| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 08/28/2002 | CN1366563A Process for electroplating work piece coated with electrically conducting polymer |
| 08/27/2002 | US6440822 Method of manufacturing semiconductor device with sidewall metal layers |
| 08/27/2002 | US6440289 Electroless deposition, followed by electrodeposition to form coating layers having uniformity and thickness; integrated circuits |
| 08/27/2002 | US6440253 Method to facilitate processing of three dimensional substrates |
| 08/27/2002 | US6440178 Methods for handling semiconductor workpiece therein. the semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing |
| 08/27/2002 | US6439301 Heat Exchangers |
| 08/22/2002 | WO2002064861A2 Substrate holder system with substrate extension apparatus and associated method |
| 08/22/2002 | US20020113279 Semiconductor device, and method of forming an electrode |
| 08/22/2002 | US20020112965 Bond enhancement antitarnish coatings |
| 08/22/2002 | US20020112964 Plating solution of metal ions at a molar concentration of between about 0.4 M and about 0.9 M; an acid, a suppressor, an accelerator and a leveler; semiconductors; void- and defect-free; sub-micron scale and smaller features |
| 08/22/2002 | US20020112952 Object plating method and system |
| 08/22/2002 | US20020112884 Circuit board and method of manufacturing the same |
| 08/21/2002 | EP1232828A1 Wire bonding, severing, and ball forming |
| 08/21/2002 | EP1232525A2 Conductive interconnection |
| 08/20/2002 | US6436258 Galvanic-cell gas sensor |
| 08/20/2002 | US6436249 Clamshell apparatus for electrochemically treating semiconductor wafers |
| 08/15/2002 | WO2002063072A1 Method and apparatus for controlling thickness uniformity of electroplated layer |
| 08/15/2002 | WO2002063069A2 Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features |
| 08/15/2002 | WO2002029875A3 Plating system with remote secondary anode for semiconductor manufacturing |
| 08/15/2002 | WO2001052307A9 Semiconductor workpiece proximity plating methods and apparatus |
| 08/15/2002 | WO2001026145A9 Seed layers for interconnects and methods and apparatus for their fabrication |
| 08/15/2002 | US20020108862 Electroplating apparatus with vertical electrical contact |
| 08/15/2002 | US20020108851 Methods and apparatus for processing the surface of a microelectronic workpiece |
| 08/15/2002 | US20020108850 Cup-type plating apparatus |
| 08/14/2002 | EP1231300A1 Plating method and device, and plating system |
| 08/14/2002 | EP1230673A1 Integrated circuit plating using highly-complexed copper plating baths |
| 08/14/2002 | EP1230443A1 Method for electrodeposition of metallic multilayers |
| 08/14/2002 | EP1230442A2 Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 08/14/2002 | EP1230441A1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method |
| 08/14/2002 | EP0993512B1 Porous film and method of preparation thereof |
| 08/14/2002 | DE10059451C1 Werkstückaufnahme für galvanische Beschichtungen Workpiece holder for electroplated coatings |
| 08/14/2002 | CN1364205A Method for producing improved cold rolled strip that is capable of being deep drawn or ironed, and cold rolled strip, preferably used for producing cylindrical containers and, in particular, battey |
| 08/14/2002 | CN1364114A Carrier foil-pasted metal foil and production method thereof |
| 08/13/2002 | US6432821 Method of copper electroplating |
| 08/13/2002 | US6432293 A process for copper-plating a wafer which comprises electroplating a semiconductor wafer having sub-micron trenches etched therein with an electrode comprising a corrosion-resistant metal substrate and a coat mainly composed |
| 08/13/2002 | US6432291 Simultaneous electroplating of both sides of a dual-sided substrate |
| 08/13/2002 | US6432282 Method and apparatus for supplying electricity uniformly to a workpiece |
| 08/08/2002 | US20020106533 Structure and plating method of thin film magnetic head and magnetic storage apparatus |
| 08/08/2002 | US20020106450 Wiring board |
| 08/08/2002 | US20020104755 Electroplating current supply system |
| 08/07/2002 | EP1229580A2 Electrochemical reduction of copper seed for reducing voids in electrochemical deposition |
| 08/07/2002 | EP1229154A1 Method and apparatus for electroplating |
| 08/07/2002 | EP1228528A1 Magnetic pole fabrication process and device |
| 08/07/2002 | EP1228267A1 An improved process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology |
| 08/07/2002 | CN2504283Y Edge cover auto tracking steel strip appts. for horizontal plating bath |
| 08/07/2002 | CN1363000A 复合电镀方法 Composite plating method |
| 08/07/2002 | CN1362538A Method for forming copper for chrome-plating of printed circuit board |
| 08/06/2002 | US6428662 Reactor vessel having improved cup, anode and conductor assembly |
| 08/06/2002 | US6428661 Plating apparatus |
| 08/06/2002 | US6428660 Reactor vessel having improved cup, anode and conductor assembly |
| 08/01/2002 | WO2002059882A2 Method for seed layer removal for magnetic heads |
| 08/01/2002 | WO2002059398A2 Plating apparatus and method |
| 08/01/2002 | US20020102846 Plating apparatus and method of manufacturing semiconductor device |
| 08/01/2002 | US20020102156 Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces |
| 08/01/2002 | US20020100693 Forming a copper seed layer over a semiconductor body, wherein copper oxide forms at a surface of copper seed layer electrochemically reducing copper oxide; electrochemically depositing copper layer on copper seed layer |
| 07/31/2002 | EP1226911A2 Method of manufacturing honeycomb extrusion die and die manufactured according to this method |
| 07/31/2002 | EP1226365A2 Sliding bearing having multilayer lead-free overplate and method of manufacture |
| 07/31/2002 | EP1133588B1 Stratified composite material for sliding elements and method for the production thereof |
| 07/31/2002 | CN2503076Y Electroplating equipment for plating inwall of pipe fitting |
| 07/31/2002 | CN1361312A Object electroplating method and system |
| 07/30/2002 | US6425996 Adjusting electroconductivity |
| 07/30/2002 | US6425991 Plating system with secondary ring anode for a semiconductor wafer |
| 07/25/2002 | WO2002058442A1 Flexible printed wiring board |
| 07/25/2002 | WO2002058114A1 Substrate processing apparatus |
| 07/25/2002 | WO2002057517A1 Electrodeposited bearing alloy, electroplating bath, and electrodeposition method |
| 07/25/2002 | WO2002057514A2 Method and apparatus for electrodeposition or etching of uniform film with minimal edge exclusion on substrate |
| 07/25/2002 | WO2002022913A3 Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 07/25/2002 | US20020096436 Substrate holder system with substrate extension apparatus and associated method |
| 07/25/2002 | US20020096435 Causing a first impregnated member containing a plating solution in electrical contact with an anode to face the conductive layer on a substrate and moving it; preferentially forming a thin film in a depression, e.g. groove or hole |
| 07/25/2002 | US20020096433 Radiating with a pulse laser (pulse width < picosecond) to excite solely electrons on the substrate surface to generate a nonequilibrium state in either temperature or energy and deposit a thin film; metal plating; energy conservation |
| 07/25/2002 | DE10147659A1 Chrom-plattiertes Gleitelement und Verfahren zu seiner Herstellung Chromium-plated sliding element and process for its preparation |
| 07/24/2002 | EP1224341A1 Process for electrolytic coating of a substrate |
| 07/24/2002 | EP0973960B1 Method for producing foamed shaped parts |
| 07/24/2002 | CN1360089A Electroplating device for circuit board |
| 07/24/2002 | CN1088323C Method for forming protection layer on surface of cooper foil for mfg. printed circuit board |
| 07/23/2002 | US6424046 Substrate for manufacturing a semiconductor device with three element alloy |
| 07/23/2002 | US6423636 Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer |
| 07/23/2002 | US6423200 Depositing a copper seed layer over dielectric layer and into etched features of dielectric layer having a barrier layer; treating copper seed layer to remove oxidized layer from over copper seed layer; electroplating copper fill layer |
| 07/23/2002 | CA2080620C Enhancements of current carrying rolls, especially in electrolysis lines |
| 07/18/2002 | WO2002055764A1 Ni-plated steel plate for alkali-manganese dry cell anode can and alkali-manganese dry cell anode can |
| 07/18/2002 | WO2002055762A2 Electrochemical co-deposition of metals for electronic device manufacture |
| 07/18/2002 | US20020093762 Method for seed layer removal for magnetic heads |
| 07/18/2002 | US20020092891 Method for manufacturing a multiple walled tube |
| 07/18/2002 | US20020092772 Barrier layer for electroplating processes |
| 07/18/2002 | DE10065643A1 Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut Apparatus and method for electrochemical treatment of strip-shaped and board-shaped |
| 07/18/2002 | DE10043817C2 Anordnung und Verfahren für elektrochemisch zu behandelndes Gut Apparatus and method for electrochemically treated Good |
| 07/17/2002 | EP1222323A1 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| 07/17/2002 | EP1222321A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 07/17/2002 | CN1359110A Method for preparing composite conductive material |
| 07/16/2002 | US6420053 Articles having a colored metallic coating with special properties |
| 07/16/2002 | US6419805 Apparatus for plating wafers, substrates and other articles |
| 07/11/2002 | WO2002053809A1 Spouted bed apparatus for contacting objects with a fluid |
| 07/11/2002 | WO2002053807A1 Device and method for electrochemically treating a band-shaped product |
| 07/11/2002 | US20020090484 Plating bath |
| 07/11/2002 | US20020088845 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for elecronic parts having the film |
| 07/11/2002 | US20020088713 Providing metal seed layer substantially free of discontinuities disposed on substrate by contacting metal seed layer disposed on a substrate with electroplating bath comprising one or more sources of copper in electrolyte |
| 07/11/2002 | US20020088708 Cup type plating apparatus |
| 07/11/2002 | DE10065649A1 Device for electrochemical treatment of electrically conducting flexible material includes electrode roller rotating in electrolyte container and having ion-permeable electrically insulating layer on electrochemically active casing surface |
| 07/10/2002 | EP1220625A1 Die manufacturing |
| 07/10/2002 | CN1358410A Surface treated copper foil and mehtod for preparing the same and copper-clad laminate using the same |