| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 03/24/2005 | US20050061676 System for electrochemically processing a workpiece |
| 03/24/2005 | US20050061661 Electrodeposition device and electrodeposition system for coating structures which have already been made conductive |
| 03/24/2005 | US20050061659 Plating apparatus and plating method |
| 03/24/2005 | DE19748926B4 Verfahren zum Galvanisieren einer siliciumhaltigen Aluminiumlegierung, Zylinderblock aus einer siliciumhaltigen Aluminiumlegierung Method of electroplating a silicon-containing aluminum alloy cylinder block of a silicon-containing aluminum alloy |
| 03/24/2005 | DE19746703B4 Galvanisiervorrichtung Plating apparatus |
| 03/24/2005 | CA2532451A1 Device and method for electrolytically treating electrically insulated structures |
| 03/23/2005 | EP1516943A2 Protective coating for turbine engine component |
| 03/23/2005 | EP1516357A2 Substrate holder and plating apparatus |
| 03/23/2005 | EP1516076A1 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents |
| 03/23/2005 | CN1599809A Pretreatment process for coating of aluminium materials |
| 03/23/2005 | CN1599513A Ultra-thin copper foil with carrier and method of producing ultra-thin copper foil with carrier and printed circuit board, |
| 03/23/2005 | CN1597290A Metal mould for processing plastic gloves and its production method |
| 03/22/2005 | US6869516 Spraying a vapor mixture of isopropyl alcohol and nitrogen to effectively remove electrolyte residue from the contact ring |
| 03/22/2005 | US6869515 Providing substrate with electroconductive surface; providing electrochemical deposition cell; immersing substrate in electrolyte; providing uniform powerful turbulent agitation; providing electroplating current for filling openings |
| 03/22/2005 | US6869510 Methods and apparatus for processing the surface of a microelectronic workpiece |
| 03/22/2005 | CA2139207C Sliding parts and method of producing same |
| 03/17/2005 | US20050058945 Reduces the tendency of the copper etch step from under-cutting the nickel/gold to cause slivers that cause short circuiting by providing a conforming nickel/gold layer that extends down the side of the traces |
| 03/17/2005 | US20050056542 Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
| 03/17/2005 | US20050056541 Enclosing in tubal shield; connecting to cathode; immersion into bath |
| 03/17/2005 | US20050056538 Insoluble anode with an auxiliary electrode |
| 03/17/2005 | DE19861248B4 Electrodeposition unit for semiconductor wafer coating - has anode with central opening to promote uniform deposited layer thickness |
| 03/16/2005 | EP1514957A1 Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board |
| 03/16/2005 | EP1513968A1 Components for electrical connectors, and metal strip therefore |
| 03/16/2005 | EP1409772B1 Method for selectively electroplating a strip-shaped, metal support material |
| 03/16/2005 | EP1204787B1 Method for continuous nickel-plating of an aluminium conductor and corresponding device |
| 03/16/2005 | CN1193115C Electrolytic copper-plated R-T-B magnet and method thereof and electrolytic copper solution |
| 03/15/2005 | US6868214 Optical waveguide, method of fabricating the waveguide, and optical interconnection device using the waveguide |
| 03/15/2005 | US6867136 Method for electrochemically processing a workpiece |
| 03/15/2005 | US6866765 Electrolytic copper-plated R-T-B magnet and plating method thereof |
| 03/15/2005 | US6866764 Electroless deposition using organometallic polymer and organosilicon polymer; forming copper film |
| 03/15/2005 | US6866763 Thickness profile control member is included that has first and second regions that allow for processing at first and second rates different from each other; for planar deposition or etching of conductive layers in integrated circuits |
| 03/10/2005 | WO2005021822A1 Method for producing a hardened steel part |
| 03/10/2005 | WO2005021821A1 Method for producing hardened parts from sheet steel |
| 03/10/2005 | WO2005021820A1 Method for producing a hardened profile part |
| 03/10/2005 | WO2004013381A3 Insoluble anode loop in copper electrodeposition cell for interconnect formation |
| 03/10/2005 | WO2003056609A3 Apparatus and method for electroplating a wafer surface |
| 03/10/2005 | US20050053772 Electrophotography; transferring visible images |
| 03/10/2005 | US20050051437 Having porous member (plating solution impregnated member), the plating apparatus being capable of handling and easily controlling composition of plating soution; especially for electroless deposition of copper or silver; for filling fine interconnect pattern in semiconductor substrate |
| 03/10/2005 | US20050051435 Spray coating the inner wall surface of a hollow body, more specifically of a pin holder of an igniter, with gold, the one end side of which is open and comprises there a perimeter edge; for electrical igniter units for igniting fuels; for air bags or for belt tighteners in automotive vehicles |
| 03/10/2005 | US20050051433 System for monitoring, dosing and distribution of a chemical composition in a material treatment process, the chemical composition containing at least one additive for maintaining quality of the chemical treatment process; particularly directed to the field of management of electroplating bath solutions |
| 03/10/2005 | US20050050767 Wet chemical processing chambers for processing microfeature workpieces |
| 03/09/2005 | EP1415021A4 Copper on invar composite and method of making |
| 03/09/2005 | EP1257694A4 Conditioning of through holes and glass |
| 03/09/2005 | EP1148976B1 Method and apparatus for deposition on and polishing of a semiconductor surface |
| 03/09/2005 | CN1592800A Electrolytic copper plating solutions |
| 03/09/2005 | CN1590597A Copper electroplating film method |
| 03/09/2005 | CN1590594A Plating method |
| 03/09/2005 | CN1590591A Multi-porous Ni foil for cathode of alkaline battery method for mfg. Ni foil and mfg. device thereof |
| 03/09/2005 | CN1192690C Copper clad laminated sheet and its mfg. method |
| 03/08/2005 | US6863991 Coated biperiodic metallic mesh arrays with molecular monolayers and lipid bilayers thereon |
| 03/08/2005 | US6863795 Plating a wafer by exposing to a first solution of a sulfur depolarizing compound to brighten and level; exposing to a metal compound solution, applying a current; elimination of depletion/monitoring of additives and defects (bumps) |
| 03/08/2005 | US6863441 Sliding member |
| 03/03/2005 | WO2005019504A1 Method of preparing printed or daubed image and printed or daubed image element by it |
| 03/03/2005 | WO2005018688A1 Sanitary hose with an antimicrobial finish |
| 03/03/2005 | WO2005018311A2 Fishhook |
| 03/03/2005 | US20050048775 Depositing a tantalum film |
| 03/03/2005 | US20050048769 Method of manufacturing a semiconductor device |
| 03/03/2005 | US20050048306 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board |
| 03/03/2005 | US20050045488 Copper electrodeposition in microelectronics |
| 03/03/2005 | US20050045486 Plating method and plating solution |
| 03/03/2005 | US20050045485 Reducing or avoiding pitting; utilizing such as amine based polyalkylene oxide; reliable interconnect formation for ultra large scale integration microcircuits |
| 03/03/2005 | US20050045474 Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof |
| 03/03/2005 | US20050045473 Device for galvanizing member-shaped substrates |
| 03/03/2005 | DE10337748A1 Elektrisch leitfähiges Material Electrically conductive material |
| 03/03/2005 | DE10212436B4 Vorrichtung zur Behandlung von strangförmigem metallischen Gut und ihre Verwendung Apparatus for treating strand-metallic material and their use |
| 03/02/2005 | EP1511366A2 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board |
| 03/02/2005 | EP1510601A1 Apparatus for electroplating wafers |
| 03/02/2005 | CN1586890A Nickel plated metal printing masterplate and its producing method |
| 03/02/2005 | CN1191605C Method and apparatus for holding and positioing semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 03/02/2005 | CN1191392C Galvanic bath, method for producing structurded hard chromium layers and use thereof |
| 03/01/2005 | US6861355 Metal plating using seed film |
| 03/01/2005 | US6860981 Minimizing whisker growth in tin electrodeposits |
| 03/01/2005 | US6860769 Cathode contact pin for an electroplating process |
| 02/24/2005 | WO2005018021A1 Battery case-use surface-treated steel sheet, battery case and battery using it |
| 02/24/2005 | WO2005016017A1 Emulsions |
| 02/24/2005 | US20050042886 System for ultraviolet atmospheric seed layer remediation |
| 02/24/2005 | US20050042868 Method for forming plating film |
| 02/24/2005 | US20050040141 Wire for high-speed electrical discharge machining |
| 02/24/2005 | US20050040049 Electrochemical depositing copper on a semiconductor wafer, chemical mechanical polishing of the conductive surface; deliverying solution to anode cavity, applying a potential |
| 02/24/2005 | US20050040046 Electrochemical deposition system for depositing copper on a semiconductor substrate; transfer system is within same apparatus to prevent contamination of copper seeding layer |
| 02/24/2005 | DE202004015858U1 Fire extinguishing fitting for hygienically conveying drinking water is made from aluminum or aluminum alloy completely or partially coated with tin |
| 02/24/2005 | DE102004030018A1 Gleitelement Slider |
| 02/24/2005 | DE102004030017A1 Gleitelement Slider |
| 02/23/2005 | EP1508385A1 System for ultraviolet cleaning |
| 02/23/2005 | EP1507900A1 Copper laminate, composite lamellar material comprising said copper laminate and a procedure for producing it |
| 02/23/2005 | EP1507612A1 Method for the galvanic coating of a continuous casting mould |
| 02/23/2005 | EP1419290B1 Segmented counterelectrode for an electrolytic treatment system |
| 02/23/2005 | CN1585835A Electropolishing assembly and methods for electropolishing conductive layers |
| 02/23/2005 | CN1191003C Device and method for treating circuit supports with impulse excitation |
| 02/23/2005 | CN1190520C Copper electroplating method |
| 02/22/2005 | US6858479 Low resistivity copper conductor line, liquid crystal display device having the same and method for forming the same |
| 02/22/2005 | US6858123 An electroplating solution comprising copper sulfate, sulfuric acid, hydrochloride, an ethylene oxide adduct or polyethylene glycol, hydroxylamine sulfate, and hydroxyl amine chloride; making semiconductors |
| 02/22/2005 | US6858122 Nickel electroplating solution |
| 02/22/2005 | US6858121 Method and apparatus for filling low aspect ratio cavities with conductive material at high rate |
| 02/17/2005 | WO2005015627A1 Substrate processing apparatus, substrate processing method, and substrate holding apparatus |
| 02/17/2005 | WO2005015623A2 Reduction of defects in conductive layers during electroplating |
| 02/17/2005 | US20050037620 Method for achieving wafer contact for electro-processing |
| 02/17/2005 | US20050037580 Manufacturing method for semiconductor device |
| 02/17/2005 | US20050035347 Probe card assembly |
| 02/17/2005 | US20050034994 Method and apparatus for full surface electrotreating of a wafer |