| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 08/03/2005 | CN1649038A Conductor for flat cabal and its producing method and flat cabal |
| 08/03/2005 | CN1213645C Method for producing surface treated copper foil |
| 08/02/2005 | US6923898 Anode inserted in a hole of a work, and a member for rotating the work about its center axis and supplying a plating current; plating a ring shaped bonded magnet |
| 08/02/2005 | US6923892 Method for electrodeposited film formation, method for electrode formation, and apparatus for electrodeposited film formation |
| 07/28/2005 | WO2005068688A2 Plating solution, process for producing a structure with the plating solution, and apparatus employing the plating solution |
| 07/28/2005 | WO2005028728A3 Machine for forming a pattern on non-woven cloth and method for producing an apron therefor |
| 07/28/2005 | US20050164498 Plating method and plating apparatus |
| 07/28/2005 | US20050164495 Method to improve planarity of electroplated copper |
| 07/28/2005 | US20050162835 Production of via hole in flexible circuit printable board |
| 07/28/2005 | US20050161336 immersion of microelectronics in liquid solutions flowing through reactor vessels, then controlling the voltage applied the electrodes such that individual electrodes establish an electrical field in the solution and adjusting the electrical field in the solution over time to promote uniform deposition |
| 07/28/2005 | US20050161320 Electroplating apparatus with segmented anode array |
| 07/28/2005 | US20050161149 Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and copper clad laminate obtained by the process |
| 07/28/2005 | US20050160977 Method and apparatus for fluid processing a workpiece |
| 07/27/2005 | EP1557484A2 Aluminium sheet embossing roll |
| 07/27/2005 | CN1647264A Method for the production of thin metal-containing layers having low electrical resistance |
| 07/27/2005 | CN1646733A Web processing method and apparatus |
| 07/27/2005 | CN1646264A Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 07/27/2005 | CN1646263A Electrochemical mechanical processing with advancible sweeper |
| 07/27/2005 | CN1645570A Method for removing particles from wafer surface |
| 07/27/2005 | CN1212680C Surface treatment steel plate for battery case, battery case and battery using the case |
| 07/26/2005 | US6921551 Electrodeposition of electroconductive metals on wafers, panels, magnetic heads or substrates having cavities, by applying power and electrolyte solutions to the surfaces; integrated circuits |
| 07/26/2005 | US6921468 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 07/21/2005 | WO2005067362A1 Copper foil for electromagnetic wave shield filter and electromagnetic wave shield filter |
| 07/21/2005 | WO2005067354A1 Printed wiring board, method for manufacturing same, and circuit device |
| 07/21/2005 | WO2005066391A1 Copper electrodeposition in microelectronics |
| 07/21/2005 | WO2004078411A3 Method and apparatus for local polishing control |
| 07/21/2005 | US20050159281 Aluminum sheet embossing roll |
| 07/21/2005 | US20050158991 Metal plating using seed film |
| 07/21/2005 | US20050158574 A printed circuit board having high-density wiring of ultra-fine width and line/spacing of <15 mu m or less where a carrier foil, a peeling layer, an ultra-thin copper foil are electroplated in this order, use of electrolytic copper foil having a specific roughness profile specific; antipeeling agents |
| 07/21/2005 | US20050158478 Substrate processing apparatus and substrate processing method |
| 07/21/2005 | US20050155869 Immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction between the wafer and the electrolyte solution in combination with electrolysis |
| 07/21/2005 | US20050155865 Electrolytic processing apparatus and method |
| 07/21/2005 | US20050155864 Automatic process control; facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece |
| 07/21/2005 | US20050155514 Additive for plating bath |
| 07/20/2005 | EP1555335A2 Additive for plating bath |
| 07/20/2005 | CN1643186A Conveyorized plating line and method for electrolytically metal plating a workpiece |
| 07/19/2005 | US6919011 Electrolytic cell; vibration, agitation |
| 07/14/2005 | WO2005064044A1 Bronzing-surface-treated copper foil, process for producing the same, and electromagnetic wave shielding conductive mesh for front panel of plasma display utilizing the bronzing-surface-treated copper foil |
| 07/14/2005 | WO2005064043A2 Improved metal strip electroplating |
| 07/14/2005 | WO2004081261B1 Plating apparatus |
| 07/14/2005 | WO2004022814A3 Device and method for electrolytically treating an at least superficially electrically conducting work piece |
| 07/14/2005 | US20050153532 Methods and apparatus to reduce growth formations on plated conductive leads |
| 07/14/2005 | US20050153154 Metal hydride composite materials |
| 07/14/2005 | US20050150770 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 07/14/2005 | CA2551273A1 Improved metal strip electroplating |
| 07/13/2005 | EP1553213A1 Copper-tin-oxygen based alloy plating |
| 07/13/2005 | EP1553212A1 Electromagnetic wave shield material and process for producing the same |
| 07/13/2005 | EP1115915B1 Electrochemical treatment assembly and process of feeding current to a printed board material |
| 07/13/2005 | CN1639840A Electroless deposition apparatus |
| 07/13/2005 | CN1638604A Method and device for contactless treatment of flat objects in through type treatment equipment |
| 07/13/2005 | CN1638603A Method and device for treating flat objects in through type treating apparatus |
| 07/13/2005 | CN1637173A Anode unit for continuous electroplating of belt poor conductor |
| 07/13/2005 | CN1637172A Anode unit for continuous electroplating of linear poor conductor |
| 07/13/2005 | CN1637169A Electroplating method for a semiconductor device |
| 07/12/2005 | US6916413 Electro-plating apparatus and method |
| 07/12/2005 | US6916412 Divided housing |
| 07/07/2005 | WO2005060379A2 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 07/07/2005 | US20050148197 Substrate proximity processing structures and methods for using and making the same |
| 07/07/2005 | US20050148172 Seed layers for metallic interconnects |
| 07/07/2005 | US20050145997 Layer sequence for producing a composite material for electromechanical components |
| 07/07/2005 | US20050145503 Platinum aluminide coating and method thereof |
| 07/07/2005 | US20050145502 Minimizing whisker growth in tin electrodeposits |
| 07/07/2005 | US20050145501 Utilizing a high-volume, high-energy electro-deposition plating for coating soft metal or alloys( tin, pb, au, ag, ni, cu or indium) to resilience metal seal (stainless steel ); enhanced leakage control of the seals; continuously moving the seals in series through an electro-plating stage |
| 07/07/2005 | US20050145500 Plating apparatus, plating method, and manufacturing method of semiconductor device |
| 07/07/2005 | US20050145484 Apparatus for avoiding particle accumulation in electrochemical processing |
| 07/07/2005 | US20050145482 Apparatus and method for processing substrate |
| 07/07/2005 | US20050145265 Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
| 07/06/2005 | EP1419289B1 Device for continuous electrodeposition and electrical or electronic components manufactured in strip comprising a plated layer by electrodeposition |
| 07/06/2005 | CN1636266A Method and system to provide electrical contacts for electrotreating processes |
| 07/06/2005 | CN1636084A Dynamic pulse plating for high aspect ratio features |
| 07/06/2005 | CN1636083A Copper bath capable of depositing lackluster copper coat and method thereof |
| 07/06/2005 | CN1636073A Heat treatment method for a cold-rolled strip with an Ni and/or Co surface coating, sheet metal producible by said method and battery can producible by said method |
| 07/06/2005 | CN1635189A Chemical plating process and device |
| 07/06/2005 | CN1209493C Plasma electroplating |
| 07/05/2005 | US6913681 Plating method and plating apparatus |
| 07/05/2005 | US6913680 Applying a voltage between anode and plating surface to enhance the concentration of metal ions in the electrolyte solution that is contained in a feature on the plating surface prior to the bulk deposition on the plating surface. |
| 07/05/2005 | US6913468 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
| 06/30/2005 | WO2005059206A2 Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces |
| 06/30/2005 | US20050142374 Flexible copper foil structure and fabrication method thereof |
| 06/30/2005 | US20050140013 Semiconductor device and manufacturing process therefor as well as plating solution |
| 06/30/2005 | US20050139482 Plating method and plating apparatus |
| 06/30/2005 | US20050139481 Method of electroplating a substance over a semiconductor substrate |
| 06/30/2005 | US20050139480 Forming a mask over the substrate; extending the openings from the mask into the first region of substrate, removing the mask; electroplating an electrically conductive material; flowing electricity; forming capacitor |
| 06/30/2005 | US20050139479 Exposing electrically conductive materials to an electrolytic solution while providing electrical current through the materials; the second electrically conductive material forms a protective covering of oxide; semiconductor applications, capacitor structures |
| 06/30/2005 | US20050139478 forming copper seed layer by applying electroplating power with current density of between about 1.0 mA/cm2 and about 5.0 mA/cm2, in periodic pulses; enhancing the deposition of copper layer; microstructure vias can be filled, forming a uniform layer; annealing at low temperatures |
| 06/30/2005 | DE10355571A1 Device for electrolytic coating useful for electrolytic coating of metal ropes in which the object to be coated is passed vertically through at least two parallel electrodes |
| 06/30/2005 | DE102004025827B3 Electrical contacting device for circuit board or conductor foil passed through electrolytic cell using contacts alternating with transport rollers along each side edge |
| 06/30/2005 | CA2549526A1 Rolling bearing having a nickel-phosphorus coating |
| 06/29/2005 | CN1633519A Electroplating solution containing organic acid complexing agent |
| 06/29/2005 | CN1632914A Electroplating and/or electropolishing stand and method for electroplating and/or electropolishing wafers |
| 06/28/2005 | US6911396 Method of producing metallic film |
| 06/28/2005 | US6911138 Plating bath contains tin (II) sulfamate, acting as a tin (II) salt; as a complexing agent citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these, or gluconic lactone; and a brightener |
| 06/28/2005 | US6911137 Strip forms cathode and is moved in its longitudinal direction relative to anode, an electrolyte flowing between strip and anode, flow of electrolyte influenced by holding body between strip and anode |
| 06/28/2005 | US6911136 Method for regulating the electrical power applied to a substrate during an immersion process |
| 06/28/2005 | US6911127 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
| 06/28/2005 | US6910926 Electronic connector terminal |
| 06/28/2005 | CA2341725C Structure and method for joining metal members |
| 06/23/2005 | US20050136636 Method for manufacturing metal structure having different heights |
| 06/23/2005 | US20050133380 Electroetching methods and systems using chemical and mechanical influence |
| 06/23/2005 | US20050133379 Electrode immersed in solution configured proximate to conductive layer having a longitudinal dimension extending to edge of wafer; elongated contact electrode configured to receive a potential difference; isolator, voltage supplier |