Patents
Sitemap › C25 - Electrolytic or electrophoretic processes; Apparatus therefor › C25D - Processes for the electrolytic or electrophoretic production of coatings; Electroforming; Joining workpieces by electrolysis; Apparatus therefor › C25D 7 - Electroplating characterised by the article coated
Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
10/2003
10/16/2003WO2003085713A1 Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
10/16/2003WO2003072853A3 Apparatus with processing stations for manually and automatically processing microelectronic workpieces
10/16/2003WO2003030584A3 Implantable hearing aid with improved sealing
10/16/2003WO2003027011A3 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires
10/16/2003WO2002103782A3 Barrier enhancement process for copper interconnects
10/16/2003US20030196181 Analysis method of film thickness distribution and design system of printed circuit board and manufacturing processes
10/16/2003US20030194866 Method and apparatus for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing
10/16/2003US20030192782 Cathode cartridge for electroplating tester
10/15/2003EP1352994A1 Ni-plated steel plate for alkali-manganese dry cell anode can and alkali-manganese dry cell anode can
10/15/2003EP1352110A1 Electrodeposited bearing alloy, electroplating bath, and electrodeposition method
10/15/2003CN1449588A Surface-treated steel plate for battery case and battery case
10/15/2003CN1124647C Interconnect structure in semiconductor device and method of formation
10/14/2003US6632335 Filling a metal such as copper in fine interconnection pattern recesses on a semiconductor
10/14/2003US6632334 Distributed power supplies for microelectronic workpiece processing tools
10/09/2003WO2003083185A1 Conveyorized plating line and method for electrolytically metal plating a workpiece
10/09/2003WO2003083184A1 Finishing installation and method for finishing elongated winding material
10/09/2003WO2003083182A2 Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
10/09/2003US20030188974 Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
10/09/2003US20030188973 Method for electroplating a strip of foam
10/09/2003US20030188965 Web processing method and apparatus
10/09/2003US20030188886 Reduces the tendency of the copper etch step from under-cutting the nickel/gold to cause slivers that cause short circuiting by providing a conforming nickel/gold layer that extends down the side of the traces
10/09/2003CA2469880A1 Conveyorized plating line and method for electrolytically metal plating a workpiece
10/08/2003EP1351289A1 Method and apparatus for forming fine circuit interconnects
10/08/2003EP1350860A1 Process of masking cooling holes of a gas turbine component
10/08/2003EP1072176B1 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
10/08/2003CN1447402A Method of annealing electroplate metals
10/08/2003CN1446946A Technique method for electroplating inner surfaces of gear wheel holes and dedicated equipments
10/07/2003US6630059 Workpeice proximity plating apparatus
10/07/2003CA2286813C Device for carrying out continuous electrolytic precipitative deposition processes
10/02/2003US20030186540 Method and apparatus for forming fine circuit interconnects
10/02/2003US20030183530 Alternately electrodepositing and electro- mechanically polishing to selectively fill a semiconductor feature with metal including a) providing an anode assembly and a semiconductor wafer disposed in spaced apart relation
10/02/2003US20030183528 Combines a potential or current reversal waveform with variation in the amplitude and duration of the applied potential or current pulse. The method includes, over time, varying the duration of the pulse and continuously decreasing
10/02/2003US20030183527 Electroplating metal onto a low conductivity layer combines a potential or current reversal waveform with variation in the amplitude and duration of the applied potential or current pulse. The method includes, over time, varying the duration of
10/02/2003US20030183526 Superior filling properties and superior planarization of the deposited metal layer is provided. This is achieved by a method having a F/R ratio, the ratio of the electric current densities between the forward electrolysis and the reverse
10/02/2003US20030183513 Plating system and method for management of plating solution using plating system
10/02/2003US20030183308 Method for electroplated metal annealing process
10/01/2003EP1348044A1 Device and method for electrochemically treating a band-shaped product
10/01/2003EP1348041A1 Plasma electroplating
10/01/2003EP1112125A4 Metallization structures for microelectronic applications and process for forming the structures
09/2003
09/30/2003US6627329 Bonding layer is the product of gold plating with a thiol which in turn interacts with lubricant
09/30/2003US6627064 Method for removing the hard material coating applied on a hard metal workpiece and a holding device for at least one workpiece
09/30/2003US6627052 Electroplating apparatus with vertical electrical contact
09/30/2003US6627051 Cathode current control system for a wafer electroplating apparatus
09/25/2003WO2003078698A1 Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it
09/25/2003US20030178319 For removing conductors of the top conductive surfaces of workpieces (copper) by applying etching solution in presence of current, forming easily removable intermediate (copper chloride)
09/25/2003US20030178315 Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes
09/25/2003US20030178313 Permits placed layer of uniform thickness to be formed over particles without aggregating in plating solution; semiconductors
09/25/2003US20030178297 Reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly
09/25/2003US20030178102 Method of depositing epitaxial layers on a substrate
09/24/2003EP1347081A1 A plating method and apparatus with fixed immersed plating tool
09/24/2003EP1346083A2 Electrochemical co-deposition of metals for electronic device manufacture
09/24/2003EP1171239B1 Method for producing a catalyst
09/24/2003CN1444437A Through-hole filling method
09/24/2003CN1444258A Reducing defect in electrodeposited copper used in semiconductor
09/24/2003CN1122121C Strip treating apparatus
09/23/2003US6624648 Probe card assembly
09/23/2003US6623790 Method of adjusting the size of cooling holes of a gas turbine component
09/23/2003US6623609 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
09/18/2003WO2003076134A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
09/18/2003WO2003033770A3 System and method for electrolytic plating
09/18/2003WO2002068728A8 Bath for the galvanic deposition of gold and gold alloys, and the use thereof
09/18/2003US20030173209 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
09/17/2003EP1344849A1 ELECTROLYTIC COPPER PLATING METHOD, ELECTROLYTIC COPPER PLATING−USE PHOSPHORUS−CONTAINING COPPER ANODE AND SEMICONDUCTOR WAFER WITH LITTLE PARTICLES DEPOSITION PLATED BY USING THEM
09/17/2003CN1121513C Copper zinc electroplating bath copper foil for printed wiring board and method of surface treatment thereof
09/16/2003US6621660 Thin film magnetic head
09/16/2003US6619538 Nickel plating process having controlled hydrogen concentration
09/12/2003WO2003006718B1 Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
09/11/2003US20030171003 Low resistivity copper conductor line, liquid crystal display device having the same and method for forming the same
09/11/2003US20030169955 Rotary member and production process
09/11/2003US20030168346 Introducing the semiconductor substrate into the dry area of processing system; moving semiconductor substrate into wet area; processing semiconductor substrate in an electrochemical processing cell; removing unwanted deposits on substrate
09/11/2003US20030168345 In-situ monitor seed for copper plating
09/11/2003US20030168344 Uniform metal deposition across the substrate
09/11/2003US20030168343 Defect reduction in electrodeposited copper for semiconductor applications
09/11/2003US20030168341 Applying functional alloy plating to an electronic component to be mounted using an electrolytic procedure with a pulse waveform, functional alloy plating comprising tin and silver
09/11/2003US20030168340 Process and apparatus for electroplating microscopic features uniformly across a large substrate
09/10/2003EP1342816A2 Tin plating method
09/10/2003EP1341951A2 Copper bath and method of depositing a matt copper coating
09/10/2003EP1171304B1 Improved gravure printing rollers
09/10/2003CN1441087A Nickel electric plating liquid
09/10/2003CN1120902C Method for producing layered material for sliding bearings and electroplating bath for carrying out this method
09/09/2003US6615485 Probe card assembly and kit, and methods of making same
09/04/2003WO2003072853A2 Apparatus with processing stations for manually and automatically processing microelectronic workpieces
09/04/2003US20030165279 Rolling bearing
09/04/2003US20030164303 Forming vias on the package substrate coated with copper film; electroplating to form electrical conductive holes; coating a resisting agent; etching the pattern; removing; electroplating substrate with nickel and gold, and removing the resist
09/04/2003US20030164302 Depositing barrier layer; depositing seed layer of metal on barrier layer; removing seed layer from barrier layer, electroplating metal using portion of seed layer and exposed portions of barrier layer; removing excess plated metal
09/04/2003US20030164301 Uniform deposition thickness
09/03/2003EP0738313B1 Protective layer for a steel portion of a reactor system for hydrocarbon processing
09/02/2003US6613214 Apparatus for depositing a metal film, comprising a holder that positions the substrate so seed layer contacts an electrolyte solution, and electric contact which contacts second side or edge of substrate; uniform current density
09/02/2003US6613200 Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform
09/02/2003US6613165 Process for heat treating bullets comprising two or more metals or alloys
09/02/2003US6612915 Work piece carrier head for plating and polishing
08/2003
08/28/2003WO2003071009A1 Method and device for electrically contacting a flat product in electrolytic installations
08/28/2003WO2003071008A2 Methods of and apparatus for making high aspect ratio microelectromechanical structures
08/28/2003WO2003071007A1 Methods of and apparatus for making high aspect ratio microelectromechanical structures
08/28/2003WO2003071001A1 Electroplating solution containing organic acid complexing agent
08/28/2003US20030159938 Electroplating solution containing organic acid complexing agent
08/28/2003US20030159921 Apparatus with processing stations for manually and automatically processing microelectronic workpieces
08/28/2003US20030159277 Method and apparatus for manually and automatically processing microelectronic workpieces
08/27/2003EP1337693A2 Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
08/27/2003CN1438678A High-pressure electrochemical method for depositing nano Cu granule film on semiconductor Si substrate
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