| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 07/10/2003 | US20030129442 Surface treated tin-plated steel sheet and chemical treatment solution |
| 07/10/2003 | US20030129440 Method of metal layer formation and metal foil-based layered product |
| 07/10/2003 | US20030127337 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 07/10/2003 | US20030127336 Methods of and apparatus for making high aspect ratio microelectromechanical structures |
| 07/10/2003 | US20030127320 Apparatus for electrochemically depositing a material onto a workpiece surface |
| 07/09/2003 | EP1325176A1 Method for electroplating a strip of foam |
| 07/09/2003 | CN1429284A Elastic contact element |
| 07/09/2003 | CN1113984C Device for carrying out continuous electrolyting precipitation process |
| 07/09/2003 | CN1113980C High fatigue ductility electrodeposited copper foil |
| 07/08/2003 | US6589593 Method for metal coating of substrates |
| 07/08/2003 | US6589413 Method of making a copper on INVAR® composite |
| 07/08/2003 | US6589412 Forming sulfide based solid lubricating layer |
| 07/08/2003 | US6589401 Apparatus for electroplating copper onto semiconductor wafer |
| 07/08/2003 | US6589400 Apparatus for metal coating of bands by electroplating |
| 07/08/2003 | US6589399 Electrolysis apparatus having liquid squeezer out of contact with strip |
| 07/08/2003 | US6588408 Cylinder liner for diesel engines with EGR and method of manufacture |
| 07/03/2003 | WO2003053621A2 Wire for high-speed electrical discharge machining |
| 07/03/2003 | US20030124840 Material deposition from a liquefied gas solution |
| 07/03/2003 | US20030124263 ULSI wiring and method of manufacturing the same |
| 07/03/2003 | US20030124255 Layers are separately formed via a diffusion prevention layer with an insulating interlayer portion made of SiO2. |
| 07/03/2003 | US20030121797 Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform |
| 07/03/2003 | US20030121792 Electrolytic cell; vibration, agitation |
| 07/03/2003 | US20030121791 Methods of and apparatus for making high aspect ratio microelectromechanical structures |
| 07/03/2003 | US20030121774 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same |
| 07/02/2003 | EP1324384A2 Via filling method |
| 07/02/2003 | EP1323850A1 Electroplating method of printed circuit with pulsed current density |
| 07/02/2003 | EP1323848A1 Nickel electroplating solution |
| 07/02/2003 | EP1323186A2 Plating system with remote secondary anode for semiconductor manufacturing |
| 07/02/2003 | EP1015669A4 Article, method, and apparatus for electrochemical fabrication |
| 07/02/2003 | CN1427668A Guide hole filling method |
| 07/02/2003 | CN1427094A Electroplating method |
| 07/02/2003 | CN1113111C Copper foil for printed wiring board, its producing method and electrolytic device |
| 07/01/2003 | US6585877 Acid resistance; waterproof |
| 07/01/2003 | US6585876 Electrolyte cell configured to receive a substrate to have a metal film deposited thereon; a porous, rigid diffuser positioned between where the substrate is to be and the anode; uniform coating; pressure removes bubbles |
| 07/01/2003 | US6585875 Process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology |
| 07/01/2003 | US6585865 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head |
| 06/26/2003 | US20030119311 Planar metal electroprocessing |
| 06/26/2003 | US20030118862 Sliding member with composite plating film |
| 06/26/2003 | US20030118751 Electronic device, and method of patterning a first layer |
| 06/26/2003 | US20030116442 Method for applying a metal layer to a light metal surface |
| 06/26/2003 | US20030116441 Overcoating; prevention impedance, vibration; efficiency |
| 06/26/2003 | US20030116440 Rinsing substrate in holder; retractable shutter |
| 06/26/2003 | US20030116439 Electroless deposition of barrier material; forming aperture pattern by photolithography |
| 06/26/2003 | US20030116429 Apparatus for continuous processing of semiconductor wafers |
| 06/25/2003 | CN1426495A Electro-plating apparatus and method |
| 06/25/2003 | CN1426333A Mold wall, especially broadside wall of continuous casting mould for steel |
| 06/24/2003 | US6583510 Semiconductor device with varying thickness gold electrode |
| 06/24/2003 | US6582580 Substrate plating apparatus |
| 06/24/2003 | US6582578 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 06/19/2003 | WO2003050328A1 Plating apparatus, plating method, and method for manufacturing semiconductor device |
| 06/19/2003 | WO2003023848A3 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
| 06/19/2003 | WO2002033153A3 Copper bath and method of depositing a matt copper coating |
| 06/19/2003 | US20030113996 Semiconductor production device and production method for semiconductor device |
| 06/19/2003 | US20030113574 Process for manufacturing a conductive wire suitable for use in semiconductor packages |
| 06/19/2003 | US20030111354 10-40 wt % of copper hexafluorosilicate and is used as an electrolyte |
| 06/19/2003 | US20030111346 Micro structured electrode and method for monitoring wafer electroplating baths |
| 06/19/2003 | US20030111339 Plating system |
| 06/19/2003 | CA2467037A1 Manufacturing method for semiconductor device |
| 06/18/2003 | EP1319093A2 Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 06/18/2003 | CN1425196A Conductive interconnections |
| 06/18/2003 | CN1425080A Electro-plating apparatus and method of electro-plating |
| 06/18/2003 | CA2365573A1 Method of manufacturing part for optical fiber connector |
| 06/17/2003 | US6579437 Acid resistance |
| 06/17/2003 | US6579430 Semiconductor wafer plating cathode assembly |
| 06/12/2003 | WO2003048864A1 Mask forming method and removing method, and semi-conductor device, electric circuit, display module, color filter and light emitting element produced by the techniques |
| 06/12/2003 | WO2003048429A1 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion |
| 06/12/2003 | WO2003048427A2 Pretreatment process for coating of aluminium materials |
| 06/12/2003 | WO2003048423A1 Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof |
| 06/12/2003 | WO2002016059B1 Narrow diameter needle having reduced inner diameter tip |
| 06/12/2003 | WO2001090446A3 Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio |
| 06/12/2003 | US20030106800 Rigidified mesh structure and process for obtaining same |
| 06/11/2003 | EP1318371A2 Heat exchange surface with galvanized microstructures with protrusions |
| 06/11/2003 | EP1318216A2 Electrolysis apparatus |
| 06/11/2003 | CN1423830A A vertically configured chamber used for multiple processes |
| 06/11/2003 | CN1422985A Electrolyzing apparatus |
| 06/11/2003 | CN1422981A Method for producing copper-resin composite material |
| 06/10/2003 | US6576113 Method of electroplating of high aspect ratio metal structures into semiconductors |
| 06/10/2003 | US6576110 Use with metal film plating; having a planar electric field generating portion coated with an inert material such as tantalum that is impervious to electrolyte solution and an electrolyte solution chemical reaction portion |
| 06/10/2003 | US6575635 Multi-layer sliding bearing |
| 06/10/2003 | US6575354 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the film |
| 06/05/2003 | WO2002059882A3 Method for seed layer removal for magnetic heads |
| 06/05/2003 | US20030105533 Electrolysis apparatus |
| 06/05/2003 | US20030102210 Electroplating apparatus with segmented anode array |
| 06/05/2003 | US20030102104 Mold wall, especially a broad side wall of a continuous casting mold for steel |
| 06/04/2003 | EP1259661A4 Pad designs and structures for a versatile materials processing apparatus |
| 06/04/2003 | CN1421905A Method of and apparatus for producing semiconductor device |
| 06/04/2003 | CN1421892A Method for producing grille of non-electrode illuminating system |
| 06/03/2003 | US6573183 Method and apparatus for controlling contamination during the electroplating deposition of metals onto a semiconductor wafer surface |
| 06/03/2003 | US6572982 Electromigration-resistant copper microstructure |
| 06/03/2003 | US6572755 Pressing workpiece against polishing surface while causing relative motion between workpiece and polishing surface, supplying an electrolyte solution to polishing surface, applying a voltage between both surfaces |
| 06/03/2003 | US6572742 Apparatus for electrochemical fabrication using a conformable mask |
| 06/03/2003 | US6572517 Current roller for an electrolytic strip coating plant |
| 06/03/2003 | US6571657 Multiple blade robot adjustment apparatus and associated method |
| 05/30/2003 | WO2003044248A1 Device for electrolytic treatment and hardening of the surface of the heat exchange tubes of steam generators of nuclear power plants |
| 05/30/2003 | WO2003044247A1 Elemental silicon nanoparticle plating and method for the same |
| 05/30/2003 | WO2003044246A1 Anodes for electroplating operations, and methods of forming materials over semiconductor substrates |
| 05/30/2003 | WO2003009343A3 Plating apparatus |
| 05/29/2003 | US20030098241 Process and apparatus for manufacturing a semiconductor device |
| 05/29/2003 | US20030098101 Forming a mesh screen, a first metal plating, vacuum heat treating, a second metal plating and a photocatalytic coating |
| 05/28/2003 | EP1313895A1 Method for metal coating the surface of high temperature superconductors |