| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 12/01/2004 | EP1264009B1 Method for applying a metal layer to a light metal surface |
| 12/01/2004 | EP1230441B1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method |
| 12/01/2004 | EP0964080B1 Electrolysis apparatus having liquid squeezer out of contact with strip |
| 12/01/2004 | CN1551931A Method and apparatus for controlling thickness uniformity of electroplated layers |
| 12/01/2004 | CN1551711A Copper foil for printed-wiring board |
| 12/01/2004 | CN1551710A Copper foil for fine pattern printed circuits and method of production of same |
| 12/01/2004 | CN1551295A Method of manufacturing electronic device |
| 12/01/2004 | CN1551247A Plated material and method of manufacturing the same, terminal member for connector, and connector |
| 12/01/2004 | CN1550577A Improved tin plating method |
| 12/01/2004 | CN1177551C Die manufacturing method and system |
| 11/30/2004 | US6824667 Metal hydride composite materials |
| 11/25/2004 | WO2004101873A1 Water-permeable drum for the hydrodynamic needling of webs of textile materials, and method for the production of said drum |
| 11/25/2004 | WO2003025255A3 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 11/25/2004 | US20040234683 forming plating layers having uniform thickness and smoothness on surfaces of resin fines selected from network structure polymers, thermosetting resins or elastic bodies, having conductive base layers using electrolytic cells having a rotatable barrel in the bath, while vibrating the barrel; alloys |
| 11/25/2004 | US20040232534 Packaging component and semiconductor package |
| 11/25/2004 | US20040232091 Blocks off a portion of flow of liquid used in a flow process (e.g., plating solution for formimg a bump electrode), by using a partition plate whose lower end is in close contact with a bottom of a plating tank and whose upper end is at a position lower than a liquid surface |
| 11/25/2004 | US20040232005 For treating electric circuit boards and other circuit carriers, particularly those that demand very thin base layers; counterelectrodes are each subdivided into at least two electrode segments: a contact-near electrode segment and a contact-remote electrode, each fed by a separate current source |
| 11/25/2004 | US20040231998 Two-step process involving immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst; produces a a seam-free and void-free metal microelectronic conductor. |
| 11/25/2004 | US20040231996 Rotating the integrated circuit wafer during electrodeposition, by immersing in an electrolytic solution, prevent defects in plated copper films |
| 11/25/2004 | US20040231995 Contains a pyridinium, bipyridinium, phenanthrolinium, quinolinium or phenazinium salt in the form of onium with an N-alkyl, N-aralkyl, N-aryl, N-alkylene or N-aralkylene moiety; each via-hole is filled totally with the conductive material |
| 11/25/2004 | US20040231994 Includes an anode, a mask with openings supported between the anode and the wafer surface defining active regions by which a rate of conductive material deposition onto the surface can be varied, a conductive mesh below the upper mask surface, and an electrolyte |
| 11/25/2004 | DE10107675B4 Endoprothese und Verfahren zu ihrer Herstellung Endoprosthesis and processes for their preparation |
| 11/24/2004 | EP1480270A2 Packaging component and semiconductor package |
| 11/24/2004 | EP1479793A2 Plating method |
| 11/24/2004 | CN1550033A Substrate holder and plating apparatus |
| 11/24/2004 | CN1549876A Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion |
| 11/23/2004 | US6821409 Electroetching methods and systems using chemical and mechanical influence |
| 11/18/2004 | WO2004100185A1 Method of coating electric wire and insulated wire |
| 11/18/2004 | WO2004099460A2 Method for producing galvanically enhanced moulded elements optionally lighted by transparency,made of thermoplastic,thermosetting plastic,elastomer or silicone, as well as moulded elements optionally lighted by transparency made of thermoplastic,thermosetting plastic,elastomer or silicone with galvanically enhanced surface |
| 11/18/2004 | WO2003010364A3 Dynamic pulse plating for high aspect ratio features |
| 11/18/2004 | US20040229077 Plated material and method of manufacturing the same, terminal member for connector, and connector |
| 11/18/2004 | US20040229076 cleaning fine lead wire, cutting fine wire to a pre-specified length, electroplating zinc or zinc alloy to fine wire, placing electroplated wire in a die of a pre-specified shape and size;compressing wire into a solid preselected shape/size |
| 11/18/2004 | US20040229070 Copper foil for printed-wiring board |
| 11/18/2004 | US20040226827 Method of manufacturing electronic device |
| 11/18/2004 | US20040226826 Electrolytic cells; immersion bath; wire mesh screen; variations in pattern density on substrate surface |
| 11/18/2004 | US20040226825 electrodeposition of nickel; controlling thickness, flexibility, hardness; drum with apertures filled with dielectric resin |
| 11/18/2004 | US20040226816 Plating processing device |
| 11/18/2004 | US20040226510 Semiconductor processing apparatus having lift and tilt mechanism |
| 11/18/2004 | US20040226402 Cylinders having differing surface roughness |
| 11/17/2004 | EP1477587A2 Improved tin plating method |
| 11/17/2004 | EP1477586A2 A movable joint and method for coating movable joints |
| 11/17/2004 | CN1547763A Dummy structures to reduce metal recess in electropolishing process |
| 11/16/2004 | US6818840 Method for manufacturing raised electrical contact pattern of controlled geometry |
| 11/16/2004 | US6818115 For circuit boards; provides improved flow of electrolyte through holes of printed circuit boards, which generates improved throwing power of plating inside through holes and blind vias |
| 11/12/2004 | CA2467033A1 A movable joint and method for coating movable joints |
| 11/11/2004 | WO2004097929A2 Method and apparatus for reduction of defects in wet processed layers |
| 11/11/2004 | WO2004075266A3 Method for immersing a substrate |
| 11/11/2004 | US20040222100 Process and system for providing electrochemical processing solution with reduced oxygen and gas content |
| 11/11/2004 | US20040222086 Electroplating reactor including back-side electrical contact apparatus |
| 11/11/2004 | DE102004015827A1 Gleitteil Slide |
| 11/10/2004 | EP1475463A2 Reverse pulse plating composition and method |
| 11/10/2004 | EP1222321B9 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 11/10/2004 | EP1153430B1 Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits |
| 11/10/2004 | CN1545570A Surface-treated copper foil |
| 11/10/2004 | CN1174857C Electrolytic copper foil with carrier foil and copper-clad laminate using electrolytic copper foil |
| 11/09/2004 | US6815709 Structure having flush circuitry features and method of making |
| 11/09/2004 | US6815357 Process and apparatus for manufacturing a semiconductor device |
| 11/09/2004 | US6815126 Printed wiring board with conformally plated circuit traces |
| 11/09/2004 | US6815089 Steel or steel alloys and having outer electroplated layer of nickel or nickel alloys |
| 11/04/2004 | WO2004094703A2 Methods of forming medical devices |
| 11/04/2004 | WO2004094702A2 Multi-chemistry plating system |
| 11/04/2004 | WO2004094701A2 Method and apparatus for monitoring, dosing, and distribution of chemical compositions |
| 11/04/2004 | US20040219771 Pattern forming method and pattern forming device |
| 11/04/2004 | US20040219376 Biasing a conductive material to surface of heat resistant resin film; applying electrolytic plating |
| 11/04/2004 | US20040217088 Selective removal of dielectric materials and plating process using same |
| 11/04/2004 | US20040217009 Copper filled submicron apertures free of pits and voids; ion source, electrolyte and polyalkylene oxide random copolymers; printed wiring boards, integrated circuits |
| 11/04/2004 | US20040217007 High quality metal or alloy thin film deposition on magnetic head; dissolving hydrogen in solution; low cost impurity reduction |
| 11/04/2004 | US20040217005 Method for electroplating bath chemistry control |
| 11/04/2004 | DE10326253B3 Metal-glass fastening equipment lead-through for airbag or seat belt tension triggers has metal pins in a through-opening and a main body with front and rear sides and a release action |
| 11/03/2004 | EP1472035A1 Method and device for obtaining a determined flow resistance of a flow channel |
| 11/03/2004 | EP1169162B1 Method and apparatus for plating and polishing a semiconductor substrate |
| 11/03/2004 | CN1543292A Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil |
| 11/03/2004 | CN1542168A Method for electroplating a cylindrical inside surface of a work-piece-extending substantially over a semi-circle |
| 11/03/2004 | CN1174481C Method for making burrless castellation via hole for plastic chip carrier and product |
| 11/02/2004 | US6812723 Probe pin for a probe card |
| 11/02/2004 | US6811675 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 11/02/2004 | US6811674 Palladium plating solution |
| 11/02/2004 | US6811672 Method for forming plating film and electronic component having plating film formed theron by same method |
| 11/02/2004 | US6811670 Method for forming cathode contact areas for an electroplating process |
| 11/02/2004 | US6811669 Methods and apparatus for improved current density and feature fill control in ECD reactors |
| 11/02/2004 | US6811661 Cathode cartridge of testing device for electroplating and testing device for electroplating |
| 10/28/2004 | WO2004092452A1 Two-layer flexible copper-clad laminate and method for manufacturing the two-layer flexible copper-clad laminate |
| 10/28/2004 | WO2004072331A3 Apparatus and method for highly controlled electrodeposition |
| 10/28/2004 | WO2002001610A3 Apparatus and method for electro chemical deposition |
| 10/28/2004 | US20040211673 Electroplating a copper thin film on the copper seed layer by using an aqueous solution of 10 to 40 wt % of copper hexafluorosilicate as an electrolyte for forming a semiconductor integrated circuit having a copper seed layer |
| 10/28/2004 | US20040211664 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 10/28/2004 | US20040211662 Method and apparatus for the electrochemical deposition and removal of a material on a workpiece surface |
| 10/28/2004 | DE10342512B3 Device for the electrolytic treatment of electrically conducting structures on strip-like material used in chip cards, price signs or ID cards comprises an arrangement consisting of contact electrodes and an electrolysis region |
| 10/27/2004 | EP1470571A2 Electroless deposition apparatus and method |
| 10/27/2004 | EP1470268A2 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 10/27/2004 | CN1540040A Reverse pulse electroplating composition and method thereof |
| 10/27/2004 | CN1540039A Nickel base alloy composite conductor roll and manufacturing method |
| 10/27/2004 | CN1173078C Process and special apparatus for electrogalvenizing inner and outer walls of steel pipe |
| 10/26/2004 | US6809029 Semiconductor production device and production method for semiconductor device |
| 10/26/2004 | US6808617 Measuring thickness equivalent data of a film on wafer, making cathode member smaller than surface face region thereof, interposing electrolytic solution between surface and cathode member, applying voltage, electrolytic polishing |
| 10/26/2004 | US6808612 Positioning electroconductive substrate in a chamber containing electrochemical bath, applying a plating bias to the substrate while immersing into bath, and depositing third conductive material in situ to fill; pulsation |
| 10/21/2004 | WO2004090199A1 Electrochemical particle coating method and devices therefrom |
| 10/21/2004 | WO2004042790A8 Method for increasing the copper to superconductor ratio in a superconductor wire |
| 10/21/2004 | US20040209779 Method for increasing the copper to superconductor ratio in a superconductor wire |
| 10/21/2004 | US20040209464 Plating method and plating apparatus |