| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 02/26/2004 | US20040035694 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
| 02/26/2004 | DE10237480A1 Process for coating a thermo-bimetal with a coating material comprises degreasing the surface of the bimetal to be coated, pickling the degreased surface, and depositing the coating material |
| 02/26/2004 | CA2465363A1 Electrolytic copper plating solutions |
| 02/25/2004 | EP1392092A1 COPPER PLATED CIRCUIT LAYER−CARRYING COPPER CLAD LAMINATED SHEET AND METHOD OF PRODUCING PRINTED WIRING BOARD USING THE COPPER PLATED CIRCUIT LAYER−CARRYING COPPER CLAD LAMINATED SHEET |
| 02/25/2004 | EP1391540A2 Methods and apparatus for improved current density and feature fill control in ECD reactors |
| 02/25/2004 | EP1391538A2 Chrome plated engine valve |
| 02/25/2004 | EP1390967A2 Method of sealing wafer backside for full-face electrochemical plating |
| 02/24/2004 | US6695962 Used to deposit, polish, or electro-polish metal films on a substrate, or to remove such metal films from such a substrate |
| 02/24/2004 | US6695587 Gas turbine airfoil protected by aluminide and platinum aluminide coatings, and its preparation |
| 02/24/2004 | US6694943 Cylinder for internal combustion engine and method of treating inner wall surface of the cylinder |
| 02/19/2004 | US20040033904 Electrodepositing the metal layer on a biaxially textured metal substrate such that the surface of the metal layer has the same texture as that of the substrate. |
| 02/19/2004 | US20040031693 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus |
| 02/19/2004 | US20040031690 Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same |
| 02/19/2004 | US20040031461 Chrome plated engine valve |
| 02/18/2004 | EP1389285A2 Structural components for the boiler zone of power plants or refuse incineration plants |
| 02/18/2004 | CN1476740A Printed wiring board-use copper foil and copper clad laminated sheet using printed wiring board-use copper foil |
| 02/17/2004 | US6693031 Formation of a metallic interlocking structure |
| 02/17/2004 | US6692629 Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer |
| 02/17/2004 | US6691912 Methods of avoiding blowhole formation by conditioning through holes and glass |
| 02/17/2004 | US6691763 Die manufacturing |
| 02/12/2004 | WO2004013381A2 Insoluble anode loop in copper electrodeposition cell for interconnect formation |
| 02/12/2004 | WO2003053621A3 Wire for high-speed electrical discharge machining |
| 02/12/2004 | US20040029006 Smooth surfaces, fine crystal structure; tensile strength, elongation |
| 02/12/2004 | US20040027718 Method for seed layer removal for magnetic heads |
| 02/12/2004 | US20040026257 Methods and apparatus for improved current density and feature fill control in ECD reactors |
| 02/12/2004 | US20040026255 Plating substrate; electrolytic cell containing ion exchanging membrane |
| 02/12/2004 | US20040026254 Covering dielectric with electroconductive polymer active material; laser ablation |
| 02/12/2004 | DE10235020A1 Device for etching large surface semiconductor wafers in a trough-shaped receiver containing a liquid electrolyte used in semiconductor manufacture comprises a testing head provided with a device for holding at least one wafer |
| 02/12/2004 | DE10234285A1 Vorrichtung zur galvanischen Abscheidung prothetischer, metallischer Dentalformteile Apparatus for electrodepositing prosthetic, metallic, molded dental components |
| 02/11/2004 | CN1138022C Equipment and technology for electroplating steel pipe inner wall by using auxiliary anode and spray-plating zinc solution |
| 02/10/2004 | US6689686 System and method for electroplating fine geometries |
| 02/10/2004 | US6689216 Filling copper into recesses for interconnects formed on a semiconductor and removing a plating liquid remaining on the substrate-contacting portion with suction |
| 02/05/2004 | WO2004011188A1 Brazing product and method of manufacturing a brazing product |
| 02/05/2004 | US20040022940 Can reinforce the thin portion of the seed layer and ensures complete filling with copper of the fine recesses, and which is so stable that its performance is not lowered after a long-term continuous use thereof. |
| 02/05/2004 | US20040022009 Component formation via plating technology |
| 02/05/2004 | US20040020783 Copper bath and methods of depositing a matt copper coating |
| 02/05/2004 | US20040020781 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 02/05/2004 | US20040020780 Connecting a power supply between a conductive layer on substrate and an electrode positioned in processing solution; immersing substrate into the processing solution; applying a forward electrical bias to conductive layer during immersion |
| 02/05/2004 | US20040020779 Method and device for producing a galvanic layer on a substrate surface |
| 02/05/2004 | DE10234122A1 Device for electrochemically processing a workpiece for electrophoretic or galvanic deposition comprises separately arranged electrodes which are impinged with a current produced by a current source |
| 02/05/2004 | DE10232612A1 Vorrichtung und Verfahren zur Überwachung eines elektrolytischen Prozesses Apparatus and method for monitoring an electrolytic process |
| 02/05/2004 | DE10229005A1 Vorrichtung und Verfahren zur elektrochemischen Metallabscheidung Apparatus and method for electro-chemical metal deposition |
| 02/05/2004 | CA2493037A1 Brazing product and method of manufacturing a brazing product |
| 02/04/2004 | EP1386984A1 Cathode cartridge for electroplating tester |
| 02/04/2004 | EP1222321B1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 02/04/2004 | CN1473357A Substrate processing method |
| 02/04/2004 | CN1473284A Mask forming and removing method, and semiconductor device, electric circuit, display module, color filter and emissive device manufactured by the same method |
| 02/04/2004 | CN1473206A Plasma electroplating |
| 02/04/2004 | CN1472794A Method for forming copper teading wires in semiconductor device |
| 02/04/2004 | CN1137511C Method for galvanically forming conductor structures of high-purity copper in production of integrated circuits |
| 02/04/2004 | CN1137510C Method for making semiconductor device |
| 02/03/2004 | US6686607 Structure and method for mounting a semiconductor element |
| 02/03/2004 | US6685817 Controlling thickness of plating over a width of a substrate |
| 02/03/2004 | US6685815 Covering substrate supported within housing with electrolyte, displacing portion of electrolyte from housing prior to electrically biasing substrate, electrically biasing substrate |
| 02/03/2004 | US6685814 Baffles, shields |
| 01/29/2004 | WO2004010464A2 Methods of electrochemically treating semiconductor substrates, and methods of forming capacitor constructions |
| 01/29/2004 | WO2004009879A1 Plating device |
| 01/29/2004 | WO2004009878A2 Electrochemical processing cell |
| 01/29/2004 | WO2004009875A2 Tilted electrochemical plating cell with constant wafer immersion angle |
| 01/29/2004 | WO2004009871A1 Multilayer plated fuel line parts for automobile |
| 01/29/2004 | US20040018675 Nickel plating process having controlled hydrogen concentration |
| 01/29/2004 | US20040018660 Method of fabricating multilayered UBM for flip chip interconnections by electroplating |
| 01/29/2004 | US20040016648 For immersing a substrate for plating operations |
| 01/29/2004 | US20040016647 Positioning substrate in a catholyte solution comprising acid source and copper source contained in a catholyte chamber of a plating cell, applying a plating bias between the substrate and an anode positioned in an anolyte chamber |
| 01/29/2004 | US20040016637 Multi-chemistry plating system |
| 01/29/2004 | US20040016636 Electrochemical processing cell |
| 01/29/2004 | DE10229001A1 Verfahren und System zum Steuern der Ionenverteilung während des galvanischen Auftragens eines Metalls auf eine Werkstückoberfläche A method and system for controlling the distribution of ions during the galvanic depositing a metal on a workpiece surface |
| 01/29/2004 | DE10228323A1 Verfahren zum Elektroplattieren von metallischen und Metallmatrix-Komposit Folien, Beschichtungen und Mikrokomponenten Method for electroplating of metal and metal matrix composite films, coatings and micro components |
| 01/28/2004 | EP1384448A1 Apparatus for the electrolytic deposition on metallic prothetic dental elements |
| 01/28/2004 | CN1470677A Plastic surface laser-carving and electroplating method |
| 01/28/2004 | CN1470676A Apparatus for removing fir-tree crystal of metal strip edge |
| 01/27/2004 | US6682642 Seed repair and electroplating bath |
| 01/27/2004 | US6682220 Lightweight bearing and wave gear drive |
| 01/22/2004 | WO2004007811A2 Device and method for monitoring an electrolytic process |
| 01/22/2004 | WO2004007810A1 Electromagnetic wave shield material and process for producing the same |
| 01/22/2004 | WO2004007809A2 Plain bearing having an overlay alloy layer |
| 01/22/2004 | US20040013793 High aspect ratio; photoresists |
| 01/22/2004 | US20040011655 For performing plating on a long conductive substrate |
| 01/22/2004 | US20040011653 Methods of electrochemically treating semiconductor substrates, and methods of forming capacitor constructions |
| 01/22/2004 | DE10326337A1 Vorrichtung zum Entfernen von Dendriten an den Kanten eines Metall-Bandes An apparatus for removing dendrites at the edges of a metal band |
| 01/22/2004 | DE10228843A1 Verfahren zur chargenweisen Beschichtung von Sägedraht A method for the batchwise coating of saw wire |
| 01/21/2004 | EP1382065A1 Electropolishing metal layers on wafers having trenches or vias with dummy structures |
| 01/21/2004 | EP1381474A1 Internal heat spreader plating methods and devices |
| 01/21/2004 | CN2600454Y Diamond internal blade plating forming device |
| 01/21/2004 | CN2600453Y Foam Ni(Cu) and nickel net (felt) producing equipment |
| 01/21/2004 | CN1469460A Thin film bearing belt for assembling electronic parts |
| 01/21/2004 | CN1468982A Gold-plating apparatus and gold-plating method |
| 01/21/2004 | CN1135307C Micro-valve and process for producing micro-valve |
| 01/20/2004 | US6679983 Bath, source of metal ions, an electrolyte comprising two or more acids and optional additive(s); fill of small features with less overplate; copper electroplating |
| 01/15/2004 | WO2004006228A2 Reflective or semi-reflective metal alloy coatings |
| 01/15/2004 | WO2003090257A3 Method for the production of thin metal-containing layers having low electrical resistance |
| 01/15/2004 | WO2002047139A3 Methode of forming a copper film on a substrate |
| 01/15/2004 | US20040009659 Method of forming copper wiring in a semiconductor device |
| 01/15/2004 | US20040007611 Asymmetric plating |
| 01/15/2004 | US20040007478 Electroetching system and process |
| 01/15/2004 | US20040007474 Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode |
| 01/15/2004 | US20040007473 Electrolyte/organic additive separation in electroplating processes |
| 01/15/2004 | US20040007467 A vessel surface is shaped to provide a uniform current density at a microfeature semiconductor workpiece; electrodeposition, electroplating |
| 01/15/2004 | US20040007459 Anode isolation by diffusion differentials |
| 01/15/2004 | US20040006869 Method of manufacturing sheet material and method of manufacturing circuit device using the same |