| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 03/28/2002 | WO2002024444A1 Copper foil for high-density ultrafine wiring board |
| 03/28/2002 | WO2001088954A3 Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing |
| 03/28/2002 | US20020036145 Copper; an acid selected from sulfuric, methanesulfonic, amidosulfuric, aminoacetic, or fluoboric; a halogen; an accelerating agent, a suppressing agent, or an accelerating-suppressing agent |
| 03/28/2002 | US20020036144 Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming copper interconnect of semiconductor device using the same |
| 03/28/2002 | DE10042228A1 Verfahren zur Beschichtung einer Vielzahl gleicher Grundkörper und Verwendung des Verfahrens A process for coating a plurality of identical basic body and use of the method |
| 03/27/2002 | EP1191551A2 Resistor component with multiple layers of resistive material |
| 03/27/2002 | EP1191127A1 Process for selective metallization of dielectric materials |
| 03/27/2002 | CN1342220A Electrodeposition of metals in small recesses using modulated electric fields |
| 03/26/2002 | US6362100 Methods and apparatus for forming a copper interconnect |
| 03/26/2002 | US6362099 Providing a barrier layer having a first surface that is substantially unoxidized; depositing a first copper layer onto the first surface of the barrier layer, wherein the first copper layer is deposited from a precursor |
| 03/26/2002 | US6361675 Method of manufacturing a semiconductor component and plating tool therefor |
| 03/26/2002 | US6361669 Apparatus and method for plating wafers, substrates and other articles |
| 03/26/2002 | US6361627 Process of controlling grain growth in metal films |
| 03/21/2002 | WO2002022915A2 Removable modular cell for electro-chemical plating |
| 03/21/2002 | WO2002022914A1 Method for electroplating a strip of foam |
| 03/21/2002 | WO2002022913A2 Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 03/21/2002 | WO2002022321A2 Multiple blade robot adjustment apparatus and associated method |
| 03/21/2002 | WO2001066830A3 Method for applying a metal layer to a light metal surface |
| 03/21/2002 | US20020034890 Movable terminal, coaxial connector, and communication apparatus |
| 03/21/2002 | US20020033342 Forming chip connectors; electrolytic cells |
| 03/21/2002 | US20020033340 Method and apparatus for conditioning electrochemical baths in plating technology |
| 03/21/2002 | US20020033339 Uniform thickness |
| 03/20/2002 | EP1115912B1 Device for partial electrochemical treatment of bar-shaped objects |
| 03/20/2002 | CN1341277A Apparatus for plating semiconductor substrate, method for plating semiconductor substrate |
| 03/20/2002 | CN1341166A Semiconductor wafer electroplating and electrolyzing apparatus and method |
| 03/19/2002 | US6358390 Obtaining a surface charge on ceramic materiall depositing an electroconductive material on surface of ceramic material; activating electroconductive material; electrolytically plating metal on surface of electroconductive material |
| 03/19/2002 | US6357917 Thin-walled bearings |
| 03/14/2002 | WO2002020876A2 Segmenting of processing system into wet and dry areas |
| 03/14/2002 | US20020032499 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 03/14/2002 | US20020031684 Lead-free; copper alloy |
| 03/14/2002 | US20020029975 Applying chemical agents to selectively remove a portion of the body overlying the crystalline plane, exposing said phase of a monolithic bulk crystal silicon having an anisotropic body with a crystalline plane |
| 03/14/2002 | US20020029973 Coated anode apparatus and associated method |
| 03/14/2002 | US20020029963 Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
| 03/14/2002 | US20020029962 Conductive biasing member for metal layering |
| 03/14/2002 | US20020029961 Electro-chemical deposition system |
| 03/14/2002 | US20020029473 Method of manufacturing a plated electronic termination |
| 03/13/2002 | CN1339822A Base for producing semiconductor device by using three element alloy |
| 03/13/2002 | CN1339819A Lead wire frame and its producing method |
| 03/12/2002 | US6355366 Exposing cleaned and activated workpiece to galvanic chromium plating bath to form a plating of hard chromium, filling and smoothing beaded or columnar structured surface by applying lubricant based on molybdenum disulfide, exposing |
| 03/12/2002 | US6355154 Article plated with boron carbide in a nickel-phosphorus matrix, and process and bath for its preparation |
| 03/12/2002 | US6355153 Chip interconnect and packaging deposition methods and structures |
| 03/12/2002 | US6355147 Porous electrode apparatus for electrodeposition of detailed metal structures or microelectronic interconnections |
| 03/12/2002 | US6354916 Modified plating solution for plating and planarization and process utilizing same |
| 03/12/2002 | US6354358 Surface is partly or wholly covered with tungsten alloy plating of tungsten and either or both of nickel and cobalt, and said plating further comprising tungsten carbide in the tungsten alloy. |
| 03/07/2002 | WO2002018677A1 Method for coating a number of similar base bodies and use of said method |
| 03/07/2002 | US20020027083 For the electrochemical reduction of organic compounds |
| 03/07/2002 | US20020027082 Method of improving contact reliability for electroplating |
| 03/07/2002 | US20020027081 For forming copper interconnects by plating a semiconductor substrate with copper to fill copper in fine recesses for interconnects formed in the surface of substrate |
| 03/07/2002 | US20020027080 Plating apparatus and method |
| 03/07/2002 | US20020027071 Inflatable compliant bladder assembly |
| 03/07/2002 | DE10041839A1 Process for coating steel pipelines comprises electrolytically applying anode spheres made of a material having a high specific electrical resistance to a flexible wire used as the anode |
| 03/07/2002 | DE10040935A1 Verfahren zur metallischen Beschichtung der Oberfläche von Hochtemperatur-Supraleitern A method for metal coating the surface of high temperature superconductors |
| 03/06/2002 | EP1185153A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185152A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185151A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185150A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1184904A2 Substrate for manufacturing a semiconductor device with three element alloy |
| 03/06/2002 | EP1184165A1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil |
| 03/06/2002 | CN2480381Y Corrosion-resistant device for electroplating crystallizer |
| 03/06/2002 | CN1338879A Movable terminal, coaxial connector and communication device |
| 03/05/2002 | US6352759 Non-lambertian glass diffuser and method of making |
| 03/05/2002 | US6352623 Vertically configured chamber used for multiple processes |
| 03/05/2002 | US6352600 Forming bullets from two dissimilar metals and/or alloys that have been bonded together and heat-treating such bullets |
| 03/05/2002 | US6352467 Integrated electrodeposition and chemical mechanical polishing tool |
| 03/01/2002 | CA2317233A1 Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing |
| 02/28/2002 | WO2002017396A1 Substrate for manufacturing a semiconductor device with three element alloy |
| 02/28/2002 | WO2002016674A1 Method for metal coating the surface of high temperature superconductors |
| 02/28/2002 | WO2002016059A2 Narrow diameter needle having reduced inner diameter tip |
| 02/28/2002 | US20020023844 A one-step, process for producing electrolytic copper foil having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, employs two super anodes on a rotating drum cathode to deposit treatment |
| 02/28/2002 | US20020023773 Method for manufacturing raised electrical contact patten of controlled geometry |
| 02/28/2002 | DE10039171A1 Kathode für Elektrolysezellen Cathode for electrolysis cells |
| 02/27/2002 | EP1181993A1 A method for manufacturing a multiple walled tube |
| 02/26/2002 | US6351682 Semiconductor processing workpiece position sensing |
| 02/26/2002 | US6350688 Annealing deposited metal layer on semiconductor substrate in vacuum; planarization; reducing via resistance via interconnects; |
| 02/26/2002 | US6350366 Uniform coatings on substrates and to provide substantially defect free filling of small features |
| 02/26/2002 | US6350364 Method for improvement of planarity of electroplated copper |
| 02/26/2002 | US6350363 Electric field directed construction of diodes using free-standing three-dimensional components |
| 02/21/2002 | WO2002015245A2 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 02/21/2002 | WO2002014585A1 Cathode electrode material and rotating cathode drum for producing electrolytic copper foil using the cathode electrode material |
| 02/21/2002 | WO2001050821A3 Conditioning of through holes and glass |
| 02/21/2002 | WO2000070127A9 Method and apparatus related to an electroplated structure |
| 02/21/2002 | US20020020629 Lead frame and method of manufacturing the lead frame |
| 02/21/2002 | US20020020628 A mask is in spaced relation proximite to but does not contact the top surface of a workpiece, while moving relative to it |
| 02/21/2002 | US20020020627 Filling a metal such as copper in fine interconnection pattern recesses on a semiconductor |
| 02/21/2002 | US20020020622 Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station |
| 02/21/2002 | US20020020621 Semiconductor workpiece proximity plating apparatus |
| 02/21/2002 | DE10121774A1 Material for ball-grid arrays comprises a plating layer formed from two metals which are mixed together on a metal material as the base material and a covering layer formed from the metal on the plating layer |
| 02/21/2002 | DE10065156C1 Production of deluxe, metal-plated car door handles, comprises applying a series of metal layers by mixture of plasma coating and electroplating to a standard plastic molded door handle |
| 02/20/2002 | EP1180682A2 Galvanic-cell gas sensor |
| 02/20/2002 | EP1088121B1 Method for metal coating of substrates |
| 02/20/2002 | CN1337064A Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits |
| 02/19/2002 | US6348737 Metallic interlocking structure |
| 02/19/2002 | US6348138 Electroplating device for electroplating a work by rotation |
| 02/14/2002 | WO2002013289A1 Surface-treated steel plate for battery case and battery case |
| 02/14/2002 | WO2002012595A1 Method of reducing a band mark of an electroplating steel sheet |
| 02/14/2002 | US20020017465 Filling copper into recesses for interconnects formed on a semiconductor and removing a plating liquid remaining on the substrate-contacting portion with suction |
| 02/14/2002 | US20020017456 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 02/13/2002 | EP1179618A2 Plating apparatus and plating liquid removing method |
| 02/13/2002 | EP1179617A1 Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
| 02/13/2002 | EP1179616A2 Method and apparatuses for electrochemically treating an article |