections, interposer, semiconductor assembly |
| 10/16/2002 | CN1374827A Multilayer base plate with holes for assembly and its producing method |
| 10/15/2002 | US6465354 Method of improving the planarization of wiring by CMP |
| 10/10/2002 | WO2002078903A2 Method and apparatus for avoiding particle accumulation during an electrochemical process |
| 10/10/2002 | WO2002031218A3 Sputter targets |
| 10/10/2002 | US20020144910 Method for preventing the thermal oxidation yellowing of tin-plated wires |
| 10/10/2002 | US20020144909 Palladium plating solution |
| 10/10/2002 | US20020144908 Back-end metallisation process |
| 10/10/2002 | US20020144900 Anodizing foil in first electrolyte solution, passing foil through oven, anodizing foil in second anodizing solution wherein first and second electrolyte solutions each comprise glycerine, ammonium phosphate, and de-ionized water |
| 10/10/2002 | US20020144894 Processing apparatus including a reactor for electrochemically etching a microelectronic workpiece |
| 10/10/2002 | US20020144753 Rare earth metal-based permanent magnet, and process for producing the same |
| 10/09/2002 | EP1247298A2 Electronic device and method using crystalline, conductive regions and amorphous, insulating regions of a layer |
| 10/09/2002 | EP1194616A4 Copper replenishment technique for precision copper plating system |
| 10/08/2002 | US6461494 Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot |
| 10/03/2002 | WO2002077328A1 Phosphate film processing method and phosphate film processing device |
| 10/03/2002 | WO2002077327A2 Mask plate design |
| 10/03/2002 | WO2001083854A3 Electroplating bath composition and method of using |
| 10/03/2002 | US20020139686 Conditioning with a cationic conditioning agent and an anionic dispersing agent and a binder, coating with a conductive carbon, electroplating and soldering |
| 10/03/2002 | US20020139685 Continuous nickel plating process for an aluminum conductor and corresponding device |
| 10/03/2002 | US20020139684 Pump for supplying plating fluid from the reservoir tank to the closed plating cup cyclically changes the pressure or flow rate of the plating fluid to prevent air bubbles in the blind holes of the plating member |
| 10/03/2002 | US20020139683 Using an insoluble anode and particularly a substrate plating apparatus capable of easily and automatically supplying metal ions; uniform primary current distribution between the cathode and anode; no particles produced from black film |
| 10/03/2002 | US20020139682 Applying a reverse bias that will cause removal of, or reduction in the size of, conductive particles on the work-piece-surface-influencing device; brushes rotating in a different direction during electrodeposition; wafers/circuits |
| 10/03/2002 | US20020139681 Automated brush plating process for solid oxide fuel cells |
| 10/03/2002 | US20020139680 Abrasive particles are adhered to a bonding material so as to have a predetermined distribution over the coated substrate; electroplating a metal layer to the bonding material to fix the predetermined spacing and concentration of particles |
| 10/03/2002 | US20020139663 Chemical treatment system |
| 10/02/2002 | EP1245038A2 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 10/02/2002 | EP0765953B1 Strip treating apparatus |
| 09/26/2002 | WO2002075797A2 Method of forming copper interconnects |
| 09/26/2002 | WO2002075792A2 Method of sealing wafer backside for full-face electronchemical plating |
| 09/26/2002 | WO2002049077A3 Barrier layer for electrical connectors and methods of applying the layer |
| 09/26/2002 | US20020135972 Electronic parts, and process for manufacturing electronic parts |
| 09/26/2002 | US20020134686 Method for the formation of copper wiring films |
| 09/26/2002 | US20020134684 Seed layer processes |
| 09/25/2002 | EP1243672A1 Plating device and plating method |
| 09/25/2002 | CN1371432A Copper replenishment technique for precision copper plating system |
| 09/24/2002 | US6455418 Barrier for copper metallization |
| 09/24/2002 | US6454928 Tin-plating which includes gallium and copper |
| 09/24/2002 | US6454927 Electrodeposition |
| 09/24/2002 | US6454926 Uniform copper layer |
| 09/24/2002 | US6454918 Cup type plating apparatus |
| 09/24/2002 | US6454917 High throughput and high performance copper electroplating tool |
| 09/24/2002 | US6454916 Selective electroplating with direct contact chemical polishing |
| 09/23/2002 | CA2359608A1 Electroplating methods for fabricating microelectronic interconnects and microelectronic structures fabricated thereby |
| 09/19/2002 | WO2002072923A2 Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
| 09/19/2002 | US20020130046 Positioning substrate in an electroplating bath; forming doped copper layer on substrate; wherein the doped copper layer comprises an amount of non-metal that is controlled for increasing electromigration resistance in doped copper layer |
| 09/19/2002 | US20020130034 Pad designs and structures for a versatile materials processing apparatus |
| 09/19/2002 | US20020129879 Device produced by a process of controlling grain growth in metal films |
| 09/18/2002 | EP1241481A2 Contact structure for interconnections, interposer, semiconductor assembly and method |
| 09/18/2002 | EP0909346B1 Method and installation for the electrolytic coating with a metal layer of the surface of a cylinder for the continuous casting of thin metal strips |
| 09/18/2002 | CN1370245A Copper electroplating bath, pre-treating liquid before copper electroplating and copdper electroplating method |
| 09/18/2002 | CN1369954A Electroplating current supply system |
| 09/17/2002 | US6451682 Method of forming interconnect film |
| 09/17/2002 | US6451627 Semiconductor device and process for manufacturing and packaging a semiconductor device |
| 09/17/2002 | US6451452 Lead-free; copper alloy |
| 09/17/2002 | US6451195 Imersing silicon wafers in electrolytic cells, applying direct current voltages, then stirring the solutions using a magnetic field; protective coatings having uniform thickness |
| 09/17/2002 | US6450821 Electrical connectors adapted to reduce or prevent adherence of conductive material to contact portions as the connector |
| 09/12/2002 | WO2002070791A1 Fluid treatment system |
| 09/12/2002 | WO2002070788A1 Method and apparatus for providing electrical and fluid communication to a rotation microelectronic workpiece during electrochemical processing |
| 09/12/2002 | WO2002070780A1 Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 09/12/2002 | WO2002070144A1 Internal heat spreader plating methods and devices |
| 09/12/2002 | US20020127956 Method of sealing wafer backside for full-face electrochemical plating |
| 09/12/2002 | US20020127847 Electrochemical co-deposition of metals for electronic device manufacture |
| 09/12/2002 | US20020127829 Solution processing apparatus and solution processing method |
| 09/12/2002 | US20020127083 Bolt tightening structure of magnesium alloy member |
| 09/12/2002 | US20020125124 Method for shorting pin grid array pins for plating |
| 09/12/2002 | US20020124801 Processing apparatus with sensory subsystem for detecting the presence/absence of wafers or other workpieces |
| 09/12/2002 | DE10162215A1 Bolzenfestziehstruktur eines Magnesiumlegierungselements Bolt tightening structure of a magnesium alloy member |
| 09/12/2002 | DE10109138A1 Bauteile für den Kesselbereich von Kraftwerken oder Müllverbrennungsanlagen Parts for the boiler area of power plants or waste incineration plants |
| 09/12/2002 | CA2433031A1 Internal heat spreader plating methods and devices |
| 09/11/2002 | EP1238412A1 A vertically configured chamber used for multiple processes |
| 09/11/2002 | CN1369024A Lift and rotate assembly for use in workpiece procesing station and method of attaching the same |
| 09/11/2002 | CN1368562A Heat-resistance protection film, its manufacture method and electric electronic element |
| 09/11/2002 | CN1090890C Method for forming electroplated layer on through-hole inwall of PC board with through-hole |
| 09/11/2002 | CN1090825C lead-provided porous metal sheet and method for manufacturing the sheet |
| 09/10/2002 | US6447929 Printed circuit boards; electrodepositing layer of chromium on copper foil, electrodepositing layer of copper on said chromium layer; nodular treatment to layers to enhance the bonding characteristics and peel strength |
| 09/10/2002 | US6447666 Galvanic bath, method for producing structured hard chromium layers and use thereof |
| 09/10/2002 | US6447664 Methods for coating metallic articles |
| 09/06/2002 | WO2002069380A2 Atomically thin highly resistive barrier layer in a copper via |
| 09/06/2002 | WO2002068863A2 Structural components for the boiler zone of power plants or refuse incineration plants |
| 09/06/2002 | WO2002068730A1 Plating device and plating method |
| 09/06/2002 | WO2002068728A1 Bath for the galvanic deposition of gold and gold alloys, and the use thereof |
| 09/06/2002 | WO2002068727A2 Copper-plating solution, plating method and plating apparatus |
| 09/06/2002 | WO2002045476A9 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| 09/06/2002 | CA2438207A1 Bath for the galvanic deposition of gold and gold alloys, and the use thereof |
| 09/05/2002 | US20020121445 Mask plate design |
| 09/05/2002 | US20020121435 Vertically configured chamber used for multiple processes |
| 09/05/2002 | DE10107675A1 Endoprothese Endoprosthesis |
| 09/03/2002 | US6444481 Measuring a thickness of the process layer; and determining at least one plating parameter of the recipe for subsequently formed process layers based on the measured thickness. a processing line includes a plating tool, a metrology tool, |
| 09/03/2002 | US6444110 Soluble copper salt, electrolyte, one or more brightener compounds that are present in a concentration of at least about 1.5 mg per liter of electroplating composition; increased brightener levels |
| 09/03/2002 | US6444101 Contact ring for electroplating a substrate having an electroconductive portion, comprising an annular insulative body with central opening, a conductive biasing member coupled to the body to exert a biasing force on the substrate |
| 08/29/2002 | WO2002065953A1 Endoprothesis with galvanised silver layer |
| 08/29/2002 | US20020119657 Bonding copper nucleation layer to barrier undercoatings |
| 08/29/2002 | US20020117399 Barrier composed of highly resistive materials include metal oxides, and tantalum nitride, coated onto the sidewalls and bottom of via hole intented for copper metallization |
| 08/29/2002 | US20020117330 Resilient contact structures formed and then attached to a substrate |
| 08/28/2002 | EP1234619A2 Installation and method for the treatment of a metal strip or sheet |
| 08/28/2002 | EP1234487A2 Method for the direct electroplating of through-holes in printed circuit boards |
| 08/28/2002 | EP1234063A2 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates |
| 08/28/2002 | EP0837750B1 Wire bonding, severing, and ball forming |