| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
|---|
| 05/11/2005 | EP0887441B1 Compound electrode for electrolysis |
| 05/11/2005 | CN1614100A Device for galvanizing member-shaped substrates |
| 05/10/2005 | US6891198 Film carrier tape for mounting an electronic part |
| 05/10/2005 | US6890813 Polymer film metalization |
| 05/10/2005 | US6890415 Reactor vessel having improved cup, anode and conductor assembly |
| 05/10/2005 | US6890413 Method and apparatus for controlling local current to achieve uniform plating thickness |
| 05/10/2005 | US6889428 Clamper covers the conductive foil to cover the exposed parts of the surface, and a plating liquid is injected into the interior of the clamper for forming the plated film on the surface of the masked conductive foil |
| 05/06/2005 | WO2005040459A2 Electroplating compositions and methods for electroplating |
| 05/05/2005 | US20050095862 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 05/05/2005 | US20050092614 Distributing forces for electrodeposition |
| 05/05/2005 | US20050092613 Two-bath electrolysis |
| 05/05/2005 | US20050092610 Uniform thickness and rate of metal deposition |
| 05/05/2005 | US20050092608 Ion-implanted electroformed structural material and method of producing the structural material |
| 05/05/2005 | US20050092602 Electrochemical plating cell having a membrane stack |
| 05/05/2005 | US20050092601 Electrochemical plating cell having a diffusion member |
| 05/05/2005 | US20050092600 Substrate holder, plating apparatus, and plating method |
| 05/05/2005 | US20050092431 Chemical processing method, and method of manufacturing semiconductor device |
| 05/04/2005 | EP1527215A2 Apparatus and method for electroplating a wafer surface |
| 05/04/2005 | EP1526943A1 Brazing product and method of manufacturing a brazing product |
| 05/04/2005 | DE10361880B3 Unit for wet chemical or electrolytic treatment of flat articles, especially metal foil, circuit foils or circuit boards, transports articles between rollers in mountings in side walls |
| 05/04/2005 | CN2697111Y Metal wire electroplating device |
| 05/04/2005 | CN1612957A Metal strip for epitaxial coating and method for production thereof |
| 05/04/2005 | CN1611632A Ion-implanted electroformed structural material and method of producing the structural material |
| 05/04/2005 | CN1200145C Equipment and method for dissolving copper in step of producing raw liquid with electrolytic copper foil |
| 05/03/2005 | US6887789 Process and manufacturing tool architecture for use in the manufacture of one or more protected metallization structures on a workpiece |
| 05/03/2005 | US6887522 Forming a first copper film on a predetermined surface of a substrate by chemical vapor deposition and forming a second copper film on the first copper film by an electrolytic copper plating using the first copper film as an electrode |
| 05/03/2005 | US6887366 Repair method for textured and/or smooth steel surfaces on endless strips or pressing sheets |
| 05/03/2005 | US6887364 Steel sheet is immersed in electrolytic baths and plated on both sides using electrode with inverted polarity; brazing |
| 05/03/2005 | US6886520 Cylinder for internal combustion engine and method of treating inner surface of the cylinder |
| 04/28/2005 | WO2005038094A2 Apparatus for electroless deposition |
| 04/28/2005 | WO2004003663A3 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion |
| 04/28/2005 | WO2003094246A8 Method for making thin-film semiconductors based on i-iii-vi2 compounds, for photovoltaic applications |
| 04/28/2005 | WO2003034478A3 Apparatus and method for electro chemical plating using backside electrical contacts |
| 04/28/2005 | WO2002004704A3 Method and apparatus for patching electrochemically deposited layers using electroless deposited materials |
| 04/28/2005 | US20050089709 Support layer for thin copper foil |
| 04/28/2005 | US20050089645 Flexible member can be used to provide a uniform force to securely retain the workpiece to be positioned in a process module resulting in uniform coatings; for fluid processing (e.g. electrodeposition) of substrates e.g. semiconductor wafers |
| 04/28/2005 | US20050087447 Addition of cyanine dye allows copper plating from trenches and vias having high aspect ratio which have been formed on surfaces of substrate; electromigration |
| 04/28/2005 | US20050087439 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 04/27/2005 | EP1525609A1 Device for etching semiconductors with a large surface area |
| 04/27/2005 | CN1610769A 电镀装置 Plating equipment |
| 04/27/2005 | CN1610091A Semiconductor multi-layer wiring plate and forming method thereof |
| 04/27/2005 | CN1610066A Metallization method for producing integrated circuit copper interconnecting wire by separating bipolar acid chemical plating |
| 04/27/2005 | CN1609282A Partial plating method and its apparatus |
| 04/26/2005 | US6885727 Apparatus and method for measuring thickness and composition of multi-layered sample |
| 04/26/2005 | US6884335 Electroplating using DC current interruption and variable rotation rate |
| 04/26/2005 | US6884334 Vertically configured chamber used for multiple processes |
| 04/21/2005 | US20050084987 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 04/21/2005 | US20050084615 monitoring the characteristics of processing fluids using detectors and external controllers |
| 04/21/2005 | US20050083048 Plating system with integrated substrate inspection |
| 04/21/2005 | US20050082163 Plating apparatus and method |
| 04/21/2005 | US20050081785 Apparatus for electroless deposition |
| 04/21/2005 | US20050081744 Electroplating compositions and methods for electroplating |
| 04/20/2005 | EP1524338A1 Plating device |
| 04/20/2005 | EP1523767A2 Methods of electrochemically treating semiconductor substrates, and methods of forming capacitor constructions |
| 04/20/2005 | CN1198488C Electro-deposition copper foil through surface processing and its producing method and use |
| 04/19/2005 | US6882048 Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area |
| 04/19/2005 | US6881319 Comprises disodium bis(3-sulfopropyl)disulfide; for use on printed wiring board or semiconductor wafer |
| 04/19/2005 | US6881318 Dynamic pulse plating for high aspect ratio features |
| 04/19/2005 | US6881309 Diffuser with spiral opening pattern for electroplating reactor vessel |
| 04/14/2005 | WO2005033377A2 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface |
| 04/14/2005 | WO2005033376A2 Plating method and apparatus |
| 04/14/2005 | WO2005015623A3 Reduction of defects in conductive layers during electroplating |
| 04/14/2005 | US20050079280 Electroless copper plating solution, electroless copper plating process and production process of circuit board |
| 04/14/2005 | US20050079089 Alloy coating, method for forming the same, and member for high temperature apparatuses |
| 04/14/2005 | US20050077185 Conveyorized plating line and method for electrolytically metal plating a workpiece |
| 04/14/2005 | US20050077173 Plating apparatus for substrate |
| 04/14/2005 | US20050076488 Method and device for obtaining a determined flow resistance of a flow channel |
| 04/13/2005 | EP1522610A2 Method for the production of a wear-resistant layer |
| 04/13/2005 | EP1521868A2 Device and method for monitoring an electrolytic process |
| 04/13/2005 | EP1214739A4 Copper deposit process |
| 04/13/2005 | CN1197443C Assembly of an electronic component with spring packaging |
| 04/13/2005 | CN1197128C Method for forming copper layer on semiconductor chip |
| 04/13/2005 | CN1196812C Surface treated Tin-plated steel sheet and chemical treatment solution |
| 04/12/2005 | US6878461 Surface treatment structure, contact, sliding, fitting-in and ornamental members, and method for manufacturing the same |
| 04/07/2005 | US20050074934 Electrodeposited layer |
| 04/07/2005 | US20050072680 Rotating about axis passing through surface to be plated and moving wafer such that its axis rotates about second axis of rotation |
| 04/07/2005 | US20050072358 Substrate processing apparatus and substrate processing method |
| 04/06/2005 | EP1520915A2 Method and apparatus for partially plating work surfaces |
| 04/06/2005 | EP1520281A2 Low-force electrochemical mechanical processing method and apparatus |
| 04/06/2005 | EP1520064A2 Plain bearing having an overlay alloy layer |
| 04/06/2005 | CN1604830A Wire for high-speed electrical discharge machining |
| 04/06/2005 | CN1196202C Method and equipment for forming zinc oxide film, and method and apparatus manufacturing photovoltaic device |
| 04/05/2005 | US6875333 Plating apparatus for wafer |
| 04/05/2005 | US6875332 Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied |
| 04/05/2005 | US6875331 Anode isolation by diffusion differentials |
| 04/05/2005 | US6875330 Process for coating workpieces with bearing metal |
| 03/31/2005 | WO2005028728A2 Machine for forming a pattern on non-woven cloth and method for producing an apron therefor |
| 03/31/2005 | WO2005028717A1 Insoluble anode with an auxiliary electrode |
| 03/31/2005 | WO2005028706A1 Composite material and method of manufacturing the same |
| 03/31/2005 | WO2004099460A3 Method for producing galvanically enhanced moulded elements optionally lighted by transparency,made of thermoplastic,thermosetting plastic,elastomer or silicone, as well as moulded elements optionally lighted by transparency made of thermoplastic,thermosetting plastic,elastomer or silicone with galvanically enhanced surface |
| 03/31/2005 | US20050067790 Piston ring having chromium coating |
| 03/31/2005 | US20050067296 Electrodeposition; galvanically coating iron on surface of aluminum-based substrate, cleaning with solution of oils, fats, emulsions, and pigments, etching in solution to dissolve alloy, rinsing surface with water, immersing in electrolytic iron sulfate solution, then anodically/cathodically switching |
| 03/31/2005 | US20050067294 SOI by oxidation of porous silicon |
| 03/31/2005 | US20050067274 [electroplating apparatus] |
| 03/30/2005 | EP1519087A1 Piston ring having chromium coating |
| 03/24/2005 | WO2005026415A1 Device and method for electrolytically treating electrically insulated structures |
| 03/24/2005 | WO2004009878A3 Electrochemical processing cell |
| 03/24/2005 | US20050064703 Substrate processing method |
| 03/24/2005 | US20050064228 Protective coating for turbine engine component |
| 03/24/2005 | US20050061679 Exposing noble metal layer to electrodeposition composition comprising a copper salt, a suppressor, an accelerator and an electrolyte, initiating electrodeposition of copper on a surface of the noble metal layer by application of a predetermined current density |