Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
04/2003
04/16/2003CN1411054A Semiconductor integrated circuit, method and apparatus for mfg. same
04/16/2003CN1410601A Copper electroplating liquid composition used for copper integrated circuit interconnector
04/15/2003US6547945 Electrode with an electrode chamber for receiving electrolyte and an article forming the second electrode disposed inwardly and spaced from the first electrode for electrolyte passage between
04/15/2003US6547937 Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
04/15/2003US6547936 Electroplating apparatus having a non-dissolvable anode
04/10/2003WO2003030584A2 Implantable hearing aid with improved sealing
04/10/2003WO2003030186A2 Nickel coated copper as electrodes for embedded passive devices
04/10/2003US20030068837 Apparatus and method for deposition of an electrophoretic emulsion
04/10/2003US20030068517 Nickel coated copper as electrodes for embedded passive devices
04/10/2003US20030066754 Method for manufacturing copper-resin composite material
04/10/2003DE19939144C2 Verfahren zur metallischen Beschichtung von Hochtemperatur-Supraleiter A method for metal coating of high-temperature superconductors
04/09/2003EP1300489A1 Electrolytic copper-plated r-t-b magnet and plating method thereof
04/09/2003EP1088122B1 Method and apparatus for electroplating
04/09/2003CN1105195C Surface-treated wire for use in composite elements of elastomeric material and manufacturing process
04/08/2003US6544399 Electrodeposition chemistry for filling apertures with reflective metal
04/08/2003US6544398 Non-cyanide-type gold-tin alloy plating bath
04/08/2003US6544392 Apparatus for manufacturing pcb's
04/08/2003US6544391 Reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly
04/03/2003WO2003028048A2 Low-force electrochemical mechanical processing method and apparatus
04/03/2003WO2003027011A2 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires
04/03/2003US20030065242 Radioactive implantable devices and methods and apparatuses for their production and use
04/03/2003US20030064669 Low-force electrochemical mechanical processing method and apparatus
04/03/2003US20030064586 Method and apparatus for controlling contamination during the electroplating deposition of metals onto a semiconductor wafer surface
04/03/2003US20030064278 Separator of fuel cell and method for producing same
04/03/2003US20030064165 Process for preparing copper-film-plated steel cord for vehicle tire
04/03/2003US20030062398 Method for manufacturing raised electrical contact pattern of controlled geometry
04/03/2003US20030062258 Electroplating apparatus with segmented anode array
04/03/2003US20030062100 Implantable hearing aid with improved sealing
04/02/2003EP1298233A2 System and method for electroplating fine geometries
04/02/2003EP1298232A1 Process of repairing steel surfaces on flat and/or structured press plates or endless bands
04/02/2003CN1407335A X-ray coating thickness device
04/02/2003CN1407141A Tinplating
04/01/2003US6541126 Copper microparticles deposited on the surface of carrier foil and covered with the release interface layer and electrodeposited copper layer; very accurate holes formed by laser; high yield in production of printed wiring boards
04/01/2003US6540928 Magnetic pole fabrication process and device
04/01/2003US6540899 Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces
04/01/2003US6540889 Conducting roller assembly for an electroplating apparatus
03/2003
03/27/2003WO2003025368A1 Cylinder liner for diesel engines with egr and method of manufacture
03/27/2003WO2003025259A1 Electrode attachment to anode assembly
03/27/2003WO2003025258A1 Method for the coating of electrically conducting support materials
03/27/2003WO2003025255A2 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
03/27/2003WO2003024594A2 A nano-supported catalyst for nanotube growth
03/27/2003WO2002077327B1 Mask plate design
03/27/2003US20030058629 Wiring substrate for small electronic component and manufacturing method
03/27/2003US20030057099 System and method for electroplating fine geometries
03/27/2003US20030057098 Tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane; prevents air bubbles from remaining on the surface to be plated.
03/27/2003US20030057093 Production of microelectronic devices; application of electrophoretic resists in automated equipment that meets the standards for cleanliness and production throughput desired by the microelectronic fabrication industry.
03/26/2003EP1295312A2 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
03/26/2003CN1405365A Method for producing soluble copper in the production of electrolytic copper foil
03/26/2003CN1405359A Method for electroplating electrode of ceramic wafer electronic component
03/26/2003CN1104044C Method for producing semiconductor package in chip size
03/25/2003US6538214 Method for manufacturing raised electrical contact pattern of controlled geometry
03/25/2003US6538212 Circuit board for semiconductor device and manufacturing method thereof
03/25/2003US6537683 Stratified composite material for sliding elements and method for the production thereof
03/20/2003WO2003023848A2 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing
03/20/2003WO2002083968A3 Coated article having a stainless steel color
03/20/2003WO2002078903A3 Method and apparatus for avoiding particle accumulation during an electrochemical process
03/20/2003WO2002075797A3 Method of forming copper interconnects
03/20/2003WO2002070144A9 Internal heat spreader plating methods and devices
03/20/2003WO2002031218B1 Sputter targets
03/20/2003US20030054094 Using glycolic acid reducing agent
03/20/2003US20030052330 Providing a first electrode layer and an overlying chalcogenide material; plating a conductive metal onto the chalcogenide to form diffusion layer, diffusing metal ions into chalcogenide to form resistance variable material
03/20/2003US20030052014 Plating bath contains tin (II) sulfamate, acting as a tin (II) salt; as a complexing agent citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these, or gluconic lactone; and a brightener
03/20/2003US20030052013 R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co
03/20/2003US20030052011 Plasma electroplating
03/20/2003US20030051999 Elastic contact element
03/20/2003US20030051995 Plating device and plating method
03/20/2003US20030051713 Cylinder liner for diesel engines with EGR and method of manufacture
03/19/2003CN1404535A Composite copper foil and manufacturing method thereof
03/19/2003CN1404120A Method for removing stain from through-hole
03/19/2003CN1103278C Non-lambertian glass diffuser and its making method
03/18/2003US6534410 Method for forming conductor members, manufacturing method of semiconductor element and manufacturing method of thin-film magnetic head
03/18/2003US6534195 Corrosion resistance and sealing can be improved without using Pb; Sn-Zn alloy is plated on first metallic member and/or second metallic member, and soldered with Sn-Ag alloy
03/18/2003US6534192 Multi-purpose finish for printed wiring boards and method of manufacture of such boards
03/18/2003US6533915 Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil
03/13/2003WO2003021008A1 Tin electroplating solution and method for plating
03/13/2003US20030048961 Sliding member
03/13/2003US20030048582 Soft magnetic film and thin film magnetic head using soft magnetic film, process for manufacturing soft magnetic film and process for manufacturing thin film magnetic head
03/13/2003US20030047448 Anode chamber and cathode chamber are separate by ionically connected chambers thereby keeping the anolyte substantially free of the plating additives reducing the likelihood of generating electrolyte species that inhibit bottom-up plating
03/12/2003EP1204786B1 Arrangement enabling a liquid to flow evenly around a surface of a sample and use of said arrangement
03/12/2003CN1401823A Process and special apparatus for electrogalvenizing inner and outer walls of steel pipe
03/11/2003US6531046 Contacting metal seed layer on substrate with acidic electrolyte bath containing acids, copper compounds, suppressors and water, then subjecting to current
03/11/2003US6531045 Acid resistance
03/06/2003WO2003019641A1 Dummy structures to reduce metal recess in electropolishing process
03/06/2003WO2003018881A1 Device for continuous electrodeposition and electrical or electronic components manufactured in strip comprising a plated layer by electrodeposition
03/06/2003WO2003018878A2 Segmented counterelectrode for an electrolytic treatment system
03/06/2003WO2003018874A2 Apparatus and methods for electrochemical processing of microelectronic workpieces
03/06/2003WO2002097165A3 Apparatus and methods for electrochemical processing of microelectronic workpieces
03/06/2003US20030044303 Ultra high saturation moment soft magnetic thin film and its manufacturing method
03/06/2003US20030042148 Electroconductive rods in narrow passageway; dielectric spacer; applying corrosion resistant protective coatings
03/06/2003US20030042147 Method of forming a nano-supported catalyst on a substrate for nanotube growth
03/06/2003US20030042144 Multilayer coating of copper and silver, nickel alloy
03/06/2003CA2456301A1 Dummy structures to reduce metal recess in electropolishing process
03/06/2003CA2449807A1 Segmented counterelectrode for an electrolytic treatment system
03/05/2003EP1289352A2 High-frequency circuit device and method for manufacturing the same
03/05/2003EP1288340A2 Galvanic apparatus
03/05/2003EP1287185A1 Anode assembly for plating and planarizing a conductive layer
03/05/2003CN1401209A Copper clad laminated sheet
03/05/2003CN1400681A Manufacture of sintered nickel positive electrode for alkali secondary battery
03/04/2003US6528424 Method of electroplating a copper-zinc alloy thin film on a copper surface using a chemical solution
03/04/2003US6527935 Process for electroplating pins of an integrated circuit package
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