| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 06/24/2004 | WO2004053202A1 Methods for forming copper interconnect structures by co-plating of noble metals and structures formed thereby |
| 06/24/2004 | WO2004053193A1 Peel strength enhancement of copper laminates 102426-201 |
| 06/24/2004 | WO2004052547A2 Coated and magnetic particles and applications thereof |
| 06/24/2004 | WO2004010464B1 Methods of electrochemically treating semiconductor substrates, and methods of forming capacitor constructions |
| 06/24/2004 | US20040118699 Homogeneous copper-palladium alloy plating for enhancement of electro-migration resistance in interconnects |
| 06/24/2004 | US20040118696 electrolytically treating a copper or copper alloy substrate with a solution of phosphoric acid and a carboxylic acid, and electrodepositing tin or tin alloy; reduced tendency to form whiskers |
| 06/24/2004 | US20040118694 Multi-chemistry electrochemical processing system |
| 06/24/2004 | US20040118692 Plating-rinse-plating process for fabricating copper interconnects |
| 06/24/2004 | US20040118690 successive conditioning, Pd activation, electroless copper plating, and electrolytic copper plating treatments; irradiation with ultraviolet light in the presence of treatment solution; resin is activated to improve copper adhesion |
| 06/24/2004 | US20040118676 Plating apparatus and plating method |
| 06/23/2004 | EP1432016A2 A plating-rinse-plating process for fabricating copper interconnects |
| 06/23/2004 | EP1431424A2 Plating apparatus and plating method |
| 06/23/2004 | EP1430167A2 Plating apparatus and method |
| 06/23/2004 | EP1430166A2 Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
| 06/23/2004 | CN1506502A Method and equipment for controlling local electric current to obtain uniform electroplating thickness |
| 06/23/2004 | CN1506501A Electroplating liquid |
| 06/23/2004 | CN1155111C Method for producing solar cell precursor thin film and solar cell |
| 06/22/2004 | US6752915 Web conveying apparatus, and apparatus and method for electrodeposition using web conveying apparatus |
| 06/22/2004 | US6752884 Method for manufacturing mesh screen of electrodeless lighting system |
| 06/22/2004 | US6752855 For providing substrate such as a semiconductor wafer solution treatment |
| 06/17/2004 | WO2004052062A1 Device for the metallisation of printed forms which are equipped with electrically conductive tracks and associated metallisation method |
| 06/17/2004 | WO2004050937A2 Method for coating piston rings for internal combustion engines |
| 06/17/2004 | US20040116004 Method for producing male terminal fittings and terminal fitting |
| 06/17/2004 | US20040115932 Method and apparatus for controlling local current to achieve uniform plating thickness |
| 06/17/2004 | US20040115340 Depositing particles comprising at least one coating on a substrate; andreflowing the particles to at least partially melt the coating, thereby forming a substantially continuous solidified solder material |
| 06/17/2004 | US20040113244 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 06/17/2004 | US20040112760 Constant low force wafer carrier for electrochemical mechanical processing and chemical mechanical polishing |
| 06/17/2004 | US20040112634 Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 06/17/2004 | DE10256063A1 Verfahren zum Beschichten von Kolbenringen für Verbrennungsmotoren A process for coating of piston rings for internal combustion engines |
| 06/16/2004 | EP1429429A1 A method for producing male terminal fittings and terminal fitting |
| 06/16/2004 | EP1428982A1 A method of depositing a local MCrAIY-coating |
| 06/16/2004 | EP1427872A1 Electrode attachment to anode assembly |
| 06/16/2004 | EP1427656A1 Belt apparatus for carrying elements during treatment |
| 06/16/2004 | CN1505141A Structure comprising a barrier layer of a tungsten alloy and manufacturing method thereof |
| 06/15/2004 | US6750597 Method for manufacturing spark plug and spark plug |
| 06/15/2004 | US6750144 Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes |
| 06/15/2004 | US6749728 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 06/15/2004 | US6749391 Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces |
| 06/10/2004 | WO2004048825A1 Gland packing and process for producing the same |
| 06/10/2004 | WO2004038072A3 Plating uniformity control by contact ring shaping |
| 06/10/2004 | WO2004009875A3 Tilted electrochemical plating cell with constant wafer immersion angle |
| 06/10/2004 | US20040108217 Forming aperture in dielectric overcoating substrate; forming barrier; plating with copper alloy |
| 06/10/2004 | US20040108213 Plating bath composition control |
| 06/10/2004 | US20040108199 Device for electrodepositing metallic, prosthetic, molded, dental components |
| 06/10/2004 | US20040108136 Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickel |
| 06/09/2004 | EP1425067A2 Radioactive implantable devices and methods and apparatuses for their production and use |
| 06/09/2004 | EP1070159A4 Electrodeposition of metals in small recesses using modulated electric fields |
| 06/09/2004 | DE20320396U1 Veredelungsanlage zum Veredeln von langgestrecktem Wickelgut Processing plant for finishing long winding |
| 06/09/2004 | CN1503345A Method of forming planar Cu interconnects without chemical mechanical polishing |
| 06/09/2004 | CN1502725A Wafer electroplating device and method |
| 06/09/2004 | CN1152983C Device for segregating metal from electrolytic solution containing metal |
| 06/08/2004 | US6746591 ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature |
| 06/08/2004 | US6746578 Selective shield/material flow mechanism |
| 06/03/2004 | WO2004046426A1 Integrated plating and planarization process and apparatus therefor |
| 06/03/2004 | WO2004046418A1 Substrate processing apparatus and method for processing substrate |
| 06/03/2004 | US20040106235 Method for manufacturing circuit devices |
| 06/03/2004 | US20040104120 Wafer chuck assembly for holding a wafer |
| 06/03/2004 | US20040104119 Electronic apparatus for plating copper onto substrate, a support of a detachable cathode clamp ring positioned at perimeter of the substrate; anode assembly is movable in a direction perpendicular to substrate, fluid inlets |
| 06/03/2004 | US20040103921 Method for electrochemically treating articles and apparatus and method for cleaning articles |
| 06/03/2004 | DE10261852B3 Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling |
| 06/02/2004 | EP1424407A1 Plating bath for forming thin resistance layer, method of formation of resistance layer, conductive base with resistance layer, and circuit board material with resistance layer |
| 06/02/2004 | CN2618928Y 边缘罩 Edge cover |
| 06/02/2004 | CN1152430C Manufacture of wire holder in double electroplating mold |
| 06/01/2004 | US6743719 Method for forming a conductive copper structure |
| 06/01/2004 | US6743532 Multi-layer coating, nickel basecoat layer, and a layers of carbon- rich refractory metal or refractory metal alloy carbonitride alternating with layers of nitrogen-rich refractory metal or refractory metal alloy carbonitride. |
| 05/27/2004 | WO2004044273A1 Electropolishing system and process |
| 05/27/2004 | WO2004044270A1 Anode for electrometallurgical applications |
| 05/27/2004 | US20040101708 Coated article |
| 05/27/2004 | US20040099534 Overcoating barrier or seed layer with copper, or other metal; connecting electrode to edges of wafer; applying potentials |
| 05/27/2004 | US20040099533 Microelectronics; positioning contactors; concentric anodes; nozzles; electroplating |
| 05/27/2004 | US20040099532 Using insulating shield; electrochemical plating bath; uniform current distribution |
| 05/26/2004 | EP1422320A1 Copper electroplating bath |
| 05/26/2004 | EP1352110B1 Electrodeposited bearing alloy, electroplating bath, and electrodeposition method |
| 05/26/2004 | EP1228267B1 Process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology |
| 05/26/2004 | EP0859877B1 Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects |
| 05/26/2004 | CN1500057A Belt appts. for carrying elements during treatment |
| 05/26/2004 | CN1151009C Fabricating interconnects and tips using sacrificial substrates |
| 05/25/2004 | US6741085 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 05/25/2004 | US6740426 Lead, copper alloy dispersed with silicon nitride particles; automobile, boat bearings; wear and friction resistance |
| 05/25/2004 | US6740425 Electroless deposition using catalyst |
| 05/25/2004 | US6740242 For forming an interconnection by embedding copper in fine interconnection groove defined in surface of semiconductor substrate through copper sulfate plating |
| 05/25/2004 | US6740221 Positioning substrate in an electroplating bath; forming doped copper layer on substrate; wherein the doped copper layer comprises an amount of non-metal that is controlled for increasing electromigration resistance in doped copper layer |
| 05/25/2004 | US6740164 Plating apparatus and method of manufacturing semiconductor device |
| 05/21/2004 | WO2004042790A2 Method for increasing the copper to superconductor ratio in a superconductor wire |
| 05/20/2004 | US20040097070 Method of producing metal film |
| 05/20/2004 | US20040094511 Method of forming planar Cu interconnects without chemical mechanical polishing |
| 05/20/2004 | US20040094427 Includes a table with a polishing pad; the table and pad have holes forming channels for dispensing electroplating solution; plurality of electroplating anodes disposed in the channels and in contact with the electroplating solution |
| 05/20/2004 | US20040094403 Integrated plating and planarization apparatus having a variable-diameter counterelectrode |
| 05/19/2004 | EP1419523A1 Dummy structures to reduce metal recess in electropolishing process |
| 05/19/2004 | EP1419290A2 Segmented counterelectrode for an electrolytic treatment system |
| 05/19/2004 | EP1419289A1 Device for continuous electrodeposition and electrical or electronic components manufactured in strip comprising a plated layer by electrodeposition |
| 05/19/2004 | EP1341951B1 Copper bath and method of depositing a matt copper coating |
| 05/19/2004 | EP1325176B1 Method for electroplating a strip of foam |
| 05/19/2004 | DE10251658A1 Verfahren zum Verbinden von zur Herstellung von Mikrostrukturbauteilen geeigneten, mikrostrukturierten Bauteillagen sowie Mikrostrukturbauteil A method of joining for the production of microstructured components suitable micro-structured component layers, as well as micro-structural component |
| 05/19/2004 | CN1498290A Phosphate film processing method and film processing device |
| 05/19/2004 | CN1497691A Manufacturing method of circuit device |
| 05/19/2004 | CN1150353C Method for forming zinc-oxide film and method of preparing semiconductor element matrix and photoelectric elements |
| 05/18/2004 | US6736953 High frequency electrochemical deposition |
| 05/18/2004 | US6736945 Wafer plating apparatus |
| 05/18/2004 | US6736204 Heat transfer surface with a microstructure of projections galvanized onto it |