| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
|---|
| 04/14/2004 | EP1407062A1 Composite foil and its manufacturing process |
| 04/14/2004 | EP1406739A1 Continuous casting roll for casting molten baths and method for producing one such continuous casting roll |
| 04/14/2004 | CN1145719C Conductive roller in electroplating strip device and cooling method for said conductive roller |
| 04/13/2004 | US6720089 Pure titanium panel with frame around margin to inhibit movement during heat treatment which forms decorative recrystallized area, including four interconnected elements with stiffening adjacent corners and contacting margin |
| 04/08/2004 | WO2004019385A3 Coating support and method for the selective coating of conductive tracks on one such support |
| 04/08/2004 | WO2004006228A3 Reflective or semi-reflective metal alloy coatings |
| 04/08/2004 | WO2004001178A3 Method and apparatus for downhole pipe or casing repair |
| 04/08/2004 | WO2003044248A8 Device for electrolytic treatment and hardening of the surface of the heat exchange tubes of steam generators of nuclear power plants |
| 04/08/2004 | WO2002072923A3 Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
| 04/08/2004 | US20040065558 Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
| 04/08/2004 | US20040065556 Method for electroplating a cylindrical inside surface of a work-piece-extending substantially over a semi-circle |
| 04/08/2004 | US20040065553 Contacting substrate with masking structure; multilayer, three-dimensional structure ; cycles; etching to remove residues |
| 04/08/2004 | US20040065552 Method for electrochemical fabrication |
| 04/08/2004 | US20040065543 Insoluble electrode for electrochemical operations on substrates |
| 04/08/2004 | US20040065225 Electrodeposition; using gold sulfite complex; dental molding |
| 04/08/2004 | US20040064951 Method of producing a workpiece having at least one bearing eye |
| 04/08/2004 | US20040064950 Method of producing a workpiece forming at least one bearing eye |
| 04/08/2004 | US20040064949 Method of producing a workpiece having at least one bearing eye |
| 04/08/2004 | US20040064948 Method of producing a workpiece having at least one bearing eye |
| 04/07/2004 | EP1405336A2 Substrate processing method |
| 04/07/2004 | EP1404899A1 Method and electrode for defining and replicating structures in conducting materials |
| 04/06/2004 | US6717236 Filling via with copper-rich copper-zinc alloy electroplated on copper surface from stable chemical solution, controlling zinc doping; improved interconnect reliability and corrosion resistance |
| 04/06/2004 | US6716738 Method of fabricating multilayered UBM for flip chip interconnections by electroplating |
| 04/06/2004 | US6716334 Electroplating process chamber and method with pre-wetting and rinsing capability |
| 04/06/2004 | US6716329 Processing apparatus and processing system |
| 04/01/2004 | WO2004003935A3 Cu ecp planarization by insertion of polymer treatment step between gap fill and bulk fill steps |
| 04/01/2004 | US20040060825 Copper-plating liquid, plating method and plating apparatus |
| 04/01/2004 | US20040060824 Chemical treatment, plating, and residue elimination method |
| 04/01/2004 | US20040060581 Vertical proximity processor |
| 04/01/2004 | US20040060580 Meniscus, vacuum, IPA vapor, drying manifold |
| 04/01/2004 | US20040060573 Proximity head for drying a substrate; and a cleaning system for cleaning wafers |
| 04/01/2004 | US20040060195 Methods and systems for processing a substrate using a dynamic Liquid meniscus |
| 03/31/2004 | EP1403401A2 Precious alloyed metal solder plating process |
| 03/31/2004 | EP1402568A2 Method and apparatus for controlling a plating process |
| 03/31/2004 | CN1143906C Process for depositing layer of material on substrate |
| 03/30/2004 | US6711925 Process for manufacturing a conductive wire suitable for use in semiconductor packages |
| 03/25/2004 | WO2003060959A3 Method for applying metal features onto barrier layers using electrochemical deposition |
| 03/25/2004 | US20040056357 Circuit device and method of manufacturing the same |
| 03/25/2004 | US20040055895 Electrodeposition of noble metal and one other metal for alloying with noble metal on the surface of a microelectronic workpiece, using an acid bath; electrolysis |
| 03/25/2004 | US20040055893 Utilizes a vacuum chuck-type substrate holder configured to secure a substrate thereto with the back side of the substrate being in contact with the vacuum chuck and the production side being exposed to an electrolyte solution |
| 03/25/2004 | US20040055890 ProvideS a film having a highly uniform thickness by plating; electric current limiting member limits horizontal flow of an electric current in the plating liquid between second electrode and substrate within plating vessel during plating |
| 03/25/2004 | US20040055889 Using ultraviolet light; joining semiconductor die to substrate; prevent short circuiting |
| 03/25/2004 | US20040055877 Workpiece processor having processing chamber with improved processing fluid flow |
| 03/25/2004 | US20040055876 Cam driven paddle assembly for a plating cell |
| 03/25/2004 | DE10242772A1 Galvanisierungseinrichtung Electroplating |
| 03/25/2004 | DE10241619A1 Vorrichtung und Verfahren zum elektrolytischen Behandeln von zumindest oberflächlich elektrisch leitfähigem Behandlungsgut Method and apparatus for electrolytic treatment of at least superficially electrically conductive material to be treated |
| 03/24/2004 | EP1400613A2 Tin plating method |
| 03/24/2004 | EP1399385A2 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires |
| 03/24/2004 | CN1484714A Ni-plated steel plate for alkali-manganese dry cell anode can and alkali manganese dry cell anode can |
| 03/23/2004 | US6709564 Electrodepositing copper; organic additive increases throwing power, leveling, suppresses deposition rate; copper salts increase overvoltage; copper pyrophosphate; cyanide, halide, thiocyanate, sulfamate; 2,5-dimercapto-1,3,4-thiadiazole |
| 03/23/2004 | US6709563 Copper-plating liquid, plating method and plating apparatus |
| 03/23/2004 | US6709562 Void-free and seamless; copper is superior to the electromigration resistance of alcu |
| 03/18/2004 | WO2004022814A2 Device and method for electrolytically treating an at least superficially electrically conducting work piece |
| 03/18/2004 | WO2003093524A3 Apparatus and method for regulating the electrical power applied to a substrate during immersion |
| 03/18/2004 | US20040053509 Fluid treatment system |
| 03/18/2004 | US20040053077 Magnetic film and thin film magnetic head using this magnetic film |
| 03/18/2004 | US20040053019 Printed wiring board-use copper foil and copper clad laminated sheet using the printed wiring board-use copper foil |
| 03/18/2004 | US20040051999 Soft magnetic film and thin film magnetic head using the same |
| 03/18/2004 | US20040050711 Substrate is brought into contact, at least once, with a processing solution containing at least one of organic substance and sulfur compound which are contained in a plating solution |
| 03/18/2004 | DE202004000597U1 Decorative metal material, e.g. for a fountain pen cap, has a black chrome layer which is plated to the metal surface and forms a bond between the substrate surface and the paint layer |
| 03/17/2004 | EP1398400A2 Apparatus for galvanisation |
| 03/17/2004 | EP1397828A1 Electrolytic processing device and substrate processing apparatus |
| 03/17/2004 | EP1397530A2 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 03/17/2004 | CN1482286A Galvanization apparatus and process of tube-type crystallizer |
| 03/16/2004 | US6706418 For use in electroplating printed circuit boards and other electronic packaging devices |
| 03/16/2004 | US6706166 Method for improving an electrodeposition process through use of a multi-electrode assembly |
| 03/11/2004 | WO2004020704A1 Apparatus and method for deposition of an electrophoretic emulsion |
| 03/11/2004 | US20040045832 Methods for using the solutions and products formed by using such methods and solutions in which the solutions contain copper alkanesulfonate salts and free alkanesulfonic acids, wherein the free acid has a concentration from about 0.05 to |
| 03/11/2004 | US20040045831 Apparatus for electro-chemically depositing a metal onto a substrate. The apparatus generally includes a head assembly having a cathode and a wafer holder disposed above the cathode. The apparatus further includes a process kit disposed |
| 03/11/2004 | US20040045813 Wafer processing apparatus, wafer stage, and wafer processing method |
| 03/11/2004 | US20040045502 Apparatus for and method of processing substrate |
| 03/10/2004 | CN1480988A Filming method of substrate and filming appts. |
| 03/10/2004 | CN1480563A Electrolytic copper foil and electrolytic copper foil for secondary cell collector |
| 03/09/2004 | US6703145 Process for electrolytic coating of a substrate and product produced |
| 03/04/2004 | WO2004019385A2 Coating support and method for the selective coating of conductive tracks on one such support |
| 03/04/2004 | WO2004018740A1 Surface treated steel plate for battery cases, its manufacturing method, battery case formed using the steel plate, battery using the battery case |
| 03/04/2004 | WO2004018739A1 Surface treated steel plate for battery cases and battery case using same |
| 03/04/2004 | WO2003090257B1 Method for the production of thin metal-containing layers having low electrical resistance |
| 03/04/2004 | US20040043609 Method of fabricating semiconductor device |
| 03/04/2004 | US20040043242 Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board |
| 03/04/2004 | US20040041194 Metal plating using seed film |
| 03/04/2004 | US20040040855 Bonding pads; integrated circuit dies; multilayers; electroconductive and dielectric layers |
| 03/04/2004 | CA2496131A1 Coating support and method for the selective coating of conductive tracks on one such support |
| 03/03/2004 | EP1394291A2 Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board |
| 03/03/2004 | EP1392889A1 Anode assembly and process for supplying electrolyte to a planar substrate surface |
| 03/03/2004 | CN1479565A 布线基板及其制造方法 Wiring board and manufacturing method thereof |
| 03/03/2004 | CN1479391A Surface treatment steel plate for battery case, battery case and battery using the case |
| 03/02/2004 | US6699396 Methods for electroplating large copper interconnects |
| 03/02/2004 | US6699380 Robotic transferring between cells |
| 03/02/2004 | US6699373 Apparatus for processing the surface of a microelectronic workpiece |
| 02/26/2004 | WO2004017384A1 Device for etching semiconductors with a large surface area |
| 02/26/2004 | WO2004016829A2 Electrolytic copper plating solutions |
| 02/26/2004 | WO2003018878A3 Segmented counterelectrode for an electrolytic treatment system |
| 02/26/2004 | US20040038148 Positive type radiation-sensitive resin composition for producing product formed by plating and process for producing product formed by plating |
| 02/26/2004 | US20040038052 Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
| 02/26/2004 | US20040038049 Release layer, a diffusion preventive layer and a copper electroplating layer; printed circuits |
| 02/26/2004 | US20040037682 Substrate holder, plating apparatus, and plating method |
| 02/26/2004 | US20040035712 An electrical apparatus comprising tank, chucks, shaft and drives, for electrodepositing a copper layer on a substrate, cleaning or etching, uniformity deposition from a solution |
| 02/26/2004 | US20040035707 For plating copper onto semiconductor wafer; methods apply to patterned metal layers plated onto seed layer partially protected by overlying photoresist; sealing performed by engaging seal against photoresist to prevent corrosion |
| 02/26/2004 | US20040035695 Flow diffuser to be used in electro-chemical plating system |