| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 05/13/2004 | WO2004040044A1 Metal plating structure and method for production thereof |
| 05/13/2004 | WO2004010464A3 Methods of electrochemically treating semiconductor substrates, and methods of forming capacitor constructions |
| 05/13/2004 | US20040091625 Methods of filling a feature on a substrate with copper nanocrystals |
| 05/13/2004 | US20040091385 Wt. % tin, 30-65 wt. % zinc and 0.1-15 wt. % metal from the following group as a third alloy component; iron, cobalt, nickel. Alloy coatings can be produced by means of electrolytic deposition from aqueous galvanic electroplating |
| 05/13/2004 | US20040089557 Process for electrolytic copper plating |
| 05/13/2004 | US20040089555 Continuous metal plating and supplemental processing in one housing; substrate stage between cassette stage and pre-treatment unit; cleaning with pure water; drying |
| 05/13/2004 | US20040089554 Apparatus and method for electroplating a metallic film on a rocket engine combustion chamber component |
| 05/13/2004 | US20040089260 Cylinder for internal combustion engine and method of treating inner surface of the cylinder |
| 05/13/2004 | DE10228998B4 Vorrichtung und Verfahren zum elektrochemischen Behandeln eines Substrats bei reduzierter Metallkorrosion An apparatus and method for electrochemically treating a substrate with reduced metal corrosion |
| 05/12/2004 | EP1417706A2 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
| 05/12/2004 | EP0792463B1 Mounting spring elements on semiconductor devices |
| 05/12/2004 | CN1495870A Composite intermediate connection element of microelectronic component and its making method |
| 05/12/2004 | CN1495296A Electroplating method and device for wire stock, and electroplate wire stock |
| 05/12/2004 | CN1149813C Honeycomb telephone shell |
| 05/11/2004 | US6733650 Apparatus and process for producing zinc oxide film |
| 05/06/2004 | WO2004039137A1 Plasma display panel-use copper foil and production method therefor |
| 05/06/2004 | WO2004038072A2 Plating uniformity control by contact ring shaping |
| 05/06/2004 | WO2004038065A1 Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereon |
| 05/06/2004 | WO2002004711A3 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 05/06/2004 | US20040087171 Combined conformal/non-conformal seed layers for metallic interconnects |
| 05/06/2004 | US20040086739 Film carrier tape for mounting electronic part |
| 05/06/2004 | US20040086697 Metal alloy compositions and plating methods related thereto |
| 05/06/2004 | US20040084509 Method of connecting module layers suitable for the production of microstructure modules and a microstructure module |
| 05/06/2004 | US20040084320 Electroplating silicon wafer; free of seeding or chemical mechanical polishing; integrated circuits |
| 05/06/2004 | US20040084319 Method for electrochemical fabrication |
| 05/06/2004 | US20040084318 Electrofilling; immersing substrate in wetting solution; applying ultrasonic or megasonic vibrations; applying high pressure electrolyte jets of metal or alloy; electroplating |
| 05/06/2004 | US20040084316 Voltage applied between cathode electrode in contact with edge of substrate and vertically moveable anode; copper films of uniform thickness |
| 05/06/2004 | US20040084315 Plating apparatus and plating method |
| 05/06/2004 | US20040084301 Electro-chemical deposition system |
| 05/06/2004 | US20040083850 Lightweight bearing and wave gear drive |
| 05/06/2004 | EP1415748A2 Method of connecting micro structured component layers suitable for making micro structered components and micro structured component |
| 05/06/2004 | EP1415021A1 Copper on invar composite and method of making |
| 05/05/2004 | CN1494606A Bath for galvanic deposition of gold and gold alloys, and use thereof |
| 05/05/2004 | CN1494462A Internal heat spreader plating methods and devices |
| 05/05/2004 | CN1148469C Vulcanized elastic material product, article and its reinforcing structure |
| 05/05/2004 | CN1148465C Method for preparing composite conductive material |
| 05/05/2004 | CN1148463C Roll forming structure steel profiles with galvanised coating |
| 05/04/2004 | US6731061 Dual layer electroplated structure for a flat panel display device |
| 05/04/2004 | US6730207 Method of manufacturing part for optical fiber connector |
| 05/04/2004 | US6730198 Container-shaped physical vapor deposition targets |
| 04/29/2004 | WO2004035860A1 Metal resin composite and process for producing the same |
| 04/29/2004 | WO2004016829A3 Electrolytic copper plating solutions |
| 04/29/2004 | WO2003103025A3 Method and apparatus of sealing wafer backside for full-face electrochemical plating |
| 04/29/2004 | US20040080053 Electropolishing metal layers on wafers having trenches or vias with dummy structures |
| 04/29/2004 | US20040079646 Pretreatment; removal bubbles adsorbed on substrate; rotation, immersion in plating solution |
| 04/29/2004 | DE10248965A1 Contact system for an electroplating bath, can be a roller which is conductive for each contact point, with alternating switching as a cathode and anode |
| 04/29/2004 | DE10248803A1 Elektrische Kontaktoberflächen Electrical contact surfaces |
| 04/29/2004 | CA2503159A1 Metal resin composite and process for producing the same |
| 04/28/2004 | EP1412781A1 Method for achieving a mirror surface and mirror with such a mirror surface |
| 04/28/2004 | EP1412561A1 Workpiece wet processing |
| 04/28/2004 | EP1051544B1 Process chamber and method for depositing and/or removing material on a substrate |
| 04/28/2004 | CN1492944A Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 04/28/2004 | CN1148092C 同轴连接器 Coaxial Connectors |
| 04/27/2004 | US6727579 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 04/27/2004 | US6726826 Method of manufacturing a semiconductor component |
| 04/27/2004 | US6726823 Assembly for holding wafer comprising wafer chuck having bottom section and spring member configured to apply electric charge to wafer disposed between bottom section and wafer, and actuator assembly configured to move wafer chuck |
| 04/22/2004 | WO2004033764A1 Liquid treatment apparatus and method of liquid treatment |
| 04/22/2004 | WO2004033763A1 Cup type plating equipment |
| 04/22/2004 | WO2002059398A3 Plating apparatus and method |
| 04/22/2004 | US20040076876 Ni-plated steel plate for alkali-manganese dry cell anode can and alkali-manganese dry cell anode can |
| 04/22/2004 | US20040076850 Structural components for the boiler zone of power plants or refuse incineration plants |
| 04/22/2004 | US20040076051 Electro- and electroless plating of metal in the manufacturing of PCRAM devices |
| 04/22/2004 | US20040074777 Cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a substrate support member having one or more electrical |
| 04/22/2004 | US20040074776 Method and device for the electrolytic coating of a metal strip |
| 04/22/2004 | US20040074763 Plating device and plating method |
| 04/22/2004 | US20040074762 Method and apparatus for sealing electrical contacts during an electrochemical deposition process |
| 04/22/2004 | US20040074761 An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating |
| 04/22/2004 | DE10296935T5 Barrierenverstärkungsprozess für Kupferdurchkontaktierungen(oder Zwischenverbindungen) Barriers amplification process for Kupferdurchkontaktierungen (or intermediates) |
| 04/21/2004 | EP1411591A2 Electrical contact surfaces |
| 04/21/2004 | EP1410430A2 Planar metal electroprocessing |
| 04/21/2004 | EP1409772A2 Method for selectively electroplating a strip-shaped, metal support material |
| 04/21/2004 | EP1328667B1 Compact processing installation for a printing cylinder |
| 04/21/2004 | EP1100638B1 Casting steel strip |
| 04/21/2004 | CN1491073A Copper foil on thin-film for integrated circuit chip, plasma displaying device or high-efficient printing circuit board |
| 04/21/2004 | CN1146522C Surface treatment device |
| 04/21/2004 | CN1146484C Structure and method for jointing metal members |
| 04/20/2004 | US6723449 Structure and plating method of thin film magnetic head and magnetic storage apparatus |
| 04/20/2004 | US6723448 Method of manufacturing honeycomb extrusion die and die manufactured according to this method |
| 04/20/2004 | US6723219 Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewith |
| 04/15/2004 | WO2004031454A2 Cathode design for use in electrodeposition cell |
| 04/15/2004 | WO2004030907A1 Laminate comprising silver layer and, formed thereon, layer for stabilizing the same |
| 04/15/2004 | WO2004007809A3 Plain bearing having an overlay alloy layer |
| 04/15/2004 | US20040072494 Field emission type cold cathode device, manufacturing method thereof and vacuum micro device |
| 04/15/2004 | US20040072456 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
| 04/15/2004 | US20040072423 Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features |
| 04/15/2004 | US20040072419 Method for applying metal features onto barrier layers using electrochemical deposition |
| 04/15/2004 | US20040069651 Oxide treatment and pressure control for electrodeposition |
| 04/15/2004 | US20040069648 Method for electroplating on resistive substrates |
| 04/15/2004 | US20040069647 Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method |
| 04/15/2004 | US20040069646 Electrolytic treatment, such as plating or etching; providing a high resistance structure having an electrical conductivity lower than that of the electrolytic solution in the solution filled between a substrate in contact with an electrode |
| 04/15/2004 | US20040069644 Spin, rinse and dry process performed on the wafer prior to electroplating either in a standalone tool or in a preclean module integrated into an electroplating tool; for semiconductors |
| 04/15/2004 | US20040069319 Method and apparatus for cleaning a substrate using megasonic power |
| 04/15/2004 | US20040068869 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 04/15/2004 | DE10344724A1 Verfahren zum Herstellen eines wenigstens ein Lagerauge bildenden Werkstückes A method for producing at least one bearing eye of a forming workpiece |
| 04/15/2004 | DE10344722A1 Device for producing a workpiece, e.g. sliding bearings for engines, has unit for the galvanic deposition of sliding layer on the orifice surface in electric field between the workpiece as cathode and anode coaxial to the orifice |
| 04/15/2004 | DE10344720A1 Verfahren zum Herstellen eines wenigstens ein Lagerauge aufweisenden Werkstückes A method of manufacturing a bearing eye having at least one workpiece |
| 04/14/2004 | EP1408380A1 Method for producing a protective hologram |
| 04/14/2004 | EP1408338A2 Method for making a probe card with multiple contact tips for testing integrated circuit |
| 04/14/2004 | EP1408337A2 Probe card assembly |
| 04/14/2004 | EP1408197A1 Method for forming abrasion-resistant layer for moving blade, abrasion-resistant layer and method for regeneration thereof, and gas turbine |