Patents
Sitemap › C25 - Electrolytic or electrophoretic processes; Apparatus therefor › C25D - Processes for the electrolytic or electrophoretic production of coatings; Electroforming; Joining workpieces by electrolysis; Apparatus therefor › C25D 7 - Electroplating characterised by the article coated
Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
12/2003
12/03/2003CN1460135A Back-end metallisation process
12/03/2003CN1460134A Copper-plating solution, plating method and plating apparatus
12/02/2003US6656339 Method of forming a nano-supported catalyst on a substrate for nanotube growth
12/02/2003US6656275 Partial plating system
12/02/2003US6655023 Method and apparatus for burning-in semiconductor devices in wafer form
11/2003
11/27/2003WO2002064861A3 Substrate holder system with substrate extension apparatus and associated method
11/27/2003US20030217932 Device providing electrical contact to the surface of a semiconductor workpiece during processing
11/27/2003US20030217929 Valve for controlling fluid flow
11/27/2003US20030217916 Electroplating reactor
11/26/2003EP1363707A2 Narrow diameter needle having reduced inner diameter tip
11/26/2003EP1142041B1 Battery sheath made of a formed cold-rolled sheet and method for producing battery sheaths
11/26/2003EP1141436B1 Steel wire with bright looking surface
11/26/2003CN2587889Y Electric deposition equipment for making high-porosity metal strip material
11/26/2003CN1459219A Flexible printed wiring board
11/26/2003CN1458987A Method for electroplating strip of foam
11/26/2003CN1458671A Conductive polishing article for electrochemical mechanical polishing
11/26/2003CN1458304A Tin plating method
11/25/2003US6654122 Semiconductor processing apparatus having lift and tilt mechanism
11/25/2003US6652993 Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer
11/25/2003US6652726 Method for reducing wafer edge defects in an electrodeposition process
11/25/2003US6652657 Method for electrochemically treating articles and apparatus and method for cleaning articles
11/20/2003WO2003095714A1 Process for producing high temperature heat resisting carrier foil clad electrolytic copper foil and high temperature heat resisting carrier foil clad electrolytic copper foil obtained by the process
11/20/2003US20030213697 Pressurizing with a flow of gas onto the semiconductor wafer
11/19/2003EP1361837A1 Endoprothesis with galvanised silver layer
11/19/2003EP1257693B1 Composite copper foil and manufacturing method thereof
11/18/2003US6649038 Electroplating method
11/18/2003CA2287179C Method for electroplating metallic and non-metallic endless products and device for carrying out said method
11/13/2003WO2003094246A1 Method for making thin-film semiconductors based on i-iii-vi2 compounds, for photovoltaic applications
11/13/2003WO2003093524A2 Apparatus and method for regulating the electrical power applied to a substrate during immersion
11/13/2003WO2003092911A1 Minimizing whisker growth in tin electrodeposits
11/13/2003WO2003036693A3 Method and system to provide electrical contacts for electrotreating processes
11/13/2003US20030211674 Electrode for electroplating planar structures
11/13/2003US20030209448 Forming grooves; fluid flow; polishing surfaces
11/13/2003US20030209445 Forming electrical contactors; uniform electrodeposition; integrated circuits
11/13/2003US20030209444 Electrolysis; using reverse current density
11/13/2003US20030209443 Substrate support with fluid retention band
11/13/2003US20030209429 Method and apparatus for processing a substrate with minimal edge exclusion
11/13/2003US20030209425 Device providing electrical contact to the surface of a semiconductor workpiece during processing
11/13/2003DE10019713C2 Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen Apparatus and method for electrically contacting electrolytic material to be treated in continuous flow systems
11/12/2003EP1361023A2 Polishing articles for electrochemical mechanical polishing of substrates
11/12/2003EP1360348A1 Method and apparatus for controlling thickness uniformity of electroplated layer
11/12/2003CN1455947A Substrate processing apparatus
11/12/2003CN1455027A Combined-box plating apparatus of crystallizer copper plate for continuous caster
11/12/2003CN1455026A Combined-box alloy plating process of continuous casting crystallizer copper plate
11/11/2003US6645549 Sheet is immersed in immersion tin solution for a time sufficient to provide a thin tin deposit operative in conjunction with the first tin deposit to enhance subsequent bonding of the sheet to an organic polymer layer
11/11/2003US6645356 Methods and apparatus for processing the surface of a microelectronic workpiece
11/11/2003CA2088123C Process for through-hole plating of two-layer circuit boards and multilayers
11/06/2003WO2003092344A1 Production of via hole in flexible circuit printable board
11/06/2003WO2003065423A3 Electroless deposition apparatus and method
11/06/2003WO2003041126A3 Electrochemical mechanical processing with advancible sweeper
11/06/2003US20030207149 Provided contact, sliding, fitting-in and ornamental members having a surface treatment structure in which contact resistance is low, and lubricating property and wear resistance are excellent, and capable of being used suitably
11/06/2003US20030205478 Object plating method and system
11/06/2003US20030205477 Periodically alternating between an electrodeposition process and electropolishing process with respect to the second electrode.
11/06/2003US20030205474 Plating solution containing up to about 0.4M of supporting electrolyte.
11/06/2003US20030205461 Removable modular cell for electro-chemical plating
11/05/2003CN1454266A Anode assembly for plating and planarizing a conductive layer
11/05/2003CN1454265A Fountain bed with fluid contacting with substance
11/05/2003CN1453834A Semiconductor device and producing method and electroplating liquid
11/05/2003CN1453398A Hollow ball for barrel plating
11/05/2003CN1127158C Surface treated steel plate for battery case, battery case and battery using case
11/04/2003US6641984 Method of frame plating and method of forming magnetic pole of thin-film magnetic head
11/04/2003US6641709 Comprises gas discharge which connects the space in plating chamber with spout to improve gas removal; semiconductors
11/04/2003CA2191225C Strip treating apparatus
10/2003
10/30/2003WO2003090257A2 Method for the production of thin metal-containing layers having low electrical resistance
10/30/2003WO2003089679A1 Process of masking cooling holes of a gas turbine component
10/30/2003WO2003012175A3 Method for selectively electroplating a strip-shaped, metal support material
10/30/2003US20030201538 Method of forming metal interconnection using plating and semiconductor device manufactured by the method
10/30/2003US20030201536 Semiconductor device and manufacturing process therefor as well as plating solution
10/30/2003US20030201249 Process for fabricating high aspect ratio embossing tool and microstructures
10/30/2003US20030201190 Using reverse polarity electrical current to dissolve plating deposits
10/30/2003US20030201188 Mixture of acid, tin compound and surfactant; determination crystal orientation
10/30/2003US20030201185 Pretreatment; applying wavelengths to seed layer; pulsation cycles; removal impurities
10/30/2003US20030201184 Electroplating of a metal; seed layer immersion in an electrolyte; controlled trapping of air bubbles by positioning substrate
10/30/2003US20030201170 Apparatus and method for electropolishing a substrate in an electroplating cell
10/30/2003US20030201166 method for regulating the electrical power applied to a substrate during an immersion process
10/29/2003EP1355745A1 Bond enhancement antitarnish coatings
10/29/2003CN1451788A Cathode chuck of electroplating tester
10/28/2003US6639194 Method for manufacturing a multiple walled tube
10/28/2003US6638863 Electropolishing metal layers on wafers having trenches or vias with dummy structures
10/28/2003US6638840 Electrode for electroplating planar structures
10/28/2003US6638688 Selective electroplating method employing annular edge ring cathode electrode contact
10/28/2003US6638411 Method and apparatus for plating substrate with copper
10/28/2003US6638374 Device produced by a process of controlling grain growth in metal films
10/23/2003WO2003088316A2 Electropolishing and electroplating methods
10/23/2003WO2003087437A1 Web processing method and apparatus
10/23/2003WO2003087436A1 Electropolishing and/or electroplating apparatus and methods
10/23/2003US20030196906 Can be used for ceramic composite materials; comprising nickel ions and at least two chelating agents selected from aminopolycarboxylic acids, polycarboxylic acids, and polyphosphonic acids
10/23/2003US20030196904 System and method for electrolytic plating
10/23/2003US20030196892 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
10/23/2003US20030196782 Black layer coated heat exchanger
10/23/2003CA2479873A1 Electropolishing and electroplating methods
10/23/2003CA2479794A1 Electropolishing and/or electroplating apparatus and methods
10/22/2003EP1355518A1 Flexible printed wiring board
10/22/2003EP1354078A1 Spouted bed apparatus for contacting objects with a fluid
10/22/2003CN1125491C Multi-layer plated lead frame
10/22/2003CN1125198C Lead frame manufacturing method
10/22/2003CN1125197C Plated aluminum alloy cylinder, planting pretreatment and planting method
10/21/2003US6635166 Adding water insoluble inorganic or organic fine particles to a metal plating bath by dispersing the fine particles in a watery medium with the help of an aromatic azo surfactant, effecting electrolysis to form composite plating film
10/21/2003US6635157 Electro-chemical deposition system
10/21/2003US6634370 Liquid treatment system and liquid treatment method
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