Patents
Sitemap › C25 - Electrolytic or electrophoretic processes; Apparatus therefor › C25D - Processes for the electrolytic or electrophoretic production of coatings; Electroforming; Joining workpieces by electrolysis; Apparatus therefor › C25D 7 - Electroplating characterised by the article coated
Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
10/2000
10/18/2000EP1044776A1 Nickel plating of a mould using pulsating current
10/18/2000CN1270642A Cathode current control system for a wafer electroplating apparatus
10/17/2000US6133061 Method of forming thin zinc oxide film, and method of producing semiconductor element substrate and photovoltaic element using thin zinc oxide film
10/17/2000US6132887 Heat treatment
10/17/2000US6132589 To improve its adhesion to non-dicy prepregs by applying layer of zinc metal and layer of hexavalent chromium oxide
10/17/2000US6132587 Uniform electroplating of wafers
10/17/2000US6132570 Method and apparatus for continuous processing of semiconductor wafers
10/17/2000US6131880 Microvalve and method for manufacturing a microvalve
10/12/2000WO2000059727A1 Improved gravure printing rollers
10/12/2000WO2000059682A1 Method and apparatus for plating and polishing a semiconductor substrate
10/12/2000WO2000026443A3 Method and apparatus for electrochemical mechanical deposition
10/11/2000EP1042541A1 Method for producing abrasive tips for gas turbine blades
10/11/2000EP1042539A1 Printed circuit manufacturing process using tin-nickel plating
10/11/2000EP1042538A2 Water bath and method for electrolytic deposition of copper coatings
10/11/2000EP1042092A1 Component of printed circuit boards
10/11/2000EP0840994B1 Process and device for producing through-connected printed circuit boards and multilayered printed circuit boards
10/10/2000US6129820 Electroplating installation, electrode and support device for this installation and electroplating process
10/05/2000WO2000057743A2 Setting of gemstones
10/05/2000WO2000029647A3 Stratified composite material for sliding elements and method for the production thereof
10/04/2000EP1041450A2 Developer-carrying member, and developing device and image forming apparatus including the member
10/03/2000US6126798 Electroplating anode including membrane partition system and method of preventing passivation of same
10/03/2000US6126761 Process of controlling grain growth in metal films
09/2000
09/28/2000WO2000056953A1 Process for electrolytic coating of a substrate
09/28/2000WO2000056453A1 Method for producing a catalyst by means of electrodeposition
09/28/2000WO2000056452A1 Method for producing a catalyst
09/28/2000DE19912897A1 Katalysator und Verfahren zur Herstellung eines Katalysators Catalyst and process for the preparation of a catalyst
09/28/2000DE19912896A1 Verfahren zur Herstellung eines Katalysators A process for the preparation of a catalyst
09/28/2000DE10009868A1 Electrodeposited alloy layer for plain bearings includes small inorganic particles to act as nucleating agent
09/28/2000CA2367893A1 Method for producing a catalyst by means of electrodeposition
09/28/2000CA2367848A1 Method for producing a catalyst
09/27/2000EP1038054A1 Electrolytic tin plating process with reduced sludge production
09/27/2000CN1267892A Rare earth metal base permanent magnet and its producing process
09/26/2000US6123984 Method and apparatus for plating a substrate
09/26/2000US6123825 Electromigration-resistant copper microstructure and process of making
09/21/2000WO2000055888A1 Device for treating substrates
09/21/2000DE19911084A1 Vorrichtung zum Behandeln von Substraten Apparatus for processing substrates
09/20/2000EP1037263A2 Apparatus for electro-chemical deposition of copper with the capability of in-situ thermal annealing
09/20/2000EP1036222A1 Copper metallization of silicon wafers using insoluble anodes
09/14/2000WO2000038218A3 Device and method for treating substrates
09/14/2000WO2000020662A9 Submicron metallization using electrochemical deposition
09/13/2000EP1034123A1 Semiconductor processing apparatus having wafer re-orientation mechanism
09/12/2000US6117299 Methods of electroplating solder bumps of uniform height on integrated circuit substrates
09/05/2000US6113771 Electro deposition chemistry
09/05/2000US6113755 Apparatus for producing an electrode foil for use in aluminum electrolytic capacitors
08/2000
08/31/2000DE19907212A1 Refined steel sink has basin enclosed by rim, side walls, hard chromium plating, and drip-deflecting surface
08/30/2000EP1031648A1 Apparatus and method for electrolytic treatment
08/30/2000EP1031647A2 Apparatus and method for plating a wafer
08/30/2000EP1031165A1 Intergrated manufacturing tool comprising electroplating, chemical-mechanical polishing, clean and dry stations, and method therefor
08/30/2000CN1264757A Equipment and method for dissolving copper in step of producing raw liquid with electrolytic copper foil
08/29/2000US6110823 Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method
08/29/2000US6110346 Preventing the plated layer become concave, first start with a low current density, then later increasing the current flow
08/29/2000US6110345 Computer controlled process regulation and quality control for the metallization of integrated circuit semiconductor devices
08/29/2000US6110011 Integrated electrodeposition and chemical-mechanical polishing tool
08/24/2000WO2000049206A1 Continuous band plating device
08/24/2000WO1999016935A3 Simplified process and apparatus for production of copper foil
08/24/2000WO1998049374A3 Device for electrolytic treatment of printed circuit boards and conductive films
08/23/2000EP1030542A2 Lead surface coating for an X-ray tube casing
08/23/2000EP1029954A1 Substrate plating device
08/23/2000EP1029951A2 Strip treating apparatus
08/23/2000EP1029950A2 Strip treating apparatus
08/23/2000EP1029948A2 Using electroplated cu as cold layer for cold/hot deposition
08/23/2000EP1029342A1 Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components
08/22/2000US6107186 High planarity high-density in-laid metallization patterns by damascene-CMP processing
08/22/2000US6106688 Method for manufacturing a suspension element for a magnetic head
08/22/2000US6106687 Process and diffusion baffle to modulate the cross sectional distribution of flow rate and deposition rate
08/22/2000US6106680 Apparatus for forming a copper interconnect
08/17/2000WO2000032835A8 Electro-chemical deposition system
08/16/2000EP1028180A1 Method for producing very small metal ball
08/16/2000EP1027729A1 Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces
08/16/2000EP1027722A1 Plating system for semiconductor materials
08/16/2000EP1027481A1 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
08/16/2000EP1027480A1 Electrodes for semiconductor electroplating apparatus and their application
08/16/2000CN1263570A Process for manufacture of high quality very low profile copper foil and copper foil produced thereby
08/15/2000US6103096 Apparatus and method for the electrochemical etching of a wafer
08/15/2000US6103089 Multilayer material for sliding elements and process and means for the production thereof
08/15/2000US6103085 Semiconductor wafers
08/15/2000US6103076 Auxiliary anode element suitable for use in electroplating a bent tubular workpiece
08/10/2000WO2000011679A3 Contact element
08/09/2000EP1026288A1 Freely detachable insoluble anode
08/09/2000EP1026286A2 Method and apparatus for plating substrate with copper
08/09/2000EP1025283A1 Cathode current control system for a wafer electroplating apparatus
08/08/2000US6100194 Silver metallization by damascene method
08/08/2000US6099977 Comprising base material of a metal or a metal alloy, a surface coating of tin or a tin alloy, an intermetallic phase, carbon embedded in an outer edge section of the coating, said coating being applied galvanically
08/08/2000US6099712 Benefit of reducing the amount of organic additives consumed in the plating process. this is believed to occur because films that otherwise may form on the anode are not disrupted by the flow of plating liquids thereover.
08/08/2000US6099709 Method of producing an electrode foil for use in aluminum electrolytic capacitors
08/08/2000US6099702 Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability
08/03/2000WO2000045625A2 Method for the direct electroplating of through-holes in printed circuit boards
08/03/2000DE19903108A1 Verfahren zur direkten galvanischen Durchkontaktierung von Leiterplatten Method for direct galvanic through-hole plating of printed circuit boards
08/03/2000DE19901765A1 Assembly to carry a gravure printing cylinder in an electroplating bath has moving clamping pads for the roller ends with holders and centering hollow cones to grip the axis ends with current flow contact and sealing
08/02/2000EP1024506A1 Rare earth metal-based permanent magnet, and process for producing the same
08/02/2000EP1023469A1 Method of making a structure with improved material properties by moderate heat treatment of a metal deposit
08/02/2000EP0725727B1 Method of making machine-engraved seamless tube
08/02/2000CN1261632A Selective electrolytic metal chemical/electro plating device and method by using fluid head
08/01/2000US6096183 Method of reducing defects caused by conductor roll surface anomalies using high volume bottom sprays
07/2000
07/27/2000WO2000044042A1 Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits
07/27/2000CA2359473A1 Method for electrolytically forming conductor structures from highly pure copper when producing integrated circuits
07/26/2000CN1054894C Anode clamp
07/25/2000US6093291 Electroplating apparatus
07/21/2000CA2259860A1 Diverter tub spout body
07/20/2000WO2000041518A2 Electrodeposition chemistry for filling of apertures with reflective metal
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