Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
01/2005
01/12/2005EP1495162A1 Web processing method and apparatus
01/12/2005EP1495161A2 Electropolishing and electroplating methods
01/12/2005CN1565149A Nickel coated copper as electrodes for embedded passive devices
01/12/2005CN1565047A Method of manufacturing semiconductor device
01/12/2005CN1184349C Formation of metal interconnection structure
01/11/2005US6841189 Forming a plating base on the surfaces and introducing a modifying agent to the recess and which absorbs into the surface regions not covered by the plating base
01/11/2005US6841056 Reduce concentration of oxygen, sulfur dioxide; forming integrated circuits
01/06/2005WO2005001896A2 Wet chemical processing chambers for processing microfeature workpieces
01/06/2005WO2004031454A3 Cathode design for use in electrodeposition cell
01/06/2005WO2002050336A3 Integrated mutli-step gap fill and all feature planarization for conductive materials
01/06/2005US20050003654 Method of producing semiconductor device
01/06/2005US20050000821 Anodes for electroplating operations, and methods of forming materials over semiconductor substrates
01/06/2005US20050000820 Apparatus and method for processing a substrate
01/06/2005US20050000818 Overcoating substrate with noble metal; reducing stresses by applying with low current, then high current
01/06/2005US20050000814 Applying ultrasonic frequency to plating bath; immersed, rotating cylinder; uniform plating
01/06/2005US20050000600 Ultra high saturation moment soft magnetic thin film
01/05/2005EP1493847A2 Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product
01/05/2005EP1492907A1 Electropolishing and/or electroplating apparatus and methods
01/05/2005CN1561409A Segmented counterelectrode for an electrolytic treatment system
01/05/2005CN1561280A Method and apparatus for avoiding particle accumulation in electrodeposition
01/05/2005CN1183814C Copper foil with good chemicals-resisting and heat-resisting characteristicas for printed circuit board
01/05/2005CN1182939C Method and apparatus for deposition on and polishing of semiconductor surface
01/04/2005US6838893 Probe card assembly
01/04/2005US6837980 Bond enhancement antitarnish coatings
01/04/2005US6837979 Plating conductive layer by applying a plating solution using an anode having a pad attached, when anode and substrate are energized with electric power; altering texture of top portion of conductive layer when pad makes contact with top portion
01/04/2005US6837978 Actuator is connected to the holder and adjustably positions the substrate relative to the electrolyte cell;
01/04/2005US6837973 Apparatus for electrically coating a hot-rolled steel substrate
12/2004
12/30/2004US20040267351 Positioning a design on gig to form stent, immersion in liqud baths with electrolytes, electropolishing or electrodepositing
12/30/2004US20040266193 Means to improve center-to edge uniformity of electrochemical mechanical processing of workpiece surface
12/30/2004US20040266085 Integrated multi-step gap fill and all feature planarization for conductive materials
12/30/2004US20040265618 Sliding member
12/30/2004US20040265592 Field emission type cold cathode device, manufacturing method thereof and vacuum micro device
12/30/2004US20040264820 Sliding member
12/30/2004US20040264105 Component formation via plating technology
12/30/2004US20040262165 Plating method
12/30/2004US20040262164 Method and apparatus for managing plating interruptions
12/30/2004US20040262150 Plating device
12/29/2004WO2004097929A3 Method and apparatus for reduction of defects in wet processed layers
12/29/2004WO2002022915A3 Removable modular cell for electro-chemical plating
12/29/2004EP1491656A1 Electroless deposition catalyst and menthod
12/29/2004CN1559081A Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
12/29/2004CN1558967A Electrode attachment to anode assembly
12/29/2004CN1558964A Foreign matter removing mechanism, fluid flow processing equipment, and foreign matter removing method
12/29/2004CN1182766C Electro-deposition copper foil through surface-processing, its mfg. method and use thereof
12/29/2004CN1182571C High-pressure electrochemical method for depositing nano Cu granule film on semiconductor Si substrate
12/29/2004CN1182278C Method for producing soluble copper in the production of electrolytic copper foil
12/28/2004US6835898 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
12/28/2004US6835442 Flexible printed wiring board
12/23/2004WO2004111312A2 Contact surfaces for electrical contacts and method for producing the same
12/23/2004WO2004110698A2 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes
12/23/2004WO2001071780A3 Apparatus and method for electrochemically processing a microelectronic workpiece
12/23/2004US20040258363 Optical fixed attenuator and manufactuing process thereof
12/23/2004US20040256240 System and process to control electroplating a metal onto a substrate
12/23/2004US20040256239 Tin plating method
12/23/2004US20040256222 Apparatus and method for highly controlled electrodeposition
12/22/2004EP1489203A1 ELECTROLYTIC COPPER PLATING METHOD, PHOSPHORUS−CONTAINING ANODE FOR ELECTROLYTIC COPPER PLATING, AND SEMICONDUCTOR WAFER PLATED USING THEM AND HAVING FEW PARTICLES ADHERING TO IT
12/22/2004EP1488025A1 Conveyorized plating line and method for electrolytically metal plating a workpiece
12/22/2004EP1487599A1 Metal hydride composite materials
12/22/2004CN1181229C Electrochemical processing device and method for transferring current to printed circuitboard material
12/21/2004US6833198 Copper clad laminate
12/16/2004WO2004108346A1 Process for forming a porous drug delivery layer
12/16/2004WO2004081262A8 Method of electroplating a workpiece having high-aspect ratio holes
12/16/2004US20040253810 Dummy structures to reduce metal recess in electropolishing process
12/16/2004US20040253802 Method of plating electrode formation
12/16/2004US20040250981 Continuous casting roll for casting molten baths and method for producing one such continuous casting roll
12/15/2004EP1485523A1 Metal strip for epitaxial coating and method for production thereof
12/15/2004EP1092338B1 Assembly of an electronic component with spring packaging
12/15/2004CN1555428A Method and electrode for defining and replicating structures in conducting materials
12/15/2004CN1180133C Electrodeposition of metals in smal recesses using modulated electric fields
12/14/2004US6831002 Manufacturing method of semiconductor device
12/14/2004US6830827 Alloy coating, method for forming the same, and member for high temperature apparatuses
12/14/2004US6830673 Anode assembly and method of reducing sludge formation during electroplating
12/14/2004US6830667 Cathode cartridge and anode cartridge of testing device for electroplating
12/14/2004US6830666 Device for supporting semiconductor in electroplating solution; electrical circuit, including electrode, for applying electrical potential across solution; control device to change distance between electrode and semiconductor
12/14/2004CA2156644C Method and apparatus for continuous galvanic or chemical application of metallic layers on a body
12/09/2004WO2004107422A2 Plating apparatus and plating method
12/09/2004US20040247865 Using acidic electrolytic bath; containing mixture of thiourea and amino acid
12/09/2004US20040246603 Method for achieving a mirror surface and mirror with such a mirror surface
12/09/2004US20040245112 Apparatus and method for plating a substrate
12/09/2004US20040245109 Film carrier tape for mounting electronic devices thereon, production method thereof and plating apparatus
12/09/2004US20040245107 Method for improving electroplating in sub-0.1um interconnects by adjusting immersion conditions
12/08/2004EP1222323A4 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
12/08/2004CN1554113A Planar metal electroprocessing
12/08/2004CN1552951A Technology for electrolyzing and manufacturing micro-gap counter-assembled welding projects
12/08/2004CN1179611C Composite foil of aluminium and copper
12/07/2004US6828225 Substrate processing method
12/07/2004US6827835 Method for electroplated metal annealing process
12/07/2004CA2157587C Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture
12/02/2004WO2004104430A1 Coated fastener systems and methods of preventing adhesion of a second coating to a portion of a fastener system
12/02/2004WO2004052547A3 Coated and magnetic particles and applications thereof
12/02/2004US20040241489 Sliding member
12/02/2004US20040238952 Asymmetric plating
12/02/2004US20040238481 Rotating wafer chuck with sufficient speed that electrolyte fluid flows towards edge; eliminates unwanted metal removal and overpolishing
12/02/2004US20040238078 Heat treatment method for a cold-rolled strip with an ni and/or co surface coating, sheet metal producible by said method and battery can producible by said method
12/02/2004US20040237896 Plating apparatus
12/02/2004US20040237282 Process for forming a porous drug delivery layer
12/02/2004DE10322052A1 Wasserdurchlässige Trommel für die hydrodynamische Vernadelung von textilen Warenbahnen und Verfahren zur Herstellung der Trommel The water permeable drum for the hydrodynamic needling of textile webs and methods for making the drum
12/02/2004DE10320237A1 Verfahren zur Herstellung durchleuchtbarer, galvanisch veredelter Thermoplastteile und durchleuchtbare Thermoplastteile mit galvanisch veredelter Oberfläche Process for the preparation radiotranslucent, galvanically refined thermoplastic parts and transilluminable thermoplastic parts with galvanically finished surface
12/01/2004EP1481114A2 Apparatus and methods for electrochemical processing of microelectronic workpieces
12/01/2004EP1480784A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
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