| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 01/15/2004 | DE10228998A1 Vorrichtung und Verfahren zum elektrochemischen behandeln eines Substrats bei reduzierter Metallkorrosion An apparatus and method for electrochemically treating a substrate with reduced metal corrosion |
| 01/14/2004 | EP1380402A2 Steel wire with bright looking surface |
| 01/14/2004 | EP1379357A2 Method and apparatus for avoiding particle accumulation during an electrochemical mechanical process |
| 01/14/2004 | CN1468327A Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 01/13/2004 | US6677233 Material deposition from a liquefied gas solution |
| 01/13/2004 | US6677056 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film |
| 01/13/2004 | US6677055 Preventing the formation of whiskers and recess cavities on lead surfaces |
| 01/13/2004 | US6676822 Method for electro chemical mechanical deposition |
| 01/13/2004 | US6675472 Preventing burrs wherein the copper plating is performed prior to making the routing of one or more slots by a thin plating; improved castellation via process |
| 01/08/2004 | WO2004004418A1 Metal based resistance heating element and method for preparation thereof |
| 01/08/2004 | WO2004003935A2 Cu ecp planarization by insertion of polymer treatment step between gap fill and bulk fill steps |
| 01/08/2004 | WO2004003663A2 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion |
| 01/08/2004 | WO2004003259A1 Method of forming polyimide coating containing dielectric filler on surface of metallic material, process for producing copper clad laminate for formation of capacitor layer for printed wiring board and copper clad laminate obtained by the process |
| 01/08/2004 | US20040005499 Surface-treated steel plate for battery case and battery case |
| 01/08/2004 | US20040005432 Silver-based alloy composition for use as a reflective or semi- reflective coatings or layer(s) for use in optical data storage media, low emissivity glass, transparent conductive displays, and electro-chromic mirrors, or other reflective or |
| 01/08/2004 | US20040003894 Method and apparatus for electro-chemical processing |
| 01/08/2004 | US20040003873 Forming a copper layer by electroplating on a substrate in an integrated processing system and treating the copper layer in a gas environment, especially annealing |
| 01/07/2004 | EP1377696A1 Back-end metallisation process |
| 01/07/2004 | EP1377441A2 Coated article having a stainless steel color |
| 01/07/2004 | CN2597490Y Special clamp device for electroplating technique of gear internal hole surface |
| 01/07/2004 | CN1466517A Copper foil for high-density ultrafine wiring board |
| 01/06/2004 | US6673470 Surface treated tin-plated steel sheet and surface treatment solution |
| 01/06/2004 | US6673218 Cathode cartridge for electropating tester |
| 01/06/2004 | US6673216 For transmitting electrical signals and fluids to and/or from microelectronic workpiece during electrochemical processing |
| 01/06/2004 | US6672820 Semiconductor processing apparatus having linear conveyer system |
| 01/02/2004 | EP1375043A1 Process for charge wise coating of saw wire |
| 01/01/2004 | US20040001922 Method for the batch coating of saw wire |
| 01/01/2004 | US20040001914 Overcoating dielectric with polymer; then metal; eching; overcoating with gold |
| 01/01/2004 | US20040000492 Metallic substrate overcoated with solid sulfide lubricant |
| 01/01/2004 | US20040000491 Neutralizing acid electrolyte in plating solution; electrolytic cell; permselective membrane |
| 01/01/2004 | US20040000488 Plating substrate; preconditioning surface; controlling thickness; reducing electrolyte leakage; multilayer integrated circuit |
| 01/01/2004 | US20040000487 Adjust pattern configuration of passageway; fluid flow of electrolyte |
| 01/01/2004 | US20040000486 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion |
| 01/01/2004 | US20040000485 Apparatus and method for electrochemical metal deposition |
| 12/31/2003 | WO2004001823A1 Semiconductor device manufacturing method |
| 12/31/2003 | WO2004001813A2 Substrate holder and plating apparatus |
| 12/31/2003 | WO2004001178A2 Method and apparatus for downhole pipe or casing repair |
| 12/31/2003 | WO2004001102A1 Process for in-situ electroforming a structural layer of metallic material to an outside wall of a metal tube |
| 12/31/2003 | WO2004001100A1 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents |
| 12/31/2003 | WO2003088316A3 Electropolishing and electroplating methods |
| 12/31/2003 | CN1465216A Copper plated circuit layer carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer carrying copper clad laminated sheet |
| 12/30/2003 | US6670308 Electrochemistry; electromagnetism; superconductivity; biaxially orientented films |
| 12/30/2003 | US6669834 Electroplating solution containing tin compounds and lead compounds, methane sulfonic acid, water, and an organic additive; used for soldering |
| 12/30/2003 | US6669833 Agitating electrolyte inside tank with suspended, reciprocating paddle |
| 12/30/2003 | US6669828 For the electrochemical reduction of organic compounds |
| 12/30/2003 | US6669489 Interposer, socket and assembly for socketing an electronic component and method of making and using same |
| 12/25/2003 | WO2003106740A1 Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board |
| 12/25/2003 | US20030234183 Electroplating metal with thin dense chromium by immersing the metal in a sulfuric acid solution containing a hydrogen fluoride catalyst as ammonium bifluoride salts followed by a chromic acid bath; protective coatings; prosthetics |
| 12/25/2003 | US20030234182 Providing strength to the low k dielectric layer by using a sacrificial conductive metal layer over it during the chemical mechanical polishing and planarization of the above barrier and copper layers; semiconductors; integrated circuits |
| 12/25/2003 | US20030234181 Process for in-situ electroforming a structural layer of metallic material to an outside wall of a metal tube |
| 12/24/2003 | WO2003106739A1 Copper-tin-oxygen based alloy plating |
| 12/24/2003 | WO2003048427A3 Pretreatment process for coating of aluminium materials |
| 12/24/2003 | WO2002070144A8 Internal heat spreader plating methods and devices |
| 12/24/2003 | CN1132239C Method of mfg. semiconductor device |
| 12/23/2003 | US6666964 High density, multilayer printed circuits comprising flexible dielectric substrates having apertures, wire conductors and gold layers formed in electroplating baths; electronics |
| 12/23/2003 | US6666960 Electroplating current supply system |
| 12/23/2003 | US6666959 Semiconductor workpiece proximity plating methods and apparatus |
| 12/18/2003 | WO2003105545A1 Flexible printed circuit board and process for producing the same |
| 12/18/2003 | WO2003105200A1 Substrate processing apparatus and substrate processing method |
| 12/18/2003 | WO2003104532A1 Components for electrical connectors, and metal strip therefore |
| 12/18/2003 | WO2003027011B1 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires |
| 12/18/2003 | WO2003009361A3 Planar metal electroprocessing |
| 12/18/2003 | US20030230491 Method and system monitoring and controlling film thickness profile during plating and electroetching |
| 12/17/2003 | EP1371754A1 Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 12/17/2003 | CN1462330A Method for forming abrasion-resistant layer for moving blade, abrasion-resistant layer and method for regeneration thereof, and gas turbine |
| 12/16/2003 | US6664727 Field emision type cold cathode device, manufacturing method thereof and vacuum micro device |
| 12/16/2003 | US6664633 Alkaline copper plating |
| 12/16/2003 | US6663761 Fine pattern forming method, developing/washing device used for the same, plating method using the same, and manufacturing method of thin film magnetic head using the same |
| 12/16/2003 | US6662673 Linear motion apparatus and associated method |
| 12/11/2003 | WO2003103025A2 Method and apparatus of sealing wafer backside for full-face electrochemical plating |
| 12/11/2003 | WO2003102277A1 Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board |
| 12/11/2003 | WO2002075792A3 Method of sealing wafer backside for full-face electronchemical plating |
| 12/11/2003 | WO2002068863A3 Structural components for the boiler zone of power plants or refuse incineration plants |
| 12/11/2003 | US20030228743 Pattern forming method and pattern forming device |
| 12/11/2003 | US20030226764 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 12/11/2003 | US20030226758 Tin plating method |
| 12/10/2003 | EP1369504A1 Metal strip for the manufacture of components for electrical connectors |
| 12/10/2003 | EP1369099A2 Improvements in stent manufacture |
| 12/10/2003 | CN1461358A Porous nickel foil for alkaline battery cathode, production method and device therefor |
| 12/10/2003 | CN1461258A Coated article having stainless steel colour |
| 12/09/2003 | US6660633 Method of reducing electromigration in a copper line by electroplating an interim copper-zinc alloy thin film on a copper surface and a semiconductor device thereby formed |
| 12/09/2003 | US6660154 Contacting a metal seed layer with a copper colloid composition including a minor amount of ionizable palladium compound |
| 12/09/2003 | US6660153 Seed layer repair bath |
| 12/09/2003 | US6660152 Elemental silicon nanoparticle plating and method for the same |
| 12/09/2003 | US6660139 Plating apparatus and method |
| 12/09/2003 | US6660137 System for electrochemically processing a workpiece |
| 12/04/2003 | WO2003100138A1 Copper laminate, composite lamellar material comprising said copper laminate and a procedure for producing it |
| 12/04/2003 | WO2003099490A1 Method for the galvanic coating of a continuous casting mould |
| 12/04/2003 | WO2003030186A3 Nickel coated copper as electrodes for embedded passive devices |
| 12/04/2003 | US20030224196 Metal hydride composite materials |
| 12/04/2003 | US20030222667 Probe card assembly |
| 12/04/2003 | US20030221969 Copper sulfate plating bath is used which contains a polyether containing at least five ether oxygen atoms in molecule, and a compound represented by formula of R1-S-(CH2O)n-R2-SO3M (wherein, R1 is a hydrogen atom, -(S)n-(CH2O)n-R2-SO3M, or |
| 12/04/2003 | US20030221967 Filling is provided, wherein after flash plating, a PPR current is applied for a cycle of 1 to 50 msec positive electrolysis time and 0.2 to 5 msec reverse electrolysis time until an F/R ratio representing the ratio of positive |
| 12/04/2003 | US20030221966 A patterned dielectric layer including small diameter vias and large diameter trenches, a pulse reverse electroplating sequence with a two-component chemistry is modified to substantially fill the vias, while in a subsequent DC |
| 12/04/2003 | US20030221957 Anode impedance control through electrolyte flow control |
| 12/04/2003 | US20030221956 Anode slime reduction method while maintaining low current |
| 12/04/2003 | US20030221953 Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 12/03/2003 | EP1366219A2 Bath for the galvanic deposition of gold and gold alloys, and the use thereof |
| 12/03/2003 | EP0966556B1 Graded metal hardware component for an electrochemical cell |
| 12/03/2003 | CN2589490Y Pitch adjustable galvanizing cup of anode, cathode and even flow plate in disk stage packaging |