| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 08/22/2001 | EP1125007A1 Submicron metallization using electrochemical deposition |
| 08/22/2001 | CN1309881A Method for metal coating of substrates |
| 08/22/2001 | CN1309073A Long lead rack conveying mechanism of electric plating device |
| 08/21/2001 | US6277263 Alkaline electrolytic copper bath is used to electroplate copper onto a barrier layer or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer |
| 08/21/2001 | US6277262 Method and apparatus for continuous processing of semiconductor wafers |
| 08/21/2001 | US6277260 Apparatus and method for plating wafers, substrates and other articles |
| 08/16/2001 | WO2001058643A1 Modified plating solution for plating and planarization and process utilizing same |
| 08/16/2001 | US20010014410 Acid resistance; waterproof |
| 08/16/2001 | US20010014409 Article, method, and apparatus for electrochemical fabrication |
| 08/16/2001 | US20010014408 Surface -treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil |
| 08/16/2001 | US20010014407 Acid resistance |
| 08/16/2001 | US20010014406 Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil |
| 08/16/2001 | US20010013472 Forming copper film on insulation layer; immersion in solution of plating promoter; removing promoter from copper film leaving it on side walls and bottoms of via holes; electroplating to fill holes; improvement over planarization |
| 08/16/2001 | EP1124257A2 Phosphorous doped copper film |
| 08/16/2001 | EP1123988A1 Method of forming chromium coated copper for printed circuit boards |
| 08/15/2001 | CN1308010A Garbage coating stripper for local electroplating equipment |
| 08/14/2001 | US6274823 Interconnection substrates with resilient contact structures on both sides |
| 08/14/2001 | US6274024 Apparatus and method for plating wafers, substrates and other articles |
| 08/14/2001 | US6274023 Configuring the fluid dynamics and electrostatics of a plating process in order to provide improved uniformity in plating deposition, improved plating rates, and improved step coverage of via holes. |
| 08/09/2001 | WO2000071921A3 Burrless castellation via process and product for plastic chip carrier |
| 08/09/2001 | DE10005089A1 Vorrichtung zur elektrolytischen Herstellung einer Schicht auf einem einen geschlossenen Umfang und eine flexible oder feste Wandung mit mehreren Öffnungen aufweisenden Körper Apparatus for the electrolytic production of a layer on a a closed circumference and a flexible or rigid wall with a plurality of foraminous body |
| 08/08/2001 | EP1122989A2 Method of plating for filling via holes |
| 08/08/2001 | EP1122339A2 Megasonic plating using a submerged transducers-array |
| 08/08/2001 | EP0834603B1 Method of straightening warp of steel strip in electroplating line |
| 08/08/2001 | CN1307793A Assembly of an electronic component with spring packaging |
| 08/08/2001 | CN1307652A Galvanic bath, method for producing structured hard chromium layers and use thereof |
| 08/08/2001 | CN1307651A Method for producing nickel foam and nickel foam thus obtainable |
| 08/07/2001 | US6270922 Surface-treated steel plate for battery case, battery case and battery using the case |
| 08/07/2001 | US6270648 Having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, which employs two ?super anodes? on a rotating drum cathode to deposit the treatment |
| 08/07/2001 | US6270647 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 08/07/2001 | US6270645 Simplified process for production of roughened copper foil |
| 08/07/2001 | US6270635 Consistent plating system for electroplating |
| 08/02/2001 | WO2001056345A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 08/02/2001 | WO2001056344A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 08/02/2001 | WO2001056343A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 08/02/2001 | WO2001056342A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 08/02/2001 | WO2000033356A9 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 08/02/2001 | US20010010287 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 08/02/2001 | DE10102145A1 Plattiervorbehandlungsvorrichtung und Plattierbehandlungsvorrichtung Plattiervorbehandlungsvorrichtung and Plattierbehandlungsvorrichtung |
| 07/31/2001 | US6268017 Plating, overcoating zones with gelatin |
| 07/31/2001 | US6267862 Creating voltage difference between electrical conductor and wafer; uniformity |
| 07/31/2001 | US6267853 Electro-chemical deposition system |
| 07/31/2001 | US6267508 Sliding bearing having multilayer lead-free overplate and method of manufacture |
| 07/26/2001 | WO2001053569A1 Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating |
| 07/26/2001 | WO2001014618A3 Apparatus and method for electroplating a material layer onto a wafer |
| 07/26/2001 | US20010009724 Depositing coating on elongate member to give a coated elongate member, coating comprising at least one metal and at least one additive, the additive capable of codepositing with the metal, heat treating; electronics packaging |
| 07/26/2001 | US20010009226 Device for supporting semiconductor in electroplating solution; electrical circuit, including electrode, for applying electrical potential across solution; control device to change distance between electrode and semiconductor |
| 07/25/2001 | EP1118696A1 Method for plating substrate and apparatus |
| 07/25/2001 | EP1118413A1 Structure and method for joining metal members |
| 07/25/2001 | CN2440047Y Antileakage device for plate electroplating-machine |
| 07/24/2001 | US6265020 Applying solution to printed circuit; inversion |
| 07/19/2001 | WO2001052307A2 Semiconductor workpiece proximity plating methods and apparatus |
| 07/19/2001 | US20010008681 Non-lambertian glass diffuser and method of making |
| 07/18/2001 | EP1115915A2 Contact element |
| 07/18/2001 | EP1115912A2 Device for partial electrochemical treatment of bar-shaped objects |
| 07/18/2001 | CN1304183A Method and equipment for forming zinc oxide film, and method and apparatus manufacturing photovoltaic device |
| 07/17/2001 | US6261954 Method to deposit a copper layer |
| 07/17/2001 | US6261436 Drawing core wire of pure silver or palladium, degreasing in alkaline solution, rinsing, treating surface with acid active surface treatment, washing with water, electroplating single outer layer of gold on surface, smoothing gold layer |
| 07/17/2001 | US6261433 Electro-chemical deposition system and method of electroplating on substrates |
| 07/17/2001 | US6261426 Method and apparatus for enhancing the uniformity of electrodeposition or electroetching |
| 07/12/2001 | WO2001050821A2 Conditioning of through holes and glass |
| 07/12/2001 | WO2001050505A2 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 07/12/2001 | WO2000033356A3 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 07/12/2001 | US20010007223 Cylinder and manufacturing method therefor |
| 07/12/2001 | DE19958202A1 Verfahren zur Herstellung einer Metallschicht mit einer vorgegebenen Dicke A process for producing a metal layer having a predetermined thickness |
| 07/11/2001 | EP1114450A1 A system and a method for plating of a conductive pattern |
| 07/11/2001 | EP1114209A1 Hard-chrome plated layer |
| 07/11/2001 | EP1114207A1 Pellistor |
| 07/11/2001 | EP1113918A1 Non-lambertian glass diffuser and method of making |
| 07/11/2001 | EP1042538B1 Aqueous bath and method for electrolytic deposition of copper coatings |
| 07/11/2001 | CN1303124A Method of forming semiconductor apparatus |
| 07/10/2001 | US6259035 Chip card |
| 07/10/2001 | US6258717 Method to produce high quality metal fill in deep submicron vias and lines |
| 07/10/2001 | US6258223 In-situ electroless copper seed layer enhancement in an electroplating system |
| 07/10/2001 | US6258220 Electro-chemical deposition system |
| 07/10/2001 | US6257762 Lead surface coating for an x-ray tube casing |
| 07/05/2001 | WO2001048800A1 Semiconductor wafer processing apparatus and processing method |
| 07/05/2001 | WO2001048275A1 Plating device and plating method |
| 07/05/2001 | WO2001048274A1 Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
| 07/05/2001 | WO2001048267A1 Sliding member |
| 07/05/2001 | WO2001047666A1 Work piece carrier head for plating and polishing |
| 07/05/2001 | US20010006745 Bipolar collector for fuel cell |
| 07/05/2001 | US20010006151 Providing a base foam having a conductive surface, nickel plating the base foam in an electroplating bath, removing the base foam |
| 07/04/2001 | EP1113487A1 Method for plating a film on a semiconductor device |
| 07/04/2001 | EP1113180A2 Laminated structure for sliding bearing |
| 07/04/2001 | EP1112125A2 Metallization structures for microelectronic applications and process for forming the structures |
| 07/03/2001 | US6254979 Low friction electrical terminals |
| 07/03/2001 | US6254760 Electro-chemical deposition system and method |
| 07/03/2001 | US6254756 Preparation of components having a partial platinum coating thereon |
| 07/03/2001 | US6254755 Electroplating process for oldham ring and scroll member type compressor comprising the same |
| 07/03/2001 | US6254742 Diffuser with spiral opening pattern for an electroplating reactor vessel |
| 06/28/2001 | WO2000003072A9 Method and apparatus for copper plating using electroless plating and electroplating |
| 06/28/2001 | US20010005056 Multiple seed layers for metallic interconnects |
| 06/28/2001 | US20010004965 Useful for electroplating a pin grid array package having multiple pins, which are electrically connected with less physical contact; reduces damage to the pin caused by removal of the pin from the apparatus after electroplating |
| 06/28/2001 | DE10063624A1 Electroplating system has anodes in the plating bath together with electrically conductive rollers as cathodes to move the workpieces forwards or backwards through the bath |
| 06/27/2001 | EP1111096A2 Seed layer repair method |
| 06/27/2001 | EP1110262A1 Bipolar collector for fuel cell |
| 06/27/2001 | EP0876519B1 Apparatus and method for electroplating a metal onto a substrate |
| 06/27/2001 | CN1301130A Binding treatment of copper sheet with improved binding strength and bottom cutting resistant |
| 06/27/2001 | CN1300882A Apparatus and method for electroplating treatment |