| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 01/30/2001 | US6180524 Rinsing in oxygen-free ammonia solution; drainage; electroless metal deposition; electroplating |
| 01/30/2001 | US6179983 Comprising clamshell for holding substrate, plating bath having wall section, virtual anode having periphery secured to wall section, virtual anode having opening therein, and anode, virtual anode being located between clamshell and anode |
| 01/30/2001 | US6179982 Introducing and reclaiming liquid in a wafer processing chamber |
| 01/30/2001 | US6178639 Multi-layer engine bearings and method of manufacture |
| 01/30/2001 | US6178623 Composite lightweight copper plated aluminum wire |
| 01/30/2001 | CA2222158C Self accelerating and replenishing non-formaldehyde immersion coating method and composition |
| 01/25/2001 | WO2000061498A3 System for electrochemically processing a workpiece |
| 01/25/2001 | DE19963385C1 Composite material layer for sliding bearings has a sliding layer made of a tin matrix in which tin-copper particles are embedded |
| 01/25/2001 | DE19934584A1 Production of contacts comprises completely covering the substrate with lacquer and then selectively removing the lacquer layer using a laser |
| 01/24/2001 | EP1070772A2 Electroplating device, and process for electroplating work using the device |
| 01/24/2001 | EP1070160A1 Outside part of a cooktop or an oven |
| 01/24/2001 | EP1070159A1 Electrodeposition of metals in small recesses using modulated electric fields |
| 01/24/2001 | CN1281517A Copper metallization of silicon wafers using insoluble anodes |
| 01/23/2001 | US6176996 Tin alloy plating compositions |
| 01/23/2001 | US6176995 Improving the transfer of materials at the surface of the material for treatment consists in generating a large flow of electrolyte at the treatment point by means of rotating electrodes which move synchronously |
| 01/23/2001 | US6176992 Method and apparatus for electro-chemical mechanical deposition |
| 01/18/2001 | WO2001004928A2 Improved apparatus and method for plating wafers, substrates and other articles |
| 01/18/2001 | WO2001004387A1 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| 01/18/2001 | WO2001004386A1 Hard-chrome plated layer |
| 01/18/2001 | WO2001004385A1 Device and method for the partial electrochemical treatment of bar-shaped elements |
| 01/18/2001 | DE19931829A1 Galvanische Hartchromschicht Galvanic hard-chromium layer |
| 01/17/2001 | EP1069212A1 Electrochemical deposition for high aspect ratio structures using electrical pulse modulation |
| 01/17/2001 | EP1069211A2 Electroplating solutions |
| 01/16/2001 | US6174425 Electroplating process makes electrical current density across a semiconductor device substrate surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. |
| 01/11/2001 | WO2001002121A1 Structure and method for joining metal members |
| 01/11/2001 | DE19932045A1 Production of electrically conducting strips for transporting electrical current in cables comprises electrolytic application of electrical conducting pathways to a strip-like insulator |
| 01/10/2001 | EP1067590A2 Electroplating system |
| 01/10/2001 | EP1067221A2 Method and apparatus for plating substrate and plating facility |
| 01/10/2001 | EP1067220A2 Article plated with boron carbide in a nickel-phosphorus matrix, and process and bath for its preparation |
| 01/10/2001 | EP1066895A2 Article equipped with structural members and method for its manufacture |
| 01/04/2001 | WO2000057743A3 Setting of gemstones |
| 01/03/2001 | EP1065711A2 Method of manufacturing a plated electronic termination |
| 01/03/2001 | EP1064417A1 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 01/03/2001 | CN1278874A Method for producing very small metal ball |
| 01/03/2001 | CN1278873A Method for producing abrasive tips for gas turbine blades ` |
| 01/02/2001 | US6168873 Electrode substrate and recording medium |
| 01/02/2001 | US6168703 Copper foil and laminate containing a hydrogen inhibitor |
| 01/02/2001 | US6168695 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| 01/02/2001 | US6168691 Device for electrochemical treatment of elongate articles |
| 12/28/2000 | DE19929090A1 Verfahren zur Beschichtung eines Werkstückes mit einem Schmierstoff A method of coating a workpiece with a lubricant |
| 12/27/2000 | EP1063323A2 Process for coating a work piece with a lubricant |
| 12/27/2000 | EP1063322A2 Anode structure for manufacture of metallic foil |
| 12/27/2000 | EP1062373A1 A surface-treated steel wire for reinforcing structures for articles of manufacture made of elastomeric material and an article of manufacture comprising the same |
| 12/27/2000 | EP0827627B1 A method of selectively metallising an inner, electrically insulating surface of an open body, and a scan velocity modulator manufactured using such a method |
| 12/27/2000 | CN1278308A Method of making a structure with improved material properties by moderate heat treatment of a metal deposit |
| 12/27/2000 | CN1278229A Semiconductor processing apparatus having wafer re-orientation mechanism |
| 12/27/2000 | CN1278023A Positve electrode structure for mfg. metal foil |
| 12/26/2000 | US6165330 Continuous plating apparatus |
| 12/21/2000 | WO2000077278A1 Method and apparatus for electroplating depressions of a substrate simultaneously preventing plating on the substrate surface using a membrane cover |
| 12/20/2000 | EP1061159A1 Plating apparatus, plating system, method for plating using the same |
| 12/20/2000 | EP1061157A1 Substrate plating device |
| 12/20/2000 | EP1060297A2 Electrolytic copper foil having a modified shiny side |
| 12/19/2000 | US6162726 Gas shielding during plating |
| 12/19/2000 | US6162497 Manufacturing particles and articles having engineered properties |
| 12/19/2000 | US6162344 Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer |
| 12/19/2000 | US6162335 Apparatus for selectively electroplating an airfoil |
| 12/14/2000 | WO2000075402A1 Hydrophobic and hydrophilic membranes to vent trapped gases in a plating cell |
| 12/12/2000 | US6159623 For electric and electronics parts; soldering characteristics |
| 12/12/2000 | US6159354 Providing cup having inner perimeter which defines cup central aperture attached to flange comprising annulus; mounting substrate in cup; placing cup and flange in plating solution; producing electric current; positioning flange |
| 12/07/2000 | WO2000040784A3 Methods for coating metallic articles |
| 12/06/2000 | CN1059244C Organic rust-proof treating copper foil |
| 12/05/2000 | US6156167 Clamshell apparatus for electrochemically treating semiconductor wafers |
| 11/30/2000 | WO2000071921A2 Burrless castellation via process and product for plastic chip carrier |
| 11/30/2000 | WO2000041518A3 Electrodeposition chemistry for filling of apertures with reflective metal |
| 11/30/2000 | WO1999040615A9 Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device |
| 11/29/2000 | EP1055020A2 Plating apparatus and method |
| 11/28/2000 | US6153078 Providing unfired ferrite substrate; coating conductive material comprising silver/palladium particles, ferrite particles, cellulose-based binder, solvent; firing substrate; electroplating copper using copper pyrophosphate bath |
| 11/28/2000 | US6153064 Apparatus for in line plating |
| 11/23/2000 | WO2000070127A1 Method and apparatus related to an electroplated structure |
| 11/22/2000 | EP1054081A2 Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating |
| 11/22/2000 | EP1054080A2 Electrolytic copper plating solutions |
| 11/22/2000 | CN1274021A Electrolytic copper electroplating liquid |
| 11/21/2000 | US6150712 Lead frame for semiconductor device, and semiconductor device |
| 11/21/2000 | US6150711 Ferroalloy substrate, first precious metal(pm) plating layer, intermediate layer of copper (alloy) plating layer and a nickel (alloy) plating layer, and a second pm plating layer formed sequentially on substrate; anticorrosion, solderable |
| 11/21/2000 | US6150186 Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive |
| 11/16/2000 | DE19932785C1 Partial electrochemical treatment apparatus, e.g. for electroplating or etching shock-absorber or valve rods, provides masking system vertical tolerance equalization by lowering a rod workpiece and pressing down a membrane holder |
| 11/15/2000 | EP1052311A1 Plating machine |
| 11/15/2000 | EP1051886A2 Device for electrolytic treatment of printed circuit boards and conductive films |
| 11/15/2000 | EP1051544A2 Process chamber and method for depositing and/or removing material on a substrate |
| 11/15/2000 | EP1051543A2 Method for electroplating metal coating(s) on particulates at high coating speed with high current density |
| 11/09/2000 | WO2000032848A3 An inflatable compliant bladder assembly |
| 11/09/2000 | WO2000011245A3 Device for partial electrochemical treatment of bar-shaped objects |
| 11/08/2000 | EP1050902A2 Method for forming a copper layer over a semiconductor wafer |
| 11/08/2000 | CN1272956A Apparatus and methods for controlling workpiece surface exposure to processing liquids during fabrication of microelectronic components |
| 11/08/2000 | CN1272685A Method for forming copper layer on semiconductor chip |
| 11/07/2000 | US6143587 Method of marking on semiconductor device having metallic layer |
| 11/07/2000 | US6143155 By providing relative motion between a bipolar electrode and a metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto |
| 11/02/2000 | EP1048756A1 Substrate plating device |
| 11/02/2000 | EP1048753A1 Multilayer material for sliding elements and process for the production thereof |
| 11/02/2000 | EP1047811A1 Articles having a colored metallic coating with special properties |
| 11/01/2000 | CN2403792Y Apparatus for auxiliary anode spraying zinc liquid electroplating steel conduit inwall |
| 10/31/2000 | US6140234 Method to selectively fill recesses with conductive metal |
| 10/31/2000 | US6139712 Method of depositing metal layer |
| 10/31/2000 | US6139703 Cathode current control system for a wafer electroplating apparatus |
| 10/26/2000 | WO2000063465A1 ACTIVE CARBON ELECTRO-DEPOSITED WITH Ag-I SYSTEM HAVING STERILIZING EFFECT |
| 10/24/2000 | US6136708 Preventing the diffusion of contaminants by forming a barrier film on a back surface of a semiconductor substrate; significant reduction in production steps |
| 10/24/2000 | US6136451 Improving oxidation resistance of a platinum modified aluminide diffusion coating on a substrate by electroplating the substrate with a platinum layer from an aqueous hydroxide based electroplating solution and aluminizing the substrate |
| 10/24/2000 | US6136163 Apparatus for electro-chemical deposition with thermal anneal chamber |
| 10/19/2000 | WO2000061837A1 Workpiece processor having processing chamber with improved processing fluid flow |
| 10/19/2000 | WO2000061498A2 System for electrochemically processing a workpiece |