| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
|---|
| 12/13/2001 | US20010050100 Semiconductors |
| 12/13/2001 | DE10125323A1 Electronic component, such as ceramic capacitor, has outer electrode layer containing polycrystalline tin and tin crystal grains with boundaries and atoms of another metal than tin at tin crystal grain boundaries |
| 12/12/2001 | EP1162289A1 Palladium electroplating bath and process for electroplating |
| 12/12/2001 | EP1161765A1 Device for treating substrates |
| 12/12/2001 | CN1326593A Battery sheath made of formed cold-rolled sheet and method for producing battery sheaths |
| 12/12/2001 | CN1326016A Local electroplating system |
| 12/11/2001 | US6330164 Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device |
| 12/11/2001 | US6329074 Alloy layer comprising copper, zinc, tin and nickel, chromate layer |
| 12/11/2001 | US6328872 Method and apparatus for plating and polishing a semiconductor substrate |
| 12/11/2001 | US6328871 Depositing a barrier layer comprising tantalum over the surface; annealing the barrier layer to form high conductance barrier layer; depositing a seed layer over the barrier layer |
| 12/06/2001 | WO2001093330A2 Electronic device and method using crystalline, conductive regions and amorphous, insulating regions of a layer |
| 12/06/2001 | WO2001052307A3 Semiconductor workpiece proximity plating methods and apparatus |
| 12/06/2001 | US20010048972 Galvanizing; controlling tolerances |
| 12/06/2001 | US20010047943 Soluble copper salt, electrolyte, one or more brightener compounds that are present in a concentration of at least about 1.5 mg per liter of electroplating composition; increased brightener levels |
| 12/05/2001 | EP1160846A2 Method of application of electrical biasing to enhance metal deposition |
| 12/05/2001 | EP1160352A1 Method of adjusting the size of cooling holes of a gas turbine component |
| 12/05/2001 | CN2463404Y Aluminium foil belt liquid conductive anodizing device for aluminium electrolytic capacitor |
| 12/05/2001 | CN1325138A Manufacture of wire holder in double electroplating mold |
| 12/04/2001 | US6325912 Apparatus and method for electrolytic treatment |
| 11/29/2001 | WO2001091163A2 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 11/29/2001 | WO2001090446A2 Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio |
| 11/29/2001 | WO2001090434A2 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 11/29/2001 | WO2001034881A3 Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 11/29/2001 | US20010046565 Method to produce high quality metal fill in deep submicron vias and lines |
| 11/29/2001 | US20010045360 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse |
| 11/28/2001 | EP1157148A2 Methods for coating metallic articles |
| 11/28/2001 | EP0859674B1 Method of making a continuous casting mold |
| 11/28/2001 | CN1323731A Web feeding apparatus, device and method for proceeding electro-plating by using said apparatus |
| 11/27/2001 | US6322678 Electroplating reactor including back-side electrical contact apparatus |
| 11/27/2001 | US6322677 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| 11/27/2001 | US6322674 Cathode current control system for a wafer electroplating apparatus |
| 11/27/2001 | US6322673 Apparatus for electrochemical treatment of a continuous web |
| 11/25/2001 | CA2349156A1 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse |
| 11/22/2001 | WO2001088954A2 Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing |
| 11/22/2001 | US20010042690 Method and apparatus for electroplating and electropolishing |
| 11/22/2001 | US20010042689 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 11/22/2001 | US20010042393 Process for the manufacture of a part with very high mechanical properties, formed by stamping of a strip of rolled steel sheet and more particularly hot rolled and coated |
| 11/22/2001 | DE10120847A1 Verfahren zum galvanischen Abscheiden einer Dispersionsschicht auf einer Oberfläche eines Werkstückes A method for the galvanic deposition of a dispersion layer on a surface of a workpiece |
| 11/21/2001 | EP1156139A2 Apparatus for clamping of printing cylinders and rotating the same in galvanic equipment |
| 11/21/2001 | CN1323256A Non-Lambertian glass diffuser and method of making |
| 11/21/2001 | CN1322863A Electroplating apparatus |
| 11/21/2001 | CN1075128C Method for manufacturing precision enclosed-cavity parts |
| 11/20/2001 | US6319621 Copper foil having glossy surface with excellent oxidation resistance and method of manufacturing the same |
| 11/20/2001 | US6319387 Copper alloy electroplating bath for microelectronic applications |
| 11/20/2001 | US6319386 Submerged array megasonic plating |
| 11/15/2001 | WO2001086031A1 Anode assembly for plating and planarizing a conductive layer |
| 11/15/2001 | US20010040264 Method of forming a semiconductor device and an improved deposition system |
| 11/15/2001 | US20010040100 Plating apparatus and method |
| 11/15/2001 | US20010040099 Method and apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing |
| 11/15/2001 | US20010040098 For plating electrical contactors for semiconductors; reliability |
| 11/15/2001 | US20010040097 Used for conveying a web while holding the web and applying tension to the web, wherein the conveyor comprises rollers with which the web contacts to be conveyed and rollers comprises a machanism to limit deformation of the web |
| 11/15/2001 | US20010040090 Plating pretreatment apparatus and plating treatment apparatus |
| 11/14/2001 | EP1154472A1 Process for fabrication of semiconductor devices having copper interconnects |
| 11/14/2001 | EP1154045A1 Process for the manufacture of a mould, of which the form giving surfaces are coated with a antisticking coating made of a chromium based galvanic layer |
| 11/14/2001 | EP1153430A1 Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits |
| 11/14/2001 | EP0950128A4 Prevention of marine encrustation on bronze propellers |
| 11/13/2001 | US6316359 Interconnect structure in a semiconductor device and method of formation |
| 11/08/2001 | WO2001083857A1 Method and device for the electrolytic coating of a metal strip |
| 11/08/2001 | WO2001083856A1 Surface treatment of parts of die-cast and extrusion machines |
| 11/08/2001 | WO2001083855A1 Textured metal article |
| 11/08/2001 | WO2001083854A2 Electroplating bath composition and method of using |
| 11/08/2001 | WO2001083136A1 Mold wall, especially a broadside wall of a continuous casting mold for steel |
| 11/08/2001 | US20010037945 Gap between contact and wafer surface being plated is small, reducing bubbles |
| 11/08/2001 | US20010037943 Liquid treatment equipment and liquid treatment method |
| 11/08/2001 | US20010037764 Liquid treatment system and liquid treatment method |
| 11/08/2001 | CA2407660A1 Method and device for the electrolytic coating of a metal strip |
| 11/07/2001 | EP1152071A1 Copper plating method |
| 11/07/2001 | CN1321121A Electrolytic copper foil with carrier foil and copper-clad laminate using electrolytic copper foil |
| 11/07/2001 | CN1320721A Nickel coated high-carbon steel wire for spring and making method thereof |
| 11/06/2001 | US6312579 Bearing having multilayer overlay and method of manufacture |
| 11/01/2001 | WO2001081657A2 Elastic contact element |
| 11/01/2001 | WO2001081043A1 Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate and layer structure made thereby |
| 11/01/2001 | US20010036514 Partial plating system |
| 11/01/2001 | US20010035355 Patterning photoresist |
| 11/01/2001 | US20010035354 Applying potentials |
| 11/01/2001 | US20010035346 Apparatus and method for electroplating |
| 11/01/2001 | US20010035343 Fine pattern forming method, developing/washing device used for the same, plating method using the same, and manufacturing method of thin film magnetic head using the same |
| 11/01/2001 | US20010035238 Physical vapor deposition target |
| 11/01/2001 | US20010035237 Copper, silver alloy |
| 11/01/2001 | CA2402805A1 Elastic contact element |
| 10/31/2001 | EP1149936A2 Plating system |
| 10/31/2001 | EP1149789A2 Web conveying apparatus, and apparatus and method for electrodeposition using web conveying apparatus |
| 10/31/2001 | EP1148976A1 Method and apparatus for deposition on and polishing of a semiconductor surface |
| 10/31/2001 | DE10019713A1 Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen Apparatus and method for electrically contacting electrolytic material to be treated in continuous flow systems |
| 10/31/2001 | CN1319685A Equipment and technology for electroplating steel pipe inner wall by using auxiliary anode and spray-plating zinc solution |
| 10/30/2001 | US6309760 Bearing material |
| 10/30/2001 | US6309759 Lining overcoated with bismuth, or alloy thereof |
| 10/30/2001 | US6309524 Methods and apparatus for processing the surface of a microelectronic workpiece |
| 10/30/2001 | US6309520 Methods and apparatus for processing the surface of a microelectronic workpiece |
| 10/30/2001 | US6309517 Apparatus for inline plating |
| 10/25/2001 | WO2001007685A3 Method for continuous nickel-plating of an aluminium conductor and corresponding device |
| 10/25/2001 | US20010032788 Divided housing |
| 10/25/2001 | US20010032787 Multilayer metal plating |
| 10/25/2001 | DE10015349A1 Treatment method for wetting, removal of gas bubbles and improving material exchange in both through and blind holes in circuit boards by impulse generation |
| 10/24/2001 | EP1148156A2 Copper Electroplating |
| 10/24/2001 | EP0895549A4 Electrochemical fluidized bed coating of powders |
| 10/24/2001 | CN1318655A Electroplating method |
| 10/23/2001 | US6306274 Method for making electrodeposition blades |
| 10/23/2001 | US6306268 Device for carrying out continuous electrolytic precipitation |
| 10/18/2001 | WO2001078473A1 Copper-clad laminated sheet |