| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
|---|
| 07/07/1999 | EP0927820A1 Cast cylinder block and method for manufacturing the same |
| 07/07/1999 | CN2327702Y Electrolyzer for inner holes of metal cylinders |
| 07/07/1999 | CN1222205A Electrochemical fluidized bed coating of powders |
| 07/01/1999 | DE19805589C1 Cleaning unit for rotating current roll of electrolytic strip coating installation |
| 07/01/1999 | DE19758121A1 Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten Aqueous bath and method for electrolytically depositing copper layers |
| 06/30/1999 | EP0926735A2 Tin-nickel alloy and component surface-treated with alloy |
| 06/29/1999 | US5917707 Flexible contact structure with an electrically conductive shell |
| 06/29/1999 | US5916696 Crack-resistant when the lead frame is bent to an angle of at least 82 degrees with a bend radius of about 150 mu.m to about 300 mu.m. |
| 06/24/1999 | WO1999031302A1 Printed circuit manufacturing process using tin-nickel plating |
| 06/24/1999 | WO1999031300A2 Water bath and method for electrolytic deposition of copper coatings |
| 06/24/1999 | WO1999031299A1 Electrodes for semiconductor electroplating apparatus and their application |
| 06/24/1999 | DE19754950A1 Area elements of iron, steel or special steel covered with a protective layer |
| 06/23/1999 | EP0924320A2 Method of fabricating a copper plated aluminium wire, a plated aluminium wire, an insulating plated aluminium wire, methods of fabricating thereof, and a composite lightweighted plated aluminium wire |
| 06/17/1999 | WO1999029933A1 Method of reducing defects caused by conductor roll surface anomalies using high volume bottom sprays |
| 06/17/1999 | WO1999015714A3 Electro-plating process |
| 06/16/1999 | EP0922791A1 Electroplating plant, electrode and support system therefor and electroplating process |
| 06/16/1999 | EP0886894A4 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 06/16/1999 | EP0772700B1 Use of a palladium colloid solution |
| 06/16/1999 | CN1219983A Method and installation for electrolytic coating with metal layer of surface of cylinder for continous casting of thin metal strips |
| 06/15/1999 | US5912046 By placing the liquid having solids in suspension in a centrifuge and spinning it about an axis so that liquid is forced against the surface of component |
| 06/15/1999 | US5911865 Repeatedly electroplating loosely connected particles settled on cathode plate with the step of stirring to separate particles and settling performed between each plating cycle |
| 06/15/1999 | US5911863 Method of manufacturing plastic foils which are electrically conductive in one direction but insulating in other directions |
| 06/09/1999 | EP0921211A1 Multilayered composite material for bearing having a support layer |
| 06/09/1999 | EP0920545A1 Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations |
| 06/09/1999 | EP0797693B1 Laminated material for sliding components and method and means for its production |
| 06/09/1999 | EP0580730B2 Electrode for an electrolytic cell, use thereof and method using same |
| 06/09/1999 | CN1218873A Cylinder-liner free casted cylinder body and its producing method |
| 06/08/1999 | US5909721 Cylinder block with stepless plating coating and method for forming stepless plating coating |
| 06/02/1999 | EP0919644A1 Process for obtaining a metallic composite band |
| 06/02/1999 | CN1218520A Tin plating method and bath having wide optimum current density range |
| 06/01/1999 | US5908544 Copper foil |
| 06/01/1999 | US5908542 Contacting a metal foil with an acidic solution; placing the metal foil in a nickel treatment bath and applying a current through the nickel treatment bath, wherein the nickel treatment bath contains at least about two plating zones, |
| 05/27/1999 | WO1999025905A1 Clamshell apparatus for electrochemically treating semiconductor wafers |
| 05/27/1999 | WO1999025904A1 Electric potential shaping apparatus for holding a semiconductor wafer during electroplating |
| 05/27/1999 | WO1999025903A1 Virtual anode design for use in wafer plating |
| 05/27/1999 | WO1999025902A1 Membrane partition system for plating of wafers |
| 05/27/1999 | WO1999014401A9 Cathode current control system for a wafer electroplating apparatus |
| 05/26/1999 | CN1217755A Collector ringless conductor roll |
| 05/26/1999 | CN1217570A Method for producing semiconductor package in chip size |
| 05/25/1999 | CA2175596C Metal tube having a section with an internal electroplated structural layer |
| 05/20/1999 | WO1999025004A1 Integrated manufacturing tool comprising electroplating, chemical-mechanical polishing, clean and dry stations, and method therefor |
| 05/20/1999 | WO1999024647A1 Method for producing abrasive tips for gas turbine blades |
| 05/20/1999 | DE19750923A1 Gear part coating formation method for bending engagement formula gearing |
| 05/12/1999 | EP0915188A2 Conducting roll for a strip coating installation |
| 05/11/1999 | US5902471 Process for selectively electroplating an airfoil |
| 05/06/1999 | WO1999010566A3 Process chamber and method for depositing and/or removing material on a substrate |
| 05/06/1999 | EP0913497A1 Method and apparatus for plating a substrate |
| 05/06/1999 | EP0912994A1 Modular semiconductor workpiece processing tool |
| 05/06/1999 | EP0590046B1 Basic accelerating solutions for direct electroplating |
| 05/04/1999 | US5900738 Method of testing semiconductor devices |
| 04/28/1999 | EP0910489A1 Element of a continuous metal casting ingot mould with a copper or copper alloy cooled wall comprising on its external surface a metal coating, and method of coating |
| 04/28/1999 | CA2251119A1 Current roller for an electrolytic strip coating plant |
| 04/27/1999 | US5897762 Method for coloring tool bit |
| 04/27/1999 | US5897326 Method of exercising semiconductor devices |
| 04/22/1999 | WO1999019544A1 Copper metallization of silicon wafers using insoluble anodes |
| 04/22/1999 | WO1999019543A1 Method for producing very small metal ball |
| 04/22/1999 | WO1999019542A1 Electrolytic tin plating process with reduced sludge production |
| 04/22/1999 | CA2305456A1 Copper metallization of silicon wafers using insoluble anodes |
| 04/21/1999 | EP0909346A1 Method and installation for the electrolytic coating with a metal layer of the surface of a cylinder for the continuous casting of thin metal strips |
| 04/21/1999 | EP0736111B1 Metallic screen material having a strand or fibre structure, and method for manufacturing such a material |
| 04/20/1999 | US5895562 Gas shielding during plating |
| 04/14/1999 | EP0908539A2 Composite layered material for slide members and process for manufacture of bearing shells |
| 04/14/1999 | EP0908537A1 Process and apparatus for selectively electroplating an airfoil |
| 04/14/1999 | CN1214088A Compound electrode for electrolysis |
| 04/14/1999 | CN1213713A Improved zinc-chromium stabilizer containing hydrogen inhibiting additive |
| 04/13/1999 | US5893966 Continuously electrodepositing material on semiconductor components by retaining the components on a moving cathode immersed in electrolyte wherein wire mesh anode rotates about the moving cathode during electrodeposition |
| 04/08/1999 | WO1999017355A1 Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces |
| 04/08/1999 | WO1999017344A1 Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components |
| 04/08/1999 | WO1999016936A1 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 04/08/1999 | WO1999016935A2 Simplified process and apparatus for production of copper foil |
| 04/08/1999 | WO1999016689A1 Semiconductor processing apparatus having wafer re-orientation mechanism |
| 04/01/1999 | WO1999015714A2 Electro-plating process |
| 04/01/1999 | DE19742523A1 Method for treating fittings and their components |
| 04/01/1999 | CA2304551A1 Electro-plating process |
| 03/30/1999 | US5889317 Leadframe for integrated circuit package |
| 03/30/1999 | US5888372 Continuously from nonconducting film by electroless and galvanic metallization |
| 03/30/1999 | US5888358 Electrically depositing drum |
| 03/25/1999 | WO1999014404A1 Method of making a structure with improved material properties by moderate heat treatment of a metal deposit |
| 03/25/1999 | WO1999014401A1 Cathode current control system for a wafer electroplating apparatus |
| 03/24/1999 | EP0903774A2 Substrate plating apparatus |
| 03/24/1999 | EP0903426A2 Improved zinc-chromium stabilizer containing a hydrogen inhibiting additive |
| 03/24/1999 | CN1212030A Method of producing layered material for sliding bearings and electroplating bath for carrying out this method |
| 03/24/1999 | CN1211639A Method for manufacturing precise enclosed-cavity parts |
| 03/24/1999 | CN1211638A Quick acidic bright copper-plating technique for low-carbon steel wire |
| 03/23/1999 | US5884398 Mounting spring elements on semiconductor devices |
| 03/18/1999 | WO1999000536A3 Porous film and method of preparation thereof |
| 03/16/1999 | US5883762 Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations |
| 03/16/1999 | US5882503 Electrochemical formation of field emitters |
| 03/16/1999 | US5882498 Method for reducing oxidation of electroplating chamber contacts and improving uniform electroplating of a substrate |
| 03/09/1999 | US5879862 Forming layer having protuberances on nonplanar layer, applying seed layer, forming photoresist layer, patterning to expose top of seed layer, forming conductive layer thereon, removing residues including seed layer |
| 03/09/1999 | US5879816 Metallic sliding material |
| 03/09/1999 | US5879520 Rotary electrodeposition apparatus |
| 03/09/1999 | US5878486 Method of burning-in semiconductor devices |
| 03/04/1999 | WO1999010566A2 Process chamber and method for depositing and/or removing material on a substrate |
| 03/03/1999 | EP0898659A1 Thin-walled bearings |
| 03/03/1999 | CN1209721A Spherical array type packing plate tin-ball electroplating method |
| 02/25/1999 | DE19736805A1 Wet chemical treatment especially electroplating of rod-like parts |
| 02/24/1999 | EP0729523B1 Process and apparatus for in situ electroplating a structural layer of metal bonded to an internal wall of a metal tube |
| 02/23/1999 | US5873992 Method of electroplating a substrate, and products made thereby |
| 02/23/1999 | CA2018741C Current conducting roller |