| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 08/27/2003 | CN1119435C A surface-treated metal wire for use in the realization of reinforcement structures for manufactured products in elastomer material |
| 08/27/2003 | CN1119434C Conducting roller and its manufacturing method |
| 08/26/2003 | US6610600 Damascene copper electroplating process with low-pressure pre-processing |
| 08/26/2003 | US6610596 Method of forming metal interconnection using plating and semiconductor device manufactured by the method |
| 08/26/2003 | US6610418 Electolytic copper foil with carrier foil and method for manufacturing the same |
| 08/26/2003 | US6610417 Nickel coated copper as electrodes for embedded passive devices |
| 08/26/2003 | US6610192 Reducing overplating in a copper layer of an integrated circuit device using at least one leveling agent, a reaction product of an amine with an epihalohydrin |
| 08/26/2003 | US6610191 Connecting electronically resistive substrate to a negative terminal of electrical power source; disposing substrate and an anode in solution comprising metal compound and supporting electrolyte; electrodepositing metal onto substrate |
| 08/26/2003 | US6610190 Anode, a shaping plate, a liquid electrolyte, and electrical contact members |
| 08/26/2003 | US6610189 Immersing the plating surface into an electrolyte solution and mechanically enhancing the concentration of metal ions in the electrolyte solution in the features, especially by mechanical vibration |
| 08/26/2003 | US6610182 Cup-type plating apparatus and method for plating wafers |
| 08/26/2003 | US6610151 Seed layers for interconnects and methods and apparatus for their fabrication |
| 08/26/2003 | US6609830 Bearing having multilayer overlay and method of manufacture |
| 08/21/2003 | WO2003068434A1 Metal hydride composite materials |
| 08/21/2003 | US20030156395 Electronic component and method of manufacturing same |
| 08/21/2003 | US20030155248 Electroless deposition using organometallic polymer and organosilicon polymer; forming copper film |
| 08/21/2003 | US20030155247 Electrolysis of copper compound; adjustment ph |
| 08/21/2003 | US20030155231 Field adjusting apparatus for an electroplating bath |
| 08/20/2003 | EP0938597B1 Method for anisotropic etching of structures in conducting materials |
| 08/20/2003 | CN1437661A Conditioning of through holes and glass |
| 08/20/2003 | CN1437256A Semiconductor element and producing method thereof, and semiconductor device and producing method thereof |
| 08/20/2003 | CN1118621C Non-cylinder liner casting cylinder body and producing method thereof |
| 08/19/2003 | US6607654 Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming a copper interconnect |
| 08/19/2003 | US6607653 Plating bath and process for depositing alloy containing tin and copper |
| 08/19/2003 | US6607650 Method of forming a plated layer to a predetermined thickness |
| 08/14/2003 | WO2003066263A1 Method and device for obtaining a determined flow resistance of a flow channel |
| 08/14/2003 | US20030153185 Plating apparatus for wafer |
| 08/14/2003 | US20030152798 Decorative architectural titanium panels and method of fabrication thereof |
| 08/14/2003 | US20030151140 Bump structure of a flip chip type semiconductor element mounted face down |
| 08/14/2003 | US20030150743 Divalent tin ions; acid or complexing agent that forms a water-soluble salt or complex with the tin; one or more metals selected from elements of Groups IB to VB of the fourth to sixth periods |
| 08/14/2003 | US20030150734 Electroplating solution composition control |
| 08/14/2003 | US20030150715 Anode assembly and method of reducing sludge formation during electroplating |
| 08/13/2003 | EP1335042A2 Process for the manufacture of a heat exchanger |
| 08/13/2003 | CN1435498A Sintered alloy, its production method, electric fuel pump comprising sintered alloy bearing |
| 08/13/2003 | CN1118099C Method for mounting intermediate connecting element to terminal of electronic module |
| 08/12/2003 | US6605205 For electrodeposition, etching, or polishing uniformily; retaining semiconductor substrates on moving cathode immersed in reaction solution wherein a wire mesh anodes rotates about the moving cathode during electrochemical reaction |
| 08/12/2003 | US6605204 Electroplating of copper from alkanesulfonate electrolytes |
| 08/07/2003 | WO2003065423A2 Electroless deposition apparatus and method |
| 08/07/2003 | WO2003024594A3 A nano-supported catalyst for nanotube growth |
| 08/07/2003 | US20030148136 Surface treated copper foil, electrodeposited copper foil with carrier, manufacture method for the electrodeposited copper foil with carrier, and copper clad laminate |
| 08/07/2003 | US20030146102 Method for forming copper interconnects |
| 08/07/2003 | US20030146101 Dividing into mesh-like plating zones; measuring; calibration; determination of film thickness |
| 08/06/2003 | EP1332243A2 Method and apparatus for electrodeposition or etching of uniform films with minimal edge exclusion on substrate |
| 08/06/2003 | CN1434882A Pad designs and structures for universal material working equipment |
| 08/06/2003 | CN1117181C Method and installation forelectrolytic coating with metal layer of surface of cylinder for continuous casting of thin metal strips |
| 08/05/2003 | US6603205 Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components |
| 08/05/2003 | US6602787 Method for fabricating semiconductor devices |
| 08/05/2003 | US6602614 Coated metal wire, wire-reinforced elastomeric article containing the same and method of manufacture |
| 08/05/2003 | US6602354 Method for producing a tin-nickel alloy film |
| 07/31/2003 | US20030143845 Mask forming and removing method, and a semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method |
| 07/31/2003 | US20030143842 Damascene copper electroplating process with low-pressure pre-processing |
| 07/31/2003 | US20030143837 Method of depositing a catalytic layer |
| 07/31/2003 | US20030143096 Sintered alloy article, its production method and a motorized fuel pump comprising a bearing comprised of sintered alloy article |
| 07/31/2003 | US20030141192 Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied |
| 07/31/2003 | US20030141185 Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces |
| 07/31/2003 | US20030141018 spreaders comprising frames for joining trowel blades and pivot points comprised of two juxtaposed side panels, for use in the laying of flooring and roofing surfaces |
| 07/30/2003 | EP1331088A1 Copper foil for high-density ultrafine wiring board |
| 07/30/2003 | EP1287185A4 Anode assembly for plating and planarizing a conductive layer |
| 07/30/2003 | CN1433572A Novel chip interconnect and packaging deposition methods and structures |
| 07/30/2003 | CN1433487A Method and apparatus for electrodeposition or etching of uniform film with miniml edge exclusion on substrate |
| 07/30/2003 | CN1433072A Wiring structure and its making process, semiconductor device with the wiring structure and its wiring base board |
| 07/30/2003 | CN1432666A Copper electroplating method |
| 07/30/2003 | CN1432661A Metal layer forming process and laminated metal foil-based product |
| 07/30/2003 | CN1116449C Device for processing printed circuit boards |
| 07/29/2003 | US6600629 Thin film magnetic head having gap layer made of nip and method of manufacturing the same |
| 07/29/2003 | US6600230 Depositing seed layer on surface by sputtering, exposing to hydrogen gase during annealing, plating metal; resistivity; semiconductors; dielectrics; wiring structures |
| 07/29/2003 | US6599834 Process of manufacturing a semiconductor device with an electroplated wiring layer |
| 07/29/2003 | US6599412 In-situ cleaning processes for semiconductor electroplating electrodes |
| 07/29/2003 | US6599402 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 07/29/2003 | CA2287536C Anode structure for manufacture of metallic foil |
| 07/24/2003 | WO2003060959A2 Method for applying metal features onto barrier layers using electrochemical deposition |
| 07/24/2003 | WO2003060203A1 Metal strip for epitaxial coating and method for production thereof |
| 07/24/2003 | WO2003060198A1 A tubular member having an anti-galling coating |
| 07/24/2003 | US20030139036 Semiconductor device and method for fabricating the same |
| 07/24/2003 | US20030137053 Wiring structure and manufacturing method therefor, semiconductor device including wiring structure and wiring board |
| 07/24/2003 | US20030136678 Apparatus and method for feeding wire in treatment liquid |
| 07/24/2003 | US20030136547 Heat transfer surface with a microstructure of projections galvanized onto it |
| 07/24/2003 | DE10215463C1 Continuous plant for electrolytic metallization of printed circuit boards, includes precautions reducing electrical potential between adjacent workpieces |
| 07/24/2003 | CA2472185A1 Metal strip for epitaxial coating and method for producing such a strip |
| 07/23/2003 | EP1330146A2 Via filling method |
| 07/23/2003 | EP1328667A1 Compact processing installation for a printing cylinder |
| 07/22/2003 | US6597182 Detector for detecting contact resistance anomaly of cathode electrode in electroplating machine |
| 07/22/2003 | US6596410 Chrome-plated sliding member and manufacturing method thereof |
| 07/22/2003 | US6596151 Electrodeposition chemistry for filling of apertures with reflective metal |
| 07/17/2003 | WO2003058696A1 Method of producing metal film |
| 07/17/2003 | WO2003058655A1 Material deposition from a liquefied gas solution |
| 07/17/2003 | WO2002055762A3 Electrochemical co-deposition of metals for electronic device manufacture |
| 07/17/2003 | US20030134509 Manufacturing method of semiconductor device |
| 07/17/2003 | US20030132192 Flexible printed wiring board |
| 07/17/2003 | US20030132120 Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface |
| 07/17/2003 | US20030132118 Electroplating of semiconductor wafers |
| 07/17/2003 | US20030132105 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 07/17/2003 | US20030132102 Cathode contact pin for an electroplating process |
| 07/16/2003 | EP1327517A2 Method of metal layer formation and metal foil-based layered product |
| 07/16/2003 | EP1230442B1 Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 07/16/2003 | CN1429934A Forming method of anode oxidation film on chain tooth row and its forming equipment |
| 07/16/2003 | CN1114718C Method of electromolding three-D metal structure directly on silicon substrate and the special fixture thereof |
| 07/15/2003 | US6592739 By electrodeposition combined with substrate transportation of a roll-to-roll system; prevent occurrence of impact marks due to due floating in the bath; transporting the continuous length substrate under electrification |
| 07/10/2003 | WO2003056609A2 Apparatus and method for electroplating a wafer surface |
| 07/10/2003 | WO2003056058A1 A method of producing a composite electroconductive material |