| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 06/23/2005 | DE10354760A1 Verfahren zur Abscheidung von Nickel und Chrom(VI)freien metallischen Mattschichten A process for the deposition of nickel and chromium (VI) free metallic mat layers |
| 06/22/2005 | EP1544327A1 Surface treated steel plate for battery cases, its manufacturing method, battery case formed using the steel plate, battery using the battery case |
| 06/22/2005 | EP1544326A1 Surface treated steel plate for battery cases and battery case using same |
| 06/22/2005 | EP1481114A4 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 06/22/2005 | CN1630739A Apparatus and method for electroplating a wafer surface |
| 06/22/2005 | CN1630039A Method for selective electroplating of semiconductor device i/o pads |
| 06/22/2005 | CN1629363A Process for electroplating zipper chain teeth and apparatus therefor |
| 06/21/2005 | US6908540 Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process |
| 06/21/2005 | US6908534 Substrate plating method and apparatus |
| 06/21/2005 | US6908515 Treatment of circuit support with impulse excitation |
| 06/16/2005 | WO2004111312A3 Contact surfaces for electrical contacts and method for producing the same |
| 06/16/2005 | WO2004107422A3 Plating apparatus and plating method |
| 06/16/2005 | WO2001090434A3 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 06/16/2005 | US20050126916 Three-dimensional structures having feature sizes smaller than a minimum feature size and methods for fabricating |
| 06/15/2005 | EP1542505A1 Metal based resistance heating element and method for preparation thereof |
| 06/15/2005 | EP1541714A1 Method for repairing components using environmental bond coatings and resultant repaired components |
| 06/15/2005 | EP1540044A2 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion |
| 06/15/2005 | CN1628340A Method for seed layer removal for magnetic heads |
| 06/15/2005 | CN1206888C Method for preparing surface treated copper foil |
| 06/14/2005 | US6906427 Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same |
| 06/14/2005 | US6905588 Forming chip connectors; electrolytic cells |
| 06/14/2005 | US6904658 Process for forming a porous drug delivery layer |
| 06/09/2005 | WO2005052221A1 Device for oxidising internal surfaces of hollow parts |
| 06/09/2005 | WO2004099460B1 Method for producing galvanically enhanced moulded elements optionally lighted by transparency,made of thermoplastic,thermosetting plastic,elastomer or silicone, as well as moulded elements optionally lighted by transparency made of thermoplastic,thermosetting plastic,elastomer or silicone with galvanically enhanced surface |
| 06/09/2005 | US20050124262 Processing pad assembly with zone control |
| 06/09/2005 | US20050121331 Depositing a tin-bismuth alloy skin layer on surfaces of a body, placing a solid tin metal and a solid bismuth metal in plating solution, electroconnecting anode; electrochemically alloying; increase in plating cycles, manufactured at a low cost, mounting reliability of a semiconductor |
| 06/09/2005 | US20050121329 Variable pressure application system for engaging the substrate through contact ring; transmitting central pressure to center region of substrate and less peripheral pressure to edge of substrate; electroplating system for forming a metal layer with reduced metal layer on edge of wafer; easy cleaning |
| 06/09/2005 | US20050121317 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 06/09/2005 | US20050121314 Electrolytic plating method and device for a wiring board |
| 06/09/2005 | US20050121313 Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station |
| 06/09/2005 | US20050120557 Process for copper free chrome plating of a vehicle wheel surface |
| 06/09/2005 | DE202004001155U1 Screw bolt with a decorative outer surface, for a light metal motor vehicle wheel rim, has an electroplated metal layer together with a silicate coating |
| 06/09/2005 | DE10242772B4 Galvanisierungseinrichtung Electroplating |
| 06/09/2005 | DE10228323B4 Verfahren zum kathodischen elektrolytischen Abscheiden und Mikrokomponenten, hergestellt durch ein solches Verfahren A method of cathodic electrolytic deposition and micro components, prepared by such a method |
| 06/08/2005 | EP1408380A4 Method for producing a protective hologram |
| 06/08/2005 | EP1220625B1 Die manufacturing |
| 06/08/2005 | CN1625611A Method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 06/08/2005 | CN1624208A Electroplate device, electroplate method and method for manufacturing semiconductor device |
| 06/08/2005 | CN1624207A Apparatus and method for plating a substrate, and method and apparatus for electrolytic treatment |
| 06/07/2005 | US6903016 Combined conformal/non-conformal seed layers for metallic interconnects |
| 06/07/2005 | US6902843 Ni-plated steel plate for alkali-manganese dry cell anode can and alkali-manganese dry cell anode can |
| 06/07/2005 | US6902824 Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same |
| 06/02/2005 | WO2005050760A1 Plated steel plate for battery case, battery case using the plate, and battery using the case |
| 06/02/2005 | WO2005049895A1 Copper electrolysis solution for production of electrolytic copper foil and process for producing electrolytic copper foil |
| 06/02/2005 | WO2005033376A3 Plating method and apparatus |
| 06/02/2005 | US20050118448 Laser ablation resistant copper foil |
| 06/02/2005 | US20050118364 Tubular member having an anti-galling coating |
| 06/02/2005 | DE102004051374A1 Galvanogeformtes Ionenimplantations-Strukturmaterial und Verfahren zur Herstellung des Strukturmaterials Electroformed ion implantation structural material and process for manufacturing the structural material |
| 06/01/2005 | EP1536037A1 Multilayer plated fuel line parts for automobile |
| 06/01/2005 | CN1623012A Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 06/01/2005 | CN1621573A Electroplating clamp for electronic parts and electrolytic plating device |
| 06/01/2005 | CN1621572A Electroplating clamp and electrolytic plating device for electronic parts |
| 05/31/2005 | US6899926 Alloy coating, method for forming the same, and member for high temperature apparatuses |
| 05/31/2005 | US6899920 Abrasive particles embedded in metal matrix |
| 05/31/2005 | US6899797 Apparatus for continuous processing of semiconductor wafers |
| 05/26/2005 | WO2004081261A3 Plating apparatus |
| 05/26/2005 | US20050112459 Surface-treated steel plate for battery case and battery case |
| 05/26/2005 | US20050110149 Semiconductor multilayer wiring board and method of forming the same |
| 05/26/2005 | US20050109633 System for electrochemically processing a workpiece |
| 05/26/2005 | US20050109629 Reactor for electrochemically processing at least one surface of a microelectronic workpiece; positioning contactors; concentric anodes; nozzles; electroplating; uniform deposition of the electroplated material |
| 05/26/2005 | US20050109628 Reactor for electrochemically processing at least one surface of a microelectronic workpiece; positioning contactors; concentric anodes; nozzles; electroplating; uniform deposition of the electroplated material |
| 05/26/2005 | US20050109627 Uniformity; using electrolytic cells; positioning seed layer of low conductivity |
| 05/26/2005 | US20050109625 Reactor for electrochemically processing at least one surface of a microelectronic workpiece; positioning contactors; concentric anodes; nozzles; electroplating; uniform deposition of the electroplated material |
| 05/26/2005 | US20050109612 Electroplating apparatus with segmented anode array |
| 05/26/2005 | US20050109611 Electroplating apparatus with segmented anode array |
| 05/25/2005 | EP1533397A2 Process of depositing mat metallic layers free of nickel and chromium(VI) |
| 05/25/2005 | EP1533396A2 Method for repairing coated components using NiAl bond coats |
| 05/25/2005 | EP1532668A1 Substrate processing apparatus and substrate processing method |
| 05/25/2005 | EP1532665A2 Coating support and method for the selective coating of conductive tracks on one such support |
| 05/25/2005 | DE10326788B4 Kontaktoberflächen für elektrische Kontakte und Verfahren zur Herstellung Contact surfaces for electrical contacts and processes for preparing |
| 05/25/2005 | CN1620221A Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier |
| 05/25/2005 | CN1619012A Process of depositing mat metallic layers free of nickel and chromium(VI) |
| 05/24/2005 | US6897151 Methods of filling a feature on a substrate with copper nanocrystals |
| 05/24/2005 | US6896784 Method for controlling local current to achieve uniform plating thickness |
| 05/24/2005 | US6896776 Method and apparatus for electro-chemical processing |
| 05/19/2005 | US20050106315 Method for repairing components using environmental bond coatings and resultant repaired components |
| 05/19/2005 | US20050103636 Forming a titanium-tungsten (TiW) layer over a passivation layer on a semiconductor substrate, the TiW layer further extending into an opening formed in the passivation layer for exposing the I/O pad, such that the TiW layer covers sidewalls of the opening and a top surface of the I/O pad |
| 05/19/2005 | DE19926102B9 Verfahren und Anlage zur Herstellung eines elektrolytisch beschichteten Warmbandes Method and apparatus for producing an electrolytically coated hot strip |
| 05/19/2005 | DE10358147B3 Transport and treatment method for circuit boards and conductor foils has electrolyte flow for electrolytic processing assisting transport of circuit boards or conductor foils in transport direction |
| 05/19/2005 | DE10217277B4 Verfahren zur metallischen Innenbeschichtung von Hohlkörpern, insbesondere von Strahlrohrelementen A process for internal coating of metallic hollow bodies, in particular jet pipe elements |
| 05/18/2005 | EP1531656A2 Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier |
| 05/18/2005 | CN1202697C Method for filling through hole |
| 05/17/2005 | US6893953 Fabrication process of a semiconductor device including a CVD process of a metal film |
| 05/17/2005 | US6893550 Copper; an acid selected from sulfuric, methanesulfonic, amidosulfuric, aminoacetic, or fluoboric; a halogen; an accelerating agent, a suppressing agent, or an accelerating-suppressing agent |
| 05/17/2005 | US6893548 Method of conditioning electrochemical baths in plating technology |
| 05/17/2005 | US6893505 Valve for controlling fluid flow |
| 05/17/2005 | US6893330 Tool and process for chrome plating a vehicle wheel surface |
| 05/12/2005 | WO2005042809A2 Support for workpiece to be electrolytically coated |
| 05/12/2005 | WO2005042807A1 Support layer for thin copper foil |
| 05/12/2005 | WO2005042804A2 Method and apparatus for fluid processing a workpiece |
| 05/12/2005 | WO2004094703A3 Methods of forming medical devices |
| 05/12/2005 | WO2003083182A3 Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths |
| 05/12/2005 | WO2001096632A3 A method and apparatus for conditioning electrochemical baths in plating technology |
| 05/12/2005 | US20050101138 System and method for applying constant pressure during electroplating and electropolishing |
| 05/12/2005 | US20050098440 Methods for the electrochemical deposition of copper onto a barrier layer of a work piece |
| 05/12/2005 | US20050098439 immersing substrate in baths containing plating solutions, then washing the surfaces, forming a second plating layer and drying; filling pits for fine wires formed in semiconductor wafers with copper or alloys |
| 05/12/2005 | US20050097735 Process for forming metal layers |
| 05/12/2005 | DE10358149B3 Process for contact-free transport and treatment of flat material by wet chemical and/or electrolytic processing useful in the transport and treatment, e.g. cleaning and etching, of conductive films and plates |
| 05/12/2005 | CA2543594A1 Support layer for thin copper foil |
| 05/11/2005 | EP1529126A2 Electrolytic copper plating solutions |