| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 02/17/2005 | US20050034976 Method and apparatus for plating and polishing semiconductor substrate |
| 02/16/2005 | CN1582346A Anodes for electroplating operations, and methods of forming materials over semiconductor substrates |
| 02/16/2005 | CN1579340A Electrically conducting material |
| 02/15/2005 | US6855239 When current flows through an inductive element, an electromagnetic field induces an electromotive force to generate a surface current and when in presence of an electrolyte, the surface of the substrate is plated |
| 02/15/2005 | US6855235 Anode impedance control through electrolyte flow control |
| 02/15/2005 | US6855103 Radioactive implantable devices and methods and apparatuses for their production and use |
| 02/15/2005 | US6855037 Method of sealing wafer backside for full-face electrochemical plating |
| 02/15/2005 | US6854473 Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station |
| 02/10/2005 | WO2002084714A3 Method and apparatus for electrochemically depositing a material onto a workpiece surface |
| 02/10/2005 | US20050032387 Asymmetric plating |
| 02/10/2005 | US20050032377 Movable optical element assembly with highly reflective surface |
| 02/10/2005 | US20050031784 Barrier layer for electroplating processes |
| 02/10/2005 | US20050029669 Semiconductor device and method for manufacturing the same |
| 02/10/2005 | US20050029497 For the preparation of dental moldings by electrodeposition; an electroconductive material such as silver flakes and a dental spacer or die spacer; may include component that changes color when the electroconducting material is dried so uniform mixing can be determined |
| 02/10/2005 | US20050029106 Electrode wetted by processing solution; applying power sources |
| 02/10/2005 | US20050028363 Contact structures and methods for making same |
| 02/10/2005 | DE10333068A1 Device including sealing rings, a screw cap, an elastic element, a siphon, and O-rings useful for electroplating conductive and metallized nonconductive plates |
| 02/10/2005 | DE10326788A1 Kontaktoberflächen für elektrische Kontakte und Verfahren zur Herstellung Contact surfaces for electrical contacts and processes for preparing |
| 02/09/2005 | EP1505178A2 Electrically conductive material |
| 02/09/2005 | CN1578597A Wiring substrate, apparatus for producing wiring substrate and method for producing the same |
| 02/09/2005 | CN1576400A Electroplating apparatus and method for electronic parts, and the same electronic parts |
| 02/09/2005 | CN1576399A Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
| 02/09/2005 | CN1188907C Electroplating appts. |
| 02/09/2005 | CN1188551C Technology for producing improved cold rolled strip capable of deep drawn or stretched ,and cold rolled strip, preferably used for producing cylindrical containers and, in particular, battey |
| 02/09/2005 | CN1188088C Method for producing prosthetic moulded parts for dental use |
| 02/08/2005 | US6852625 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 02/08/2005 | US6852445 Battery sheath made of a formed cold-rolled sheet and method for producing battery sheaths |
| 02/08/2005 | US6852209 Insoluble electrode for electrochemical operations on substrates |
| 02/08/2005 | US6852208 Method and apparatus for full surface electrotreating of a wafer |
| 02/08/2005 | US6852207 Using galvanic deposition by pulse-plating, characterized in that gold or a gold alloy is deposited from a gold sulphite bath at a pulse current density of between 0.2 A/dm2 and 50 A/dm2 |
| 02/07/2005 | CA2476374A1 Electrically conducting material |
| 02/03/2005 | WO2005010241A1 Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conductive mesh for front panel of plasma display |
| 02/03/2005 | WO2003028048A3 Low-force electrochemical mechanical processing method and apparatus |
| 02/03/2005 | WO2002020876A3 Segmenting of processing system into wet and dry areas |
| 02/03/2005 | US20050026788 High strength composite; biaxial texture; intermetallic formed by diffusion; support strip for superconductots |
| 02/03/2005 | US20050025960 Catalyst composition and deposition method |
| 02/03/2005 | US20050023149 Uses an insoluble anode and which can perform plating of a substrate stably while preventing oxygen gas, generated due to the use of the insoluble anode, from causing defects in the substrate |
| 02/03/2005 | DE10357174B3 Continuous deposition of adherent coatings on e.g. smooth copper foil comprises passing foil through bath containing copper ions and applying double pulses consisting of short, steep pulse followed by longer, flatter pulse |
| 02/02/2005 | CN1575512A 键合线 Bonding wire |
| 02/02/2005 | CN1575106A Printed circuit boards and the methods of their production |
| 02/02/2005 | CN1575099A Method for forming sheet metal |
| 02/02/2005 | CN1574319A Circuit device and method of manufacturing the same |
| 02/02/2005 | CN1574300A 封装组件和半导体封装 Package assembly and semiconductor packaging |
| 02/02/2005 | CN1574254A Method of plating electrode formation |
| 02/02/2005 | CN1572915A Cartridge plating device and design method |
| 02/02/2005 | CN1572911A Apparatus and method for plating a substrate |
| 02/02/2005 | CN1572903A Catalyst composition and deposition method |
| 02/02/2005 | CN1187763C Rare earth metal base permanent magnet and its producing process |
| 02/02/2005 | CN1187481C Electrolyzing apparatus |
| 02/02/2005 | CN1187480C Method and apparatus for producing hot-rolled steel belt with electrolytic coating |
| 02/02/2005 | CN1187479C Electroplating device and process for electroplating parts using said device and annular adhesive magnet |
| 02/02/2005 | CN1187247C Web conveying apparatus, and apparatus and method for electroplating using web conveying apparatus |
| 02/02/2005 | CN1187244C Surface treatment device |
| 02/01/2005 | US6849865 Chemical processor |
| 02/01/2005 | US6849294 Overcoating dielectric with polymer; then metal; eching; overcoating with gold |
| 02/01/2005 | US6849173 Forming copper seed layer over the sidewalls of opening in patterned dielectric layer; electrochemically removing any copper oxide; electrochemically plating a bulk copper layer over the oxide-free seed layer |
| 02/01/2005 | US6849167 Electroplating reactor including back-side electrical contact apparatus |
| 02/01/2005 | US6848955 Method for producing male terminal fittings and terminal fitting |
| 01/27/2005 | WO2005008759A1 Multiple-step electrodeposition process for direct copper plating on barrier metals |
| 01/27/2005 | WO2005007933A1 Electrochemical processing cell |
| 01/27/2005 | US20050020079 Structure having flush circuit features and method of making |
| 01/27/2005 | US20050020068 Plating method |
| 01/27/2005 | US20050019599 Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil |
| 01/27/2005 | US20050019598 The laminate of a electrolytically plated copper film and a polyimide film using no adhesive and on which a fine circuit pattern can be formed; copper film has at most 200 protrusions having a diameter of >15 mu m (abnormally large protrusions) on a surface not facing the polyimide film; peel strength |
| 01/27/2005 | US20050017099 Narrow diameter needle having reduced inner diameter tip |
| 01/27/2005 | US20050016868 Providing a wafer electrical connection by holding the conductive surface against the surface of the belt pad, applying a potential difference between the electrode and the wafer electrical connection and establishing a relative motion between the surface of the belt pad and the wafer |
| 01/27/2005 | US20050016858 Reverse pulse plating composition and method |
| 01/27/2005 | US20050016681 Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface |
| 01/27/2005 | DE19926102B4 Verfahren und Anlage zur Herstellung eines elektrolytisch beschichteten Warmbandes Method and apparatus for producing an electrolytically coated hot strip |
| 01/26/2005 | EP1500146A1 Method for making thin-film semiconductors based on i-iii-vi sb 2 /sb compounds, for photovoltaic applications |
| 01/26/2005 | EP1499759A2 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 01/26/2005 | EP1499451A1 Minimizing whisker growth in tin electrodeposits |
| 01/26/2005 | CN2673884Y Means for electroplating teeth-lines of zippers |
| 01/26/2005 | CN1571867A Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board |
| 01/26/2005 | CN1571865A System and method for electrolytic plating |
| 01/25/2005 | US6846392 Hydrophobic and hydrophilic membranes to vent trapped gases in a plating cell |
| 01/20/2005 | WO2005005692A1 Apparatus and method for depositing and planarizing thin films of semiconductor wafers |
| 01/20/2005 | WO2004094701A3 Method and apparatus for monitoring, dosing, and distribution of chemical compositions |
| 01/20/2005 | US20050014368 Substrate holder and plating apparatus |
| 01/20/2005 | US20050014359 Semiconductor device manufacturing method |
| 01/20/2005 | US20050014355 Under-bump metallization layers and electroplated solder bumping technology for flip-chip |
| 01/20/2005 | US20050014014 Electroplating bath composition and method of using |
| 01/19/2005 | EP1497859A2 Method for the production of thin metal-containing layers having low electrical resistance |
| 01/19/2005 | EP1497476A1 Process of masking cooling holes of a gas turbine component |
| 01/19/2005 | CN1185371C Method for electroplating substrate using ceramic chromium and ceramic chromium layer electroplated on substrate |
| 01/19/2005 | CA2474830A1 Device for galvanizing member-shaped substrates |
| 01/18/2005 | US6844274 Substrate holder, plating apparatus, and plating method |
| 01/18/2005 | US6843897 Anode slime reduction method while maintaining low current |
| 01/13/2005 | WO2005003409A1 Method for producing nanocarbon material and method for manufacturing wiring structure |
| 01/13/2005 | WO2005002773A1 Method of connecting module layers suitable for the production of microstructure components and a microstructure component |
| 01/13/2005 | WO2005002742A1 Process equipment wear surfaces of extended resistance and methods for their manufacture |
| 01/13/2005 | US20050009334 Method of producing multilayer interconnection structure |
| 01/13/2005 | US20050006245 Multiple-step electrodeposition process for direct copper plating on barrier metals |
| 01/13/2005 | US20050006244 Electrode assembly for electrochemical processing of workpiece |
| 01/13/2005 | US20050006243 Positioning object in concave zone of carrier tape; plating, washing; electrolytic cell |
| 01/13/2005 | DE10329031A1 Electrolysis covering device e.g. for metal rod, has plating electrode which allows two electrodes to be portioned which are electrically isolated from each other |
| 01/13/2005 | DE102004025560A1 Gleitteil Slide |
| 01/13/2005 | CA2530976A1 Method for producing nanocarbon material and method for manufacturing wiring structure |
| 01/13/2005 | CA2495788A1 Method of connecting module layers suitable for the production of microstructure components and a microstructure component |
| 01/12/2005 | EP1496142A2 Electroplating method and electroplating apparatus |