| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 10/21/2004 | US20040209109 heat-resistant layer with an olefin-based silane coupling agent layer on at least one side thereof; low profile with excellent adhesion to the insulating resin; used for a copper-clad laminate for higher frequency applications. |
| 10/21/2004 | US20040209106 thin films comprising metallic carriers, barriers layers, a second metallic layer selected from zinc, copper and cobalt, and/or arsenic, manganese, tin, vanadium, molybdenum, antimony or tungsten, and electrodeposited overcoating, used for printed circuits; electrical and electronic apparatus; multilayer |
| 10/21/2004 | US20040208749 Method of forming abrasion-resistant layer on rotor blade, an abrasion-resistant layer and a method of regenerating the same, and a gas turbine |
| 10/21/2004 | US20040206629 Method for the selectively electroplating a strip-shaped, metal support material |
| 10/21/2004 | US20040206628 Electrical bias during wafer exit from electrolyte bath |
| 10/21/2004 | DE10340615A1 Manufacture of biaxially textured pure metal or alloy layer useful as magnetic material involves depositing biaxially textured pure metal or alloy layer on the surface of the pure metal or alloy substrate using electroplating process |
| 10/20/2004 | CN1539030A Plating method and plating apparatus |
| 10/20/2004 | CN1539029A Copper on INVAR composite and method of making |
| 10/20/2004 | CN1537977A Surface structure of metallic body |
| 10/19/2004 | US6805915 Electroless copper plating solution, electroless copper plating process and production process of circuit board |
| 10/19/2004 | US6805786 Precious alloyed metal solder plating process |
| 10/19/2004 | US6805785 Production method of sintered-type nickel positive electrode for alkaline secondary battery |
| 10/14/2004 | US20040203235 Formation method for metal element, production method for semiconductor device, production method for electronic device, semiconductor device, electronic device, and electronic equipment |
| 10/14/2004 | US20040203221 Electronic device manufacturing method |
| 10/14/2004 | US20040202887 A bearing having improved an improved antiseizure overlay layer of bismuth or bismuth alloy of crystal structure, a Miller index (202) face of index of orientation of > 30% and a maximum X-ray diffraction intensity R(202); oil wetting; automobile crankshafts,connecting rods, internal combustion engines |
| 10/14/2004 | US20040201446 Conductive substrate with resistance layer, resistance board, and resistance circuit board |
| 10/14/2004 | US20040200727 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion |
| 10/13/2004 | EP1466679A2 Press molding die and manufacturing method of same |
| 10/13/2004 | CN1537315A Material deposition from liquefied gas solution |
| 10/13/2004 | CN1537180A Method for producing electroconductive particles |
| 10/13/2004 | CN1536948A Electro plating bath used for forming film resis tance layer, resistance layer forming method, conductive substrate material having resistance layer and circuit base plate material |
| 10/13/2004 | CN1536101A Electric plating equipment for wafer |
| 10/13/2004 | CN1171325C Battery sheath made of formed cold-rolled metal sheet and method for producing battery sheaths |
| 10/12/2004 | US6803312 Semiconductor device and method for fabricating the same |
| 10/12/2004 | US6802999 Method of fabricating protective coating for a crucible with the coating having channels formed therein |
| 10/12/2004 | US6802955 Polishing pad, platen comprising first conductive layer in contact with polishing pad for coupling to first potential, second conductive layer for coupling to second potential, insulating layer, electrical contact, electrolyte reservoir |
| 10/12/2004 | US6802950 Apparatus and method for controlling plating uniformity |
| 10/12/2004 | US6802947 Apparatus and method for electro chemical plating using backside electrical contacts |
| 10/12/2004 | US6802946 Apparatus for controlling thickness uniformity of electroplated and electroetched layers |
| 10/07/2004 | US20040198190 Method and apparatus for reduction of defects in wet processed layers |
| 10/07/2004 | US20040198081 Microelectronic spring contact elements |
| 10/07/2004 | US20040197973 Component formation via plating technology |
| 10/07/2004 | US20040196593 Magnetic material, magnetic recording medium, magnetic recording/reproducing apparatus, information processing apparatus, and method for manufacturing the magnetic material |
| 10/07/2004 | US20040195111 Performs uniform electrodeposition and electroetching |
| 10/07/2004 | US20040195105 Using pure metal or alloy as cathode; high misorientation on plane formed by a-axis and b-axis |
| 10/07/2004 | US20040194698 Plating apparatus |
| 10/07/2004 | US20040194527 Press molding die and manufacturing method of same |
| 10/06/2004 | EP1464732A1 An installation for the application of a coating to metal parts and method therefor |
| 10/06/2004 | EP1464731A1 Plating apparatus, plating method, and method for manufacturing semiconductor device |
| 10/06/2004 | EP1309740B1 Elastic contact element |
| 10/06/2004 | EP1200647B1 Method for producing improved cold rolled strip that is capable of being deep drawn or ironed, and cold rolled strip, preferably used for producing cylindrical containers and, in particular, battery containers |
| 10/06/2004 | CN1534112A Device for avoiding hole forming on electroplating deposited copper film and its use method |
| 10/06/2004 | CN1533855A Die and its mfg. method |
| 10/05/2004 | US6800187 Support that controls plating solution flow dynamics and electric field shape during electroplating; uniformity; bubble free |
| 09/30/2004 | US20040192066 Method for immersing a substrate |
| 09/30/2004 | US20040191561 Gold layer; prevent diffusion of nickel undercoatings |
| 09/30/2004 | US20040191560 Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board |
| 09/30/2004 | US20040188268 Manufacturing procedure of hand tool |
| 09/30/2004 | US20040188267 corrosion resistance protective coating; lamination rare eath magnet with nickel sulfide in plating bath |
| 09/30/2004 | US20040188261 Methods of forming medical devices |
| 09/30/2004 | US20040188257 Multilayer; three-dimensional; containing recesses; thin electroconductive seed layer; removal segments of negative photoresists; rotating in bath |
| 09/30/2004 | US20040187731 Bath contains carrier; water soluble, mercapto-containing organic brightener; and leveling agent; semiconductor connectors |
| 09/29/2004 | EP1461815A1 Material deposition from a liquefied gas solution |
| 09/29/2004 | CN1533586A Plating apparatus |
| 09/29/2004 | CN1533450A Method of producing high temperature heat resistant electrolytic copper foil with carrier foil and electrolytic copper foil obtained by the method |
| 09/29/2004 | CN1533449A Method for selectively electroplating strip-shaped metal support material |
| 09/29/2004 | CN1533448A Jet plating apparatus |
| 09/29/2004 | CN1169282C Electroplating current supply system |
| 09/29/2004 | CN1168854C System, device and method for electroplating semiconductor wafer |
| 09/29/2004 | CN1168844C Strip composite material and its producing method |
| 09/28/2004 | US6797405 Method for uniform electrochemical reduction of apertures to micron and submicron dimensions using commercial biperiodic metallic mesh arrays and devices derived therefrom |
| 09/28/2004 | US6797144 Electrolysis; using reverse current density |
| 09/28/2004 | US6797132 Apparatus for plating and polishing a semiconductor workpiece |
| 09/28/2004 | US6797079 Copper, silver alloy |
| 09/28/2004 | US6796870 Field emission type cold cathode device, manufacturing method thereof and vacuum micro device |
| 09/23/2004 | WO2004081262A1 Method of electroplating a workpiece having high-aspect ratio holes |
| 09/23/2004 | WO2004081261A2 Plating apparatus |
| 09/23/2004 | WO2004081255A1 Semiconductor device |
| 09/23/2004 | US20040184691 Lightweight bearing and wave gear drive |
| 09/23/2004 | US20040183225 Method of fabricating a pvc ornamental article having effects of imitated materials |
| 09/23/2004 | US20040182720 Measuring thickness equivalent data of a film on a wafer, making a cathode member smaller than the surface face a region, interposing an electrolytic solution between the surface and the cathode member, applying a voltage using the cathode member as a cathode and the film an anode, electrolytic polishing |
| 09/23/2004 | US20040182715 Process and apparatus for air bubble removal during electrochemical processing |
| 09/23/2004 | US20040182712 Process and system for eliminating gas bubbles during electrochemical processing |
| 09/23/2004 | DE10311575A1 Electrolytic metallizing of a workpiece with bores of high aspect ratio useful for the electrodeposition of copper, e.g. onto conductive plates |
| 09/22/2004 | EP1460150A1 Method for fabricating bismuth thin film and device using said film |
| 09/22/2004 | EP1458908A1 A tubular member having an anti-galling coating |
| 09/22/2004 | CN1530471A Apparatus and utilizing method for preventing electroplating depositing copper thin membrane generating cavity |
| 09/22/2004 | CN1530470A Tin-plating method |
| 09/22/2004 | CN1530469A High efficient copper foil and producing method thereof |
| 09/22/2004 | CN1168125C Copper deposit process |
| 09/21/2004 | US6794063 The lower/upper magnetic core contains an alloy of cobalt, nickel and/or iron; crystal grains of the thin film magnetic head having a grain size gradient, smaller in the center than at the surface; large coercive force; recording media |
| 09/21/2004 | US6793797 Alternately electrodepositing and electro- mechanically polishing to selectively fill a semiconductor feature with metal including a) providing an anode assembly and a semiconductor wafer disposed in spaced apart relation |
| 09/21/2004 | US6793795 Utilizing ferrous and/or ferric salts and dimensionally stable insoluble anodes; full surface uniform deposition; rapidly and completely filling small width and diameter recesses; avoiding gas or liquid inclusions |
| 09/21/2004 | US6793794 Using an insoluble anode and particularly a substrate plating apparatus capable of easily and automatically supplying metal ions; uniform primary current distribution between the cathode and anode; no particles produced from black film |
| 09/16/2004 | WO2004079055A1 Method for producing rare-earth permanent magnet and metal plating bath |
| 09/16/2004 | WO2004078411A2 Method and apparatus for local polishing control |
| 09/16/2004 | WO2003038158A3 Electroplating device and electroplating system for coating already conductive structures |
| 09/16/2004 | US20040180225 Peel strength enhancement of copper laminates |
| 09/16/2004 | US20040179309 magnetoresistance at room temperature; spintronics device; very fast film growth speed in the electrodepositing method, and a thickness of a Bi thin film can be controlled easily in the sputtering method |
| 09/16/2004 | US20040178060 Apparatus and method for depositing and planarizing thin films of semiconductor wafers |
| 09/16/2004 | US20040178058 Electro-chemical deposition apparatus and method of preventing cavities in an ECD copper film |
| 09/16/2004 | DE10309401A1 Coating apparatus for e.g. metallic tube, rod, has carrying disk rotated by motor, causing items to in turn rotate with respect to the threaded rod while being immersed into electrolytes contained in a reservoir |
| 09/16/2004 | DE10308731A1 Process for electroplating a hollow body on an electrically insulated, horizontally turnable, fixed support useful for electroplating hollow items, involves dipping the hollow body into an electrolyte contained in a bath |
| 09/15/2004 | EP1455981A2 Wire for high-speed electrical discharge machining |
| 09/15/2004 | EP1222321B8 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 09/15/2004 | EP1027729A4 Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces |
| 09/15/2004 | CN1529903A Plating system with remote secondary anode for semiconductor manufacturing |
| 09/15/2004 | CN1529774A Electrolytic copper plating method phosphorous cooper anode for electrolytic copper plating method said semiconductor wafer having low particle adhension plated with said method and anode |
| 09/15/2004 | CN1529772A Electrochemical co-deposition of metals for electronic device manufacture |
| 09/15/2004 | CN1529771A Composite foil and its manufacturing process |