| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 08/05/2004 | US20040149585 Electroplating copper bottom layer, depositing insulation pattern and forming permeable core; adding polyimide vias and insulation then filling; forming top metal lines staggered with bottom lines and topping with protective layer |
| 08/05/2004 | US20040149573 Contact ring with embedded flexible contacts |
| 08/05/2004 | DE10344723A1 Verfahren zum Herstellen eines wenigstens ein Lagerauge aufweisenden Werkstückes A method of manufacturing a bearing eye having at least one workpiece |
| 08/04/2004 | EP1114209B1 Hard-chrome plated layer |
| 08/04/2004 | CN1518060A Metal element, semiconductor device, electronic device and electronic equipment and its manufacturing method |
| 08/04/2004 | CN1518030A Electromagnetic switch and its electroplating method |
| 08/04/2004 | CN1517453A Electroplating device, electroplating cup and cathode ring |
| 08/04/2004 | CN1160231C Semiconductor processing apparatus having wafer re-orientation mechanism |
| 08/03/2004 | US6769160 Sn plating layer as the outermost layer of an outer electrode; avoid the formation of whiskers |
| 08/03/2004 | CA2327810C Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components |
| 07/29/2004 | WO2004063426A1 Metal plating coating film having sliding function and article coated therewith |
| 07/29/2004 | US20040144656 Uniform thickness; reacting a nickel compound and sulfamic acid in presence of phosphoric acid |
| 07/29/2004 | DE10302107A1 Zylinderoberfläche Cylinder surface |
| 07/29/2004 | DE10296936T5 Verfahren zur Herstellung von elektroleitfähigen Teilchen A process for producing electro-conductive particles |
| 07/28/2004 | EP1441390A2 A method for forming a conductive copper structure |
| 07/28/2004 | EP1441232A2 Method for connecting electronic components |
| 07/28/2004 | EP1441157A1 Cylinder surface |
| 07/28/2004 | EP1441048A2 Plating apparatus, plating cup and cathode ring |
| 07/28/2004 | EP1441046A1 SURFACE−TREATED COPPER FOIL |
| 07/28/2004 | EP1439935A2 Electrochemical mechanical processing with advancible sweeper |
| 07/28/2004 | CN1516895A Barrier enhancement process for copper interconnects |
| 07/28/2004 | CN1516755A Plating apparatus, plasting method and method for mfg. semiconductor device |
| 07/28/2004 | CN1516243A Crystalline grain in metal film growth control method |
| 07/28/2004 | CN1515704A Strip processing device |
| 07/28/2004 | CN1159756C Lead wire frame and its producing method |
| 07/27/2004 | US6768194 Electrode for electroplating planar structures |
| 07/27/2004 | US6767817 Asymmetric plating |
| 07/27/2004 | US6767589 Method for metal coating a flywheel rim |
| 07/27/2004 | US6767437 Electroplating apparatus and electroplating method |
| 07/27/2004 | US6766811 Method of removing smear from via holes |
| 07/22/2004 | WO2003044248A9 Device for electrolytic treatment and hardening of the surface of the heat exchange tubes of steam generators of nuclear power plants |
| 07/22/2004 | US20040141299 Burrless castellation via process and product for plastic chip carrier |
| 07/22/2004 | US20040140287 Edge and bevel cleaning process and system |
| 07/22/2004 | US20040140217 Noble metal contacts for plating applications |
| 07/22/2004 | US20040140203 Liquid isolation of contact rings |
| 07/22/2004 | US20040140199 Plating apparatus, plating cup and cathode ring |
| 07/22/2004 | US20040140192 Solenoid switch and plating method thereof |
| 07/22/2004 | DE10241619B4 Vorrichtung und Verfahren zum elektrolytischen Behandeln von zumindest oberflächlich elektrisch leitfähigem Behandlungsgut Method and apparatus for electrolytic treatment of at least superficially electrically conductive material to be treated |
| 07/21/2004 | EP1439397A2 Method of performing a burn-in |
| 07/21/2004 | EP1439018A1 Process for chrome plating a vehicle wheel surface |
| 07/21/2004 | EP1438446A2 System and method for electrolytic plating |
| 07/21/2004 | CN1158411C Electroplating device for circuit board |
| 07/20/2004 | US6764953 Electronic device, and method of patterning a first layer |
| 07/20/2004 | US6764585 Electronic device manufacturing method |
| 07/20/2004 | CA2315177C Component of printed circuit boards |
| 07/15/2004 | WO2004059041A1 Electrodeposition of biaxial textured films |
| 07/15/2004 | US20040134793 for plating conductive material on semiconductor substrate by rotating pad/blade/anode; eliminates dishing and voids; for production of integrated circuits |
| 07/15/2004 | US20040134790 Endoprothesis with galvanised silver layer |
| 07/15/2004 | US20040134787 Method and apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing |
| 07/15/2004 | US20040134775 Electrochemical processing cell |
| 07/15/2004 | US20040134774 Processing apparatus including a reactor for electrochemically etching microelectronic workpiece |
| 07/15/2004 | US20040134773 Method and apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing |
| 07/15/2004 | DE19512196B4 Kupferfolien für Basismaterial von gedruckten Schaltungen sowie Verfahren zur Oberflächenbehandlung der Kupferfolien Copper foil for the base material of printed circuits as well as method for surface treatment of the copper foils |
| 07/14/2004 | EP1437787A2 Process of manufacturing a membrane-electrode unit |
| 07/14/2004 | CN1511977A Electroplating cup with adjustable spacing between cathode, anode and uniform stream plate in wafer level package |
| 07/14/2004 | CN1157503C Method for producing very small metal ball |
| 07/13/2004 | US6761814 Superior filling properties and superior planarization of the deposited metal layer is provided. this is achieved by a method having a f/r ratio, the ratio of the electric current densities between the forward electrolysis and the reverse |
| 07/13/2004 | US6761812 Supplying electrical current to workpiece through contact portions contacting workpiece at different locations, measuring magnetic field of each portion to determine magnitude of current, individually adjusting current |
| 07/13/2004 | US6761806 Processing apparatus with sensory subsystem for detecting the presence/absence of wafers or other workpieces |
| 07/08/2004 | WO2004057061A1 Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit |
| 07/08/2004 | WO2004057060A2 Multi-chemistry electrochemical processing system |
| 07/08/2004 | WO2004007811A3 Device and method for monitoring an electrolytic process |
| 07/08/2004 | WO2004006228B1 Reflective or semi-reflective metal alloy coatings |
| 07/08/2004 | WO2004001813A3 Substrate holder and plating apparatus |
| 07/08/2004 | WO2002004712A3 Flow diffuser to be used in electro-chemical plating system |
| 07/08/2004 | US20040132299 Method for depositing lead-free tin alloy |
| 07/08/2004 | US20040132285 Polymer film metalization |
| 07/08/2004 | US20040131766 Substrate processing method and apparatus |
| 07/08/2004 | US20040129576 improves the flatness of a plated film on a substrate even when fine grooves and large grooves are co-present in the surface of the substrate, enabling a later CMP processing to be carried out in a short time while preventing dishing |
| 07/08/2004 | US20040129575 rotating substrate holding member to remove plating liquid; and sucking liquid remaining on the substrate-contacting portion or in its vicinity, while the holding member is rotated |
| 07/08/2004 | US20040129573 cells of the mask comprise independently controllable electrodes; pattern of dielectric material extends beyond the electrodes for contacting the substrate and for forming electrochemical process pockets when contacted ; deposition selectivity |
| 07/08/2004 | US20040129572 low-resistance; improves the RC-delay characteristic of circuit on large-area substrate and reduces the number of masks for processing of a structure of gate overlap lightly-doped drain (source) |
| 07/08/2004 | US20040129570 immersing the substrate with the electrode into a solvent containing a first metal salt and a second metal salt; applying a bias voltage, to form active particle with a dimension between 1/10 nanometer and five hundred nanometers |
| 07/08/2004 | US20040129384 Chemical treatment apparatus and chemical treatment method |
| 07/08/2004 | US20040129209 Phosphate film processing method and phospate film processing device |
| 07/08/2004 | DE10261396A1 Handling station for electroplating of band type substrate carriers, e.g. in solar cells, has a first trough-type container used for galvanizing the strip and a second container which recycles electrolyte flowing from first container |
| 07/07/2004 | EP1435193A2 Nickel coated copper as electrodes for embedded passive devices |
| 07/07/2004 | CN1510980A Film carrying belt for mounting electronic components, production and electrolyzing apparatus |
| 07/07/2004 | CN1510174A Method for depositing non-lead tin alloy |
| 07/07/2004 | CN1156613C Process of controlling grain growth in metal films |
| 07/06/2004 | US6758984 Selective removal of dielectric materials and plating process using same |
| 07/06/2004 | US6758920 Copper, silver alloy |
| 07/06/2004 | US6758387 Electroplating difficult to solder material with easier to solder one; hot dipping; applying ultrasonic waves; adhesion to plated portions |
| 07/01/2004 | WO2004055247A1 Electro-plating apparatus and method |
| 07/01/2004 | US20040126548 ULSI wiring and method of manufacturing the same |
| 07/01/2004 | US20040124089 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 06/30/2004 | EP1433544A1 A method for manufacturing a multiple walled tube |
| 06/30/2004 | EP1432851A1 Method for the coating of electrically conducting support materials |
| 06/30/2004 | EP1278899B1 Method and device for the electrolytic coating of a metal strip |
| 06/30/2004 | CN1509351A Copper electroplating method, phosphorus-copper anode for copper electroplating, and semiconductor wafer with minimal particle adhesion plated by using them |
| 06/30/2004 | CN1509348A Workpiece wet processing |
| 06/30/2004 | CN1508296A Electroplating device and method thereof |
| 06/30/2004 | CN1508285A Metal-film formation processing method, semiconductor device and wiring substrate board |
| 06/29/2004 | US6755958 For a copper alloy surface; electroplated barrier layer consisting of cobalt, cobalt-nickel alloys, cobalt-tungsten alloys, cobalt-nickel-tungsten alloys, or rhodium. |
| 06/29/2004 | US6755957 Forming copper film on insulation layer; immersion in solution of plating promoter; removing promoter from copper film leaving it on side walls and bottoms of via holes; electroplating to fill holes; improvement over planarization |
| 06/29/2004 | US6755956 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires |
| 06/29/2004 | US6755955 Immersing a planar substrate in an electrolyte that contains the catalytically active metallic; applying an electrical voltage; depositing a layer of catalytically active metallic material by electrochemical deposition on the planar substrate |
| 06/29/2004 | US6755954 Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements |
| 06/29/2004 | US6755946 Clamshell apparatus with dynamic uniformity control |
| 06/24/2004 | WO2004053455A2 Plating bath composition control |