| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 09/15/2004 | CN1529769A Anode Assembly depositing planar metal through enhancing electrolyte mixing and process for supplying electrolyte |
| 09/15/2004 | CN1529642A Continuous casting roll for casting molten baths and method for producing same |
| 09/14/2004 | US6790776 Barrier layer for electroplating processes |
| 09/14/2004 | US6790763 Substrate processing method |
| 09/14/2004 | US6790377 Method for electrochemical fabrication |
| 09/14/2004 | US6790336 Providing strength to the low k dielectric layer by using a sacrificial conductive metal layer over it during the chemical mechanical polishing and planarization of the above barrier and copper layers; semiconductors; integrated circuits |
| 09/14/2004 | US6790333 Applying functional alloy plating to an electronic component to be mounted using an electrolytic procedure with a pulse waveform, functional alloy plating comprising tin and silver |
| 09/14/2004 | US6790332 Ia/ic ratio is 1-1.5, and wherein a charge ratio qa/qc=taia/tcic of charge qa, transported during an anode pulse of duration ta, to a charge qc, transported during a cathode pulse of duration tc, is 30-45. |
| 09/14/2004 | US6790295 Carburizing slide surfaces of iron or steel, plating with chromium, and impulsing by shot peening for lubricant retaining cavities; wear resistance |
| 09/14/2004 | CA2352929C Method of forming chromium coated copper for printed circuit boards |
| 09/14/2004 | CA2322363C Method of forming chromium coated copper for printed circuit boards |
| 09/14/2004 | CA2225825C Roll forming structural steel profiles with galvanised coating |
| 09/10/2004 | WO2004076724A1 SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY, HEAT SINK USING THE SAME, AND METHOD FOR PRODUCING SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY |
| 09/09/2004 | US20040175582 Coated foil resists laser ablation, thereby resisting piercing of the foil by the laser during drilling; adhesion of the copper foil layer to the dielectric substrate |
| 09/09/2004 | US20040173461 Method and apparatus for local polishing control |
| 09/09/2004 | US20040173454 Apparatus and method for electro chemical plating using backsid electrical contacte |
| 09/09/2004 | US20040173375 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 09/08/2004 | EP1455005A2 Copper foil for high frequency circuit and method of producing of same |
| 09/08/2004 | EP1363707A4 Narrow diameter needle having reduced inner diameter tip |
| 09/08/2004 | CN1526856A Continuous nickel plating process for stainless steel wire |
| 09/08/2004 | CN1526855A Continuous fine metal wire nickel plating apparatus |
| 09/07/2004 | US6787248 Structure on a bi-color rust-proof barrier layer of a tool head |
| 09/07/2004 | US6787087 Method of fabricating a PVC ornamental article having effects of imitated materials |
| 09/02/2004 | WO2004075266A2 Method for immersing a substrate |
| 09/02/2004 | WO2004074554A1 Device and method for producing armoured layers on the cylinder bearing surfaces of internal combustion engines or similar |
| 09/02/2004 | WO2004073890A1 Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards |
| 09/02/2004 | US20040171277 Method of forming a conductive metal line over a semiconductor wafer |
| 09/02/2004 | US20040171269 Substrate processing method |
| 09/02/2004 | US20040170858 Process for producing high temperature heat resisting carrier foil clad electrolytic copper foil and high temperature heat resisting carrier foil clad electrolytic copper foil obtained by the process |
| 09/02/2004 | US20040170769 Tool and process for chrome plating a vehicle wheel surface |
| 09/02/2004 | US20040169959 Structure and plating method of thin film magnetic head and magnetic storage apparatus |
| 09/02/2004 | US20040168928 Using a metal compound; polymerization inhibitor ,promoter and electrolyte; heating, controlling temperature |
| 09/02/2004 | US20040168926 Electrodeposition; supplying solution; rotating wafers |
| 09/01/2004 | EP1452628A1 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion |
| 09/01/2004 | EP1452107A1 Coin made from a CuAlZnSn alloy for a mirror polish stamping and process of manufacturing the same |
| 09/01/2004 | EP1451392A2 Pretreatment process for coating of aluminium materials |
| 09/01/2004 | CN1525544A Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 09/01/2004 | CN1164800C Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 08/31/2004 | US6784104 Method for improved cu electroplating in integrated circuit fabrication |
| 08/31/2004 | US6783654 Using wiring board as one pole and insoluble electrode as other; applying forward/reverse current; copper plating solution includes iron ions; filling microvia holes in board with metal plating |
| 08/26/2004 | WO2004072331A2 Apparatus and method for highly controlled electrodeposition |
| 08/26/2004 | US20040166789 Method of sealing wafer backside for full-face processing |
| 08/26/2004 | US20040163963 Filter divides internal housing volume; fluid flow to second chamber is higher speed than to first chamber; flows are blended in second chamber; rotates at controlled speed |
| 08/26/2004 | US20040163950 Planar plating apparatus |
| 08/26/2004 | US20040163948 Plating apparatus and method of managing plating liquid composition |
| 08/26/2004 | US20040163947 Substrate plating apparatus |
| 08/26/2004 | US20040163252 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 08/26/2004 | DE10235020B4 Vorrichtung und Verfahren zum Ätzen großflächiger Halbleiterscheiben Apparatus and method for etching large-surface semiconductor wafers |
| 08/25/2004 | CN1524292A Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
| 08/25/2004 | CN1524136A Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
| 08/25/2004 | CN1523951A Chip-on-film use copper foil |
| 08/24/2004 | US6780303 Continuous nickel plating process for an aluminum conductor and corresponding device |
| 08/24/2004 | US6780302 Process for electrochemical treatment of a continuous web |
| 08/19/2004 | WO2004070087A1 Composite copper foil, method for production thereof and high frequency transmission circuit using said composite copper foil |
| 08/19/2004 | US20040161928 Method of manufacturing semiconductor device having damascene interconnection |
| 08/19/2004 | US20040161627 a copper foil having a high etching factor, enabling formation of fine patterns excellent in linearity of bottom lines of circuit patterns and without leaving particles of copper foil forming the circuit patterns |
| 08/19/2004 | US20040159553 Semiconductor manufacturing apparatus and method for manufacturing semiconductor devices |
| 08/19/2004 | US20040159552 coating the surface of a single crystal or directionally solidified article, especially on local areas of a gas turbine component; uniformity; good oxidation and fatigue resistance; may be used as a repair process |
| 08/19/2004 | US20040159542 Galvanizing device |
| 08/18/2004 | EP1448036A1 Copper foil for fine pattern printed circuits and method of production same |
| 08/18/2004 | EP1448035A1 Chip-on-film use copper foil |
| 08/18/2004 | EP1447846A2 Socket and method for connecting electronic components |
| 08/18/2004 | EP1447842A1 Bonding wire |
| 08/18/2004 | EP1446514A1 Electropolishing assembly and methods for electropolishing conductive layers |
| 08/18/2004 | CN1522464A Method and apparatus for controlling a plating process |
| 08/17/2004 | US6778406 Resilient contact structures for interconnecting electronic devices |
| 08/17/2004 | US6777778 Thin-film resistor and method for manufacturing the same |
| 08/17/2004 | US6776891 Plating alloy using electrolytic cells |
| 08/17/2004 | US6776885 Integrated plating and planarization apparatus having a variable-diameter counterelectrode |
| 08/12/2004 | WO2004042790A3 Method for increasing the copper to superconductor ratio in a superconductor wire |
| 08/12/2004 | US20040157080 Copper foil for fine pattern printed circuits and method of production of same |
| 08/12/2004 | US20040154930 Copper foil for high frequency circuit and method of production of same |
| 08/12/2004 | US20040154927 Internal heat spreader plating methods and devices |
| 08/12/2004 | US20040154926 Multiple chemistry electrochemical plating method |
| 08/12/2004 | US20040154917 Cup-shaped plating apparatus |
| 08/12/2004 | US20040154915 Contact plating apparatus |
| 08/12/2004 | US20040154828 Method and electrode for defining and replicating structures in conducting materials |
| 08/12/2004 | US20040154535 Modular electrochemical processing system |
| 08/12/2004 | DE10303835A1 Nordic gold alloy for mirror-finish coinage striking, used to produce collectors series, has surface coated with stamping enhancement agent |
| 08/11/2004 | EP1445351A1 Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil |
| 08/11/2004 | EP1444722A2 Method and system to provide electrical contacts for electrotreating processes |
| 08/11/2004 | EP1444386A1 Elemental silicon nanoparticle plating and method for the same |
| 08/11/2004 | EP1444385A1 Anodes for electroplating operations, and methods of forming materials over semiconductor substrates |
| 08/11/2004 | CN1161499C Anode electrode structure for mfg. metal foil |
| 08/10/2004 | US6774021 Pattern forming method and pattern forming device |
| 08/10/2004 | US6773827 Multilayer exterior electrodes |
| 08/10/2004 | US6773576 Anode assembly for plating and planarizing a conductive layer |
| 08/10/2004 | US6773572 Overcoating porous resin; plating; semiconductor |
| 08/10/2004 | US6773570 An electroplating solution, an electroetching solution, and a nonabrasive slurry dispensed on a polishing pad and in a sequence of process steps the substrate is held against the pad with a variable force; chemical mechanical polishing |
| 08/10/2004 | US6773568 Metal alloy compositions and plating methods related thereto |
| 08/10/2004 | US6773560 Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces |
| 08/10/2004 | US6773559 Processing apparatus including a reactor for electrochemically etching a microelectronic workpiece |
| 08/10/2004 | US6773247 Die used for resin-sealing and molding an electronic component |
| 08/05/2004 | WO2004065664A1 Plating device and plating method |
| 08/05/2004 | WO2004053455A3 Plating bath composition control |
| 08/05/2004 | WO2004050937A3 Method for coating piston rings for internal combustion engines |
| 08/05/2004 | WO2002029137A3 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 08/05/2004 | US20040152348 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
| 08/05/2004 | US20040149588 Electrolytic cooper plating method, phosphorus-containing anode for electrolytic cooper plating, and semiconductor wafer plated using them and having few particles adhering to it |
| 08/05/2004 | US20040149587 Oxidation inhibition; using at small excess to minimize agglomeration; stannous and/or lead(II) plating |