| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 12/01/1999 | CN1236969A Technology for manufacturing white dumet wire |
| 12/01/1999 | CN1236829A Surface-treated metal component for reinforcing structures and article of manufactured comprising the same |
| 11/25/1999 | WO1999060189A2 Method for metal coating of substrates |
| 11/25/1999 | CA2331757A1 Process for coating substrates with metals |
| 11/23/1999 | US5989727 Electrolytic copper foil having a modified shiny side |
| 11/23/1999 | US5989405 Process for producing a dresser |
| 11/23/1999 | CA2119050C Self accelerating and replenishing non-formaldehyde immersion coating method and composition |
| 11/18/1999 | WO1999052336B1 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| 11/18/1999 | DE19822075A1 Metallization of polymeric substrates for production of circuit boards |
| 11/17/1999 | EP0956600A1 PREPARATION OF Cu x?In y?Ga z?Se n? (x=0-2, y=0-2, z=0-2, n=0-3) PRECURSOR FILMS BY ELECTRODEPOSITION FOR FABRICATING HIGH EFFICIENCY SOLAR CELLS |
| 11/17/1999 | EP0698132B1 Carbon compositions and processes for preparing a non-conductive substrate for electroplating |
| 11/16/1999 | US5985125 Forming barrier metal patterns on wafer, depositing copper only on barrier metal patterns by electrochemistry |
| 11/16/1999 | US5983493 Method of temporarily, then permanently, connecting to a semiconductor device |
| 11/11/1999 | WO1999057448A1 Multi-layer engine bearings and method of manufacture |
| 11/11/1999 | WO1999057342A1 Method and device for plating substrate |
| 11/10/1999 | CN1234454A Method for forming zinc-oxide film and method of preparing semiconductor element matrix and photoelectric elements |
| 11/09/1999 | US5980722 Anodic etching of silicon-containing aluminum alloy to protrude silicon from surface of aluminum alloy |
| 11/04/1999 | WO1999055937A1 Device, method and installation for electrodeposition on large dimension parts |
| 11/03/1999 | EP0839440B1 Copper foil for the manufacture of printed circuits and method of producing same |
| 11/03/1999 | CN2346800Y Electrochemical means for treating continuous electroconductive fibre |
| 11/02/1999 | US5977620 Lead frame having a Ni-Mn alloy layer and a Pd layer |
| 11/02/1999 | US5976712 Multilayer material for sliding elements and process and means for the production thereof |
| 11/02/1999 | US5976331 Electrodeposition apparatus for coating wafers |
| 11/02/1999 | US5974662 Method of planarizing tips of probe elements of a probe card assembly |
| 10/28/1999 | WO1999054920A2 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 10/28/1999 | WO1999054527A2 Electro-chemical deposition system and method of electroplating on substrates |
| 10/28/1999 | WO1999045176A3 Electrolytic copper foil having a modified shiny side |
| 10/27/1999 | EP0952242A1 Electro deposition chemistry |
| 10/26/1999 | US5972192 Pulse electroplating copper or copper alloys |
| 10/21/1999 | WO1999053123A1 Metal tube armored linear body, metal tube armoring linear body, method and apparatus for manufacturing metal tube armored linear body |
| 10/21/1999 | WO1999040241A3 Method for electroplating metal coating(s) on particulates at high coating speed with high current density |
| 10/20/1999 | EP0950128A1 Prevention of marine encrustation on bronze propellers |
| 10/20/1999 | CN1232575A Surface-treated steel plate for battery case, battery case and battery using case |
| 10/20/1999 | CN1232513A Electrolysis apparatus having liquid squeezer out of contact with strip |
| 10/19/1999 | US5968333 Method of electroplating a copper or copper alloy interconnect |
| 10/14/1999 | WO1999052336A1 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| 10/14/1999 | WO1999041434A3 Plating apparatus and method |
| 10/14/1999 | CA2327574A1 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| 10/13/1999 | EP0949356A1 Surface-treated metal component for reinforcing structures for manufactured products made of elastomeric material and an article of manufacture comprising the same |
| 10/13/1999 | EP0859877A4 Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects |
| 10/13/1999 | CN1231505A Method and apparatus for making semiconductor device |
| 10/13/1999 | CN1045693C Contact structure for interconnections, interposer, semiconductor assembly and method |
| 10/07/1999 | WO1999031300A3 Water bath and method for electrolytic deposition of copper coatings |
| 10/06/1999 | CN2341997Y Electroplating equipment for punched steel band |
| 09/30/1999 | DE19911962A1 Piston ring or compression ring for gasoline and diesel engines |
| 09/28/1999 | CA2109708C Electrode for electrolyte cell, use thereof and process |
| 09/23/1999 | WO1999047731A1 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 09/22/1999 | CN1229274A Method of manufacturing semiconductor device |
| 09/21/1999 | US5955147 Selective application of a fluoropolymer protective coating to only a partial portion of the show surface of the shaped strip and the application of a thermoplastic to the portions of the show surface not covered by the protective coating. |
| 09/21/1999 | CA2175105C Process for improving the formability and weldability properties of zinc coated steel sheet |
| 09/16/1999 | WO1999046430A1 Outside part of a cooktop or an oven |
| 09/16/1999 | WO1999025904A9 Electric potential shaping apparatus for holding a semiconductor wafer during electroplating |
| 09/10/1999 | WO1999045176A2 Electrolytic copper foil having a modified shiny side |
| 09/10/1999 | WO1999045170A1 Substrate plating device |
| 09/08/1999 | CN2337160Y Continuous belt-shape foamed nickel integral electroplating bath |
| 09/02/1999 | WO1999043860A1 A surface-treated steel wire for reinforcing structures for articles of manufacture made of elastomeric material and an article of manufacture comprising the same |
| 09/01/1999 | EP0938597A1 Method for anisotropic etching of structures in conducting materials |
| 09/01/1999 | CN1227283A Conductive roller in electroplating strip device |
| 09/01/1999 | CN1044946C An inner-shield material to be attached inside a color cathode ray tube and manufacturing method thereof |
| 08/31/1999 | US5944965 Method and apparatus for sequentially metalizing polymeric films and products made thereby |
| 08/24/1999 | US5942350 Used as mechanical support for electrochemical cell structures; aircraft and spacecraft |
| 08/24/1999 | US5942096 Method and apparatus for electro-depositing a metal or alloy coating onto one or both sides of a metal strip |
| 08/19/1999 | WO1999041434A2 Plating apparatus and method |
| 08/18/1999 | EP0936639A2 Process for forming device comprising metallized magnetic substrates |
| 08/18/1999 | EP0935680A1 Method to produce a diamond wire for use in cutting stone materials, and diamond wire produced with said method |
| 08/18/1999 | CN1226080A Interconnect structure in semiconductor device and method of formation |
| 08/18/1999 | CN1044729C Metal tube having a section with internal electroplated structural layer |
| 08/17/1999 | US5939677 Roller electrode for use in a continuous electroplating process |
| 08/17/1999 | US5939172 Metallic screen material having a strand or fibre structure, and method for manufacturing such a material |
| 08/17/1999 | US5939135 Milling; hard chromium plating edge; accuracy, corrosion resistance |
| 08/17/1999 | US5938913 Process and device for electrolytic treatment of continuous running material |
| 08/12/1999 | WO1999040615A1 Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device |
| 08/12/1999 | WO1999040241A2 Method for electroplating metal coating(s) on particulates at high coating speed with high current density |
| 08/12/1999 | WO1999025905A9 Clamshell apparatus for electrochemically treating semiconductor wafers |
| 08/12/1999 | WO1999025904A8 Electric potential shaping apparatus for holding a semiconductor wafer during electroplating |
| 08/12/1999 | DE19828545C1 Galvanic bath for forming a hard chromium layer on machine parts |
| 08/11/1999 | EP0935296A2 Method of forming thin zinc oxide film, and method of producing semiconductor element substrate and photovoltaic element using thin zinc oxide film |
| 08/11/1999 | CN1225396A Non-oriented electrical steel sheet having good punchability and process for producing same |
| 08/10/1999 | US5935407 Applying a bond coat by low pressure plasma spraying, anchoring abrasive particles to the bond coat by entrapment plating in a metal matrix; mechanical strength, durability |
| 08/10/1999 | US5935406 Classifying the starting metal particles into different narrow diameter size range fractions, and separately electroplating each different smaller size range with a metal or metal alloy to form a desired final diameter |
| 08/10/1999 | US5935330 Automatic wafer plating equipment |
| 08/10/1999 | US5934239 Plated cylinder arrangement |
| 08/10/1999 | US5934157 Flexible meshing type gear device having a high wear-resisting rigid internal gear |
| 08/04/1999 | EP0932913A1 Electroplated interconnection structures on integrated circuit chips |
| 08/04/1999 | CN1225046A Element of a continuous metal casting ingot mould with a copper or copper alloy cooled wall comprising on its external surface a metal coating,and method of coating |
| 08/03/1999 | US5933758 Method for preventing electroplating of copper on an exposed surface at the edge exclusion of a semiconductor wafer |
| 08/03/1999 | US5933711 Fabrication method for chip size semiconductor package |
| 07/29/1999 | WO1999037831A1 Method of manufacturing of copper tubes with their internal surface tin plated by electrolysis |
| 07/28/1999 | EP0931858A1 Device for the galvanic treatment of a rotatably drivable body |
| 07/28/1999 | CN2330667Y Electroplating equipment for punched steel strip |
| 07/27/1999 | US5928487 Electrolytic plating of steel substrate |
| 07/27/1999 | US5926951 Method of stacking electronic components |
| 07/22/1999 | WO1999036595A1 Articles having a colored metallic coating with special properties |
| 07/22/1999 | CA2318391A1 Articles having a colored metallic coating with special properties |
| 07/21/1999 | EP0930647A1 Method to selectively fill recesses with conductive metal |
| 07/20/1999 | US5925231 Method for electroplating rotogravure cylinder using ultrasonic energy |
| 07/20/1999 | US5924674 Microvalve and method for manufacturing a microvalve |
| 07/20/1999 | CA2143606C Method of making electronic housings more reliable by preventing formation of metallic whiskers on the sheets used to fabricate them |
| 07/15/1999 | WO1999035309A1 Plating jig of wafer |
| 07/13/1999 | CA2149305C Method of making machine-engraved seamless tube |