| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 05/28/2002 | US6395642 Semiconductor substrate |
| 05/28/2002 | US6395583 Nickel, copper, iron, or alloy thereof |
| 05/28/2002 | US6395230 Pellistor |
| 05/28/2002 | US6395164 Copper seed layer repair technique using electroless touch-up |
| 05/23/2002 | US20020061715 Modified plating solution for plating and planarization and process utilizing same |
| 05/23/2002 | US20020060159 Chrome-plated sliding member and manufacturing method thereof |
| 05/23/2002 | DE10052188A1 Production of a metallized electrode used as a gas diffusion electrode for a polymer-electrolyte-membrane fuel cells comprises applying a catalyst onto a conducting substrate coated with a polymer by electrochemical deposition |
| 05/22/2002 | EP1207219A1 Equipment and method for covering a metallic element with a layer of copper |
| 05/21/2002 | US6391473 Cu plated ceramic substrate and a method of manufacturing the same |
| 05/21/2002 | US6391168 Plating apparatus utilizing an auxiliary electrode |
| 05/21/2002 | US6391166 Plating apparatus and method |
| 05/21/2002 | US6390356 Method of forming cylindrical bumps on a substrate for integrated circuits |
| 05/16/2002 | WO2002038834A1 Porous nickel foil for alkaline battery cathode, production method therefor and production device therefor |
| 05/16/2002 | WO2002038830A1 Surface treated tin-plated steel sheet and chemical treatment solution |
| 05/16/2002 | WO2002038827A1 Plasma electroplating |
| 05/16/2002 | US20020056890 Formation of a metallic interlocking structure |
| 05/16/2002 | US20020056649 Method of fabricating thin magnetic film and electrolytic plating apparatus for fabricating thin magnetic film |
| 05/16/2002 | US20020056646 Vertically configured chamber used for multiple processes |
| 05/16/2002 | US20020056636 Interpenetrating network free radical block polymer having hydrophobic and hydrophilic regions; improved thermal and mechanical stability; fuel cells |
| 05/16/2002 | DE10043816C1 Device for electrochemically metallizing, etching, oxidizing and reducing material in electrolytic apparatus comprises rigid base body, electrical contacts arranged on base body, contact isolator, counter electrode and electrical connection |
| 05/15/2002 | EP1204787A2 Method for continuous nickel-plating of an aluminium conductor and corresponding device |
| 05/15/2002 | EP1204786A1 Arrangement enabling a liquid to flow evenly around a surface of a sample and use of said arrangement |
| 05/15/2002 | CN1349659A Burless castellation via process and product for plastic chip carrier |
| 05/14/2002 | US6387227 Metal plate electrolyzation apparatus and electrode for electrolyzing metal plate |
| 05/09/2002 | US20020053734 Probe card assembly and kit, and methods of making same |
| 05/09/2002 | US20020053516 Anode, a shaping plate, a liquid electrolyte, and electrical contact members |
| 05/09/2002 | US20020053510 Methods and apparatus for processing the surface of a microelectronic workpiece |
| 05/07/2002 | US6383352 Spiral anode for metal plating baths |
| 05/07/2002 | US6383348 Plating pretreatment apparatus and plating treatment apparatus |
| 05/02/2002 | US20020050628 Metallization structures for microelectronic applications and process for forming the structures |
| 05/02/2002 | US20020050459 Forming insulating film above substrate, forming a to be filled region of interconnecting groove and hole in film, forming conductive film containing catalyst which accelerates electroless plating, forming second and third conductive films |
| 05/02/2002 | EP1202337A2 Probe pin for a probe card |
| 05/02/2002 | EP1201792A1 Composite plating method |
| 05/02/2002 | EP1201790A1 Seed layer |
| 05/02/2002 | EP1200647A1 Method for producing improved cold rolled strip that is capable of being deep drawn or ironed, and cold rolled strip, preferably used for producing cylindrical containers and, in particular, battery containers |
| 04/30/2002 | US6380083 Process for semiconductor device fabrication having copper interconnects |
| 04/30/2002 | US6379522 Electrodeposition chemistry for filling of apertures with reflective metal |
| 04/30/2002 | US6379521 Method of producing zinc oxide film, method of producing photovoltaic element, and method of producing semiconductor element substrate |
| 04/30/2002 | US6379520 Plating semiconductors |
| 04/25/2002 | WO2002033153A2 Copper bath and method of depositing a matt copper coating |
| 04/25/2002 | WO2002033152A1 A reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly |
| 04/25/2002 | US20020048889 Method of manufacturing semiconductor device with sidewall metal layers |
| 04/25/2002 | US20020048631 Using polyvinylphenols substituted with alkoxymethyl groups and with acid-unstabilizing groups; acid generator; carboxymethyl-substituted aromatic compound |
| 04/25/2002 | US20020047721 Probe pin for a probe card |
| 04/25/2002 | US20020047186 Semiconductor leadframes comprising silver plating |
| 04/25/2002 | US20020046953 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires |
| 04/25/2002 | US20020046952 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 04/25/2002 | US20020046951 Electrode with an electrode chamber for receiving electrolyte and an article forming the second electrode disposed inwardly and spaced from the first electrode for electrolyte passage between |
| 04/25/2002 | US20020046942 Diffuser with spiral opening pattern for electroplating reactor vessel |
| 04/25/2002 | US20020046787 Method for producing a thin-nickel alloy film |
| 04/25/2002 | DE10050750A1 Processing plant for printing cylinder has basic frame supporting units holding printing cylinders, track system for crane, and connections for control, power and fluid. |
| 04/25/2002 | CA2419595A1 Copper bath and method of depositing a matt copper coating |
| 04/24/2002 | EP1199386A2 Plating methods and systems |
| 04/24/2002 | EP1199384A2 Plating Bath |
| 04/24/2002 | EP1199383A2 Seed layer repair bath |
| 04/24/2002 | EP1198624A1 Process for electroplating a work piece coated with an electrically conducting polymer |
| 04/24/2002 | CN1346510A Mehtod and apparatus for holding and positioing semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 04/23/2002 | US6376374 Process and manufacturing tool architecture for use in the manufacturing of one or more protected metallization structures on a workpiece |
| 04/23/2002 | US6375823 Plating method and plating apparatus |
| 04/23/2002 | US6375731 Cationic conditioning agent, binder or an anionic dispersant that improve the adhesion of carbon particles and coverage, printed circuit board |
| 04/18/2002 | WO2002031231A1 Semiconductor production device and production method for semiconductor device |
| 04/18/2002 | WO2002031229A1 Compact processing installation for a printing cylinder |
| 04/18/2002 | WO2002031227A2 Deposition uniformity control for electroplating apparatus, and associated method |
| 04/18/2002 | WO2002031218A2 Sputter targets |
| 04/18/2002 | US20020043468 Source of metal ions, an electrolyte and one or more branched suppressor compounds comprising branched polymers, dendrimers or star polymers |
| 04/18/2002 | US20020043467 Electrolyte |
| 04/18/2002 | US20020043466 Depositing conductive barrier layer on substrate, depositing a conductive material on the substrate, and then depositing a second conductive material on the first by electroless deposition to fill discontinuities formed in seed layer |
| 04/17/2002 | EP1198001A2 Method of testing and mounting devices using a resilient contact structure |
| 04/17/2002 | EP1197587A2 Seed layer repair and electroplating bath |
| 04/17/2002 | EP1197586A2 Electrolyte |
| 04/17/2002 | CN1083234C Through-connected printed circuit board or process for producing multilayered printed circuit board |
| 04/16/2002 | US6373683 Electronic parts |
| 04/16/2002 | US6372114 Method of forming a semiconductor device |
| 04/11/2002 | WO2002029875A2 Plating system with remote secondary anode for semiconductor manufacturing |
| 04/11/2002 | WO2002029137A2 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 04/11/2002 | WO2001093330A3 Electronic device and method using crystalline, conductive regions and amorphous, insulating regions of a layer |
| 04/11/2002 | WO2001091163A3 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 04/11/2002 | US20020040853 Method of manufacturing a semiconductor component and plating tool therefor |
| 04/11/2002 | US20020040849 Cathode cartridge and anode cartridge of testing device for electroplating |
| 04/10/2002 | EP1195454A2 Cathode cartridge and anode cartridge of testing device for electroplating |
| 04/10/2002 | EP1195453A2 Bath device for engraver cylinder |
| 04/10/2002 | EP1194616A1 Copper replenishment technique for precision copper plating system |
| 04/10/2002 | EP1194613A1 Workpiece processor having processing chamber with improved processing fluid flow |
| 04/10/2002 | CN1344334A Process for electrolytic coating of substrate |
| 04/09/2002 | US6368966 Addition of zinc to copper in very low quantities assists in solving the diffusion and self-passivation problems, |
| 04/09/2002 | US6368958 Thick copper layer is deposited by disproportionation caused by water which is added to the stabilized cuprous ion solution, hydration energy of cupric ions increased causing cuprous ion disproportionate into cupric and solid copper |
| 04/09/2002 | US6368484 Lining workpiece, then adding and selectively removing a seed layer before electroplating; reduces waste, cost, and time |
| 04/09/2002 | US6368475 Apparatus for electrochemically processing a microelectronic workpiece |
| 04/09/2002 | US6368467 Electro-plating plasma arc deposition process |
| 04/04/2002 | WO2002027074A1 Method for selectively metallizing dielectric materials |
| 04/04/2002 | WO2001077416A3 Thin copper foil, and process and apparatus for the manufacture thereof |
| 04/04/2002 | DE10045991A1 Ternäre Zinn-Zink-Legierungen, galvanische Bäder und galvanisches Verfahren zur Erzeugung von ternären Zinn-Zink-Legierungsschichten Ternary tin-zinc alloy electroplating baths and galvanic method for generating ternary tin-zinc alloy layers |
| 04/04/2002 | DE10043817A1 Continuous electrochemical plant metallizing, etching, oxidizing and reducing e.g. PCBs, wafers and hybrids, controls electrode approach during conveying |
| 04/03/2002 | EP1193330A2 Plating apparatus and plating method for substrate |
| 04/03/2002 | EP1192298A2 System for electrochemically processing a workpiece |
| 04/02/2002 | US6365029 Sputtering electroconductive material on dielectric; forming photoresist pattern |
| 04/02/2002 | US6365027 Preirradiation with pulsed laser |
| 04/02/2002 | US6365025 Multilstage, multizonal |
| 04/02/2002 | US6365020 Wafer plating jig |
| 04/02/2002 | US6365017 Substrate plating device |