| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 05/28/2003 | EP1125007A4 Submicron metallization using electrochemical deposition |
| 05/28/2003 | CN1420212A Small plated body electroplating device |
| 05/27/2003 | US6569307 Object plating method and system |
| 05/27/2003 | US6569299 Membrane partition system for plating of wafers |
| 05/27/2003 | US6569297 Workpiece processor having processing chamber with improved processing fluid flow |
| 05/22/2003 | WO2003042433A1 Electropolishing assembly and methods for electropolishing conductive layers |
| 05/22/2003 | WO2003015870A3 Radioactive implantable devices and their production methods |
| 05/22/2003 | WO2002090624A3 A process and apparatus for cleaning and/or coating metal surfaces |
| 05/22/2003 | US20030096456 Semiconductor devices having their exposed edges defined by cutting apart two of the semiconductor preassembly; then moving the first semiconductor device against another element to break loose flash on the first exposed edge; appearance |
| 05/22/2003 | US20030096059 Semiconductors; void occurence suppressed in junction layer; occurrence of cracks, swelling, and exfoliation in the plating layer suppressed |
| 05/22/2003 | US20030095731 Sliding member |
| 05/22/2003 | US20030094376 Comprises disodium bis(3-sulfopropyl)disulfide; for use on printed wiring board or semiconductor wafer |
| 05/22/2003 | US20030094374 Comprises etching dielectric layer around the periphery of a semiconductor wafer substrate; increased strength, eliminates delamination |
| 05/22/2003 | US20030094373 Comprises grooved cathode for uniformly concentrating electric fields; microelectronics |
| 05/22/2003 | US20030094372 Mist trap mechanism and method for plating apparatus |
| 05/22/2003 | US20030094371 Producing ferrule via electroforming on stretched-rod metallic or plastic wire used as mother mold, forming grooves on the rod at intervals, breaking, then machining |
| 05/22/2003 | US20030093899 Copper-clad laminated sheet |
| 05/22/2003 | CA2464423A1 Electropolishing assembly and methods for electropolishing conductive layers |
| 05/21/2003 | EP1312818A2 Rolling bearing |
| 05/21/2003 | EP1312817A2 Rotary member and production process |
| 05/21/2003 | EP1198624A4 Process for electroplating a work piece coated with an electrically conducting polymer |
| 05/21/2003 | CN1109134C Electrolytic processing apparatus |
| 05/21/2003 | CN1109133C Technolong for manufacturing white dumet wire |
| 05/20/2003 | US6565731 Electrodeposition plating using solution containing reducing agent and polyelectrolyte |
| 05/20/2003 | US6565729 Using alkaline electrolyte bath; uniform overcoatings |
| 05/20/2003 | US6564604 Process for the manufacture of a part with very high mechanical properties, formed by stamping of a strip of rolled steel sheet and more particularly hot rolled and coated |
| 05/15/2003 | WO2003041126A2 Electrochemical mechanical processing with advancible sweeper |
| 05/15/2003 | US20030092261 Substrate processing method |
| 05/15/2003 | US20030089615 Forming conductive layers on a semiconductor wafer surface without losing space on the surface by clamping; a relative motion, rotational and lateral, established between the contacts and the wafer surface; consistancy |
| 05/15/2003 | US20030089612 Method and system to provide electrical contacts for electrotreating processes |
| 05/15/2003 | US20030089611 Elemental silicon nanoparticle plating and method for the same |
| 05/15/2003 | US20030089610 Repair method for textured and/or smooth steel surfaces on endless strips or pressing sheets |
| 05/15/2003 | US20030089608 Substrate processing apparatus |
| 05/15/2003 | US20030089598 Method and system to provide electrical contacts for electrotreating processes |
| 05/15/2003 | US20030089013 Picture frame mat made by injection-molding process |
| 05/14/2003 | EP1311145A1 Method of providing conductive tracks on a printed circuit |
| 05/14/2003 | EP1311010A1 Surface-treated steel plate for battery case and battery case |
| 05/14/2003 | EP1310582A1 Process for electrolytic copper plating |
| 05/14/2003 | EP1309740A2 Elastic contact element |
| 05/14/2003 | CN1418454A Treatment of circuit supports with impulse excitation |
| 05/14/2003 | CN1418264A Device providing electrical contact to surface of semiconductor workpiece during metal plating |
| 05/14/2003 | CN1418050A Manufacture of wiring substrate |
| 05/13/2003 | US6562222 Copper sulfate, sulfuric acid, chlorine, silane coupling agent; semiconductors |
| 05/13/2003 | US6562219 Forming a first copper film by means of a chemical vapor depotion on an insulating diffusion barrier film; heating the first copper film to a requiered temperature, subsequently forming second copper film on the first by plating |
| 05/13/2003 | US6562217 That efficiently permit a plated layer of uniform thickness to be formed over each of the particles without aggregating the particles in a plating liquid; electronic circuits |
| 05/13/2003 | US6562204 Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers |
| 05/13/2003 | US6561322 Plated wear surface for alloy components and methods of manufacturing the same |
| 05/13/2003 | CA2077784C Metal wire with a layer of coating for reinforcing articles made of elastomeric materials, and articles made of elastomeric materials reinforced with the said wire |
| 05/08/2003 | WO2003038158A2 Electroplating device and electroplating system for coating already conductive structures |
| 05/08/2003 | WO2003038149A1 Surface-treated copper foil |
| 05/08/2003 | WO2003005430A3 Method and apparatus for controlling a plating process |
| 05/08/2003 | WO2002016059A3 Narrow diameter needle having reduced inner diameter tip |
| 05/08/2003 | US20030085467 Plating method, plating solution, semiconductor device and process for producing the same |
| 05/08/2003 | US20030085133 Comprises copper sulfate, sulfuric acid, chlorine, and surfactant for patterning the electrodepostion of copper |
| 05/08/2003 | US20030085129 Method of forming zinc oxide film, method of producing semiconductor element substrate using same, and method of producing photovoltaic element |
| 05/08/2003 | US20030085119 Semiconductor wafer plating cathode assembly |
| 05/08/2003 | US20030085118 Semiconductor wafer plating cell assembly |
| 05/08/2003 | US20030085113 Wherein surface of electroconductive workpiece forms the surface of a cathode of an electrolytic cell in which the anode direct current voltage is maintained, while immersing in foam and venting released gases |
| 05/07/2003 | EP1308539A1 Cathode electrode material and rotating cathode drum for producing electrolytic copper foil using the cathode electrode material |
| 05/07/2003 | EP1307905A2 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 05/07/2003 | CN1416478A Surface treated Tin-plated steel sheet and chemical treatment solution |
| 05/06/2003 | US6558750 Method of processing and plating planar articles |
| 05/06/2003 | US6558739 Titanium nitride/titanium tungsten alloy composite barrier layer for integrated circuits |
| 05/06/2003 | US6558518 Method and apparatus for plating substrate and plating facility |
| 05/06/2003 | US6557237 Removable modular cell for electro-chemical plating and method |
| 05/01/2003 | WO2003036710A1 Bonding wire |
| 05/01/2003 | WO2003036693A2 Method and system to provide electrical contacts for electrotreating processes |
| 05/01/2003 | WO2003035943A1 Electrolytic copper plating method, electrolytic copper plating-use phosphorus-containing copper anode and semiconductor wafer with little particles deposition plated by using them |
| 05/01/2003 | US20030082398 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film |
| 05/01/2003 | US20030079996 Cylinder for internal combustion engine and method of treating inner wall surface of the cylinder |
| 05/01/2003 | US20030079995 Retaining object between cathode and anode in electrochemical reactor to present surface of object for electrochemical reaction; applying electric field by flowing current through electrolyte; dynamically inflating or deflating the bladder |
| 05/01/2003 | US20030079989 Enables use of electrophoretic resists in the microfabrication industry for production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current photoresist deposition technology |
| 05/01/2003 | US20030079683 Chemical vapor deposition; silicon carbide films; dielectrics |
| 04/29/2003 | US6554630 Movable terminal, coaxial connector, and communication apparatus |
| 04/24/2003 | WO2003034478A2 Apparatus and method for electro chemical plating using backside electrical contacts |
| 04/24/2003 | WO2003033774A1 Submerged transfer plating device with plating fluid jetting tube |
| 04/24/2003 | WO2003033773A1 Selective plating of printed circuit boards |
| 04/24/2003 | WO2003033772A1 Production of metallically conductive surface areas on coated light metal alloys |
| 04/24/2003 | WO2003033770A2 System and method for electrolytic plating |
| 04/24/2003 | WO2003033765A1 Plating apparatus |
| 04/24/2003 | US20030077411 Multilayer; polymer, rubber, thermoplastic elastomer and metal plating |
| 04/24/2003 | US20030075451 Semiconductor integrated circuit, manufacturing method thereof, and manufacturing apparatus thereof |
| 04/23/2003 | EP1304519A2 Process for making a fluid-impermeable layer, and an impermeable hose |
| 04/23/2003 | EP1303650A1 Method of reducing a band mark of an electroplating steel sheet |
| 04/23/2003 | CN1106459C Process and device for electrolytic treatment of continuous running materials |
| 04/22/2003 | US6551722 Coated article having a stainless steel color |
| 04/22/2003 | US6551488 Segmenting of processing system into wet and dry areas |
| 04/22/2003 | US6551487 Wafer is loaded and/or unloaded from an electroplating apparatus in a horizontal orientation relative to the surface of the plating bath |
| 04/22/2003 | US6551486 Process for galvanic depositing of a dispersion layer on a work piece surface |
| 04/22/2003 | US6551484 Connecting an electric source between an anode immersed in an electrolyte solution and a seed layer formed on the substrate |
| 04/22/2003 | US6551483 Mitigate corrosion of a metal seed layer on recessed features by contacting the seed layer with an electrolyte solution |
| 04/17/2003 | WO2003018874A3 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 04/17/2003 | US20030070941 Apparatus and method for evaluating plating solution and apparatus and method for fabricating electronic device |
| 04/17/2003 | US20030070932 Plating apparatus and plating method |
| 04/17/2003 | US20030070931 Selective plating of printed circuit boards |
| 04/17/2003 | US20030070930 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating and method of providing such contact |
| 04/17/2003 | US20030070918 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 04/16/2003 | EP1302563A1 Production of metal conductive surface regions on coated light-metal alloys |
| 04/16/2003 | EP1301824A2 Fast-switching reversible electrochemical mirror (rem) |
| 04/16/2003 | CN1411055A Wiring substrate for small electronic unit and mfg. method thereof |