| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 09/08/2005 | US20050196634 Metal member and electric contact using same |
| 09/08/2005 | US20050194696 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 09/08/2005 | US20050194257 Plating of the inner surfaces of the objects occurs by flowing an electroplating solution from the reservoir through the stack conduit in the presence of a current |
| 09/08/2005 | US20050194248 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 09/08/2005 | US20050193537 Modular semiconductor workpiece processing tool |
| 09/07/2005 | EP1570102A2 Method for coating piston rings for internal combustion engines |
| 09/07/2005 | CN1665966A Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and |
| 09/07/2005 | CN1664174A Method for copperizing continuously |
| 09/06/2005 | US6939622 Chip-on-film use copper foil |
| 09/06/2005 | US6939455 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 09/06/2005 | US6939448 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
| 09/06/2005 | US6939206 Method and apparatus of sealing wafer backside for full-face electrochemical plating |
| 09/06/2005 | US6938552 cleaning fine lead wire, cutting fine wire to a pre-specified length, electroplating zinc or zinc alloy to fine wire, placing electroplated wire in a die of a pre-specified shape and size;compressing wire into a solid preselected shape/size |
| 09/01/2005 | WO2003071008A3 Methods of and apparatus for making high aspect ratio microelectromechanical structures |
| 09/01/2005 | US20050191422 Applying mask material to cooling holes so that holes are at partially filled with mask material in portion closest to external surface and up to the level of the external surface, thickening portion of mask material within cooling holes, coating, removing thickened mask material |
| 09/01/2005 | US20050189229 Method and apparatus for electroplating a semiconductor wafer |
| 09/01/2005 | US20050189226 Contacting negatively charged electrode and pattern during immersion and movement of substrate in electrolytic bath; industrial scale, continuous process, economical |
| 09/01/2005 | US20050189214 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 09/01/2005 | US20050189213 Method and apparatus for copper plating using electroless plating and electroplating |
| 09/01/2005 | DE10308731B4 Verfahren und Vorrichtung zur galvanischen Beschichtung von Hohlkörpern Method and apparatus for the galvanic coating of hollow bodies |
| 09/01/2005 | DE102004006562A1 Method of forming lead strip materials, for battery electrode grids, involves coating lead strip materials with a plated metal or alloy in one or more plating baths |
| 09/01/2005 | DE102004006098A1 Coating articles comprises applying first corrosion-resistant metallic coating to article, applying second corrosion-resistant metallic coating over first coating and partially removing second coating to expose first |
| 08/31/2005 | EP1568258A1 Device for the metallisation of printed forms which are equipped with electrically conductive tracks and associated metallisation method |
| 08/31/2005 | EP1567695A1 Methods for forming copper interconnect structures by co-plating of noble metals and structures formed thereby |
| 08/31/2005 | CN1663329A Production of via hole in flexible circuit printable board |
| 08/31/2005 | CN1663036A Electropolishing metal layers on wafers having trenches or vias with dummy structures |
| 08/31/2005 | CN1217564C Roughened copper foil and making method thereof |
| 08/31/2005 | CN1217034C Workpiece processor having processing chamber with improved processing fluid flow |
| 08/31/2005 | CN1217030C Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 08/30/2005 | US6936925 Semiconductor device having copper lines with reduced electromigration using an electroplated interim copper-zinc alloy film on a copper surface |
| 08/25/2005 | WO2005078823A1 Plated steel sheet for battery container, battery container using such plated steel sheet, and battery using such battery container |
| 08/25/2005 | WO2005077677A1 Physical vapor deposition components, and methods of treating components |
| 08/25/2005 | WO2005076977A2 Plating apparatus and method |
| 08/25/2005 | WO2005038094A3 Apparatus for electroless deposition |
| 08/25/2005 | US20050186332 Forming an electroless nickel plating layer having an even thickness in a reliable manner; chromium and copper thin films are formed next sequentially on the surface of the supporting board exposed from the insulating base layer and on the entire surface of the insulating base layer |
| 08/25/2005 | US20050184409 Decorative mirror and a process of manufacturing it |
| 08/25/2005 | US20050183960 Selective electroless deposition; conductive polymer as seed layer for plating the metal electrode; semiconductor processing, lithographic techniques for metal patterning on a ferroelectric polymer layer; eliminates aggressive and environmentally unsafe chemical based photoresist removal processes |
| 08/25/2005 | US20050183959 Automatic process control; using facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece |
| 08/25/2005 | DE10251658B4 Verfahren zum Verbinden von zur Herstellung von Mikrostrukturbauteilen geeigneten, mikrostrukturierten Bauteillagen sowie Mikrostrukturbauteil A method of joining for the production of microstructured components suitable micro-structured component layers, as well as micro-structural component |
| 08/24/2005 | CN2719870Y Continuous electroplating line electroplating tank main-secondary tank structure |
| 08/24/2005 | CN1659936A Flexible printed circuit board and process for producing the same |
| 08/24/2005 | CN1659686A 衬底处理设备和衬底处理方法 The substrate processing apparatus and a substrate processing method |
| 08/24/2005 | CN1659316A Copper-tin-oxygen based alloy plating |
| 08/24/2005 | CN1659315A Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 08/24/2005 | CN1658739A Production method of suspension board with circuit |
| 08/24/2005 | CN1216385C Thin film resistor element and its producing method |
| 08/23/2005 | US6932896 Applying a reverse bias that will cause removal of, or reduction in the size of, conductive particles on the work-piece-surface-influencing device; brushes rotating in a different direction during electrodeposition; wafers/circuits |
| 08/23/2005 | US6932874 Method for increasing the copper to superconductor ratio in a superconductor wire |
| 08/18/2005 | WO2005076680A2 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectrict substrate |
| 08/18/2005 | WO2002031227A3 Deposition uniformity control for electroplating apparatus, and associated method |
| 08/18/2005 | US20050178668 Method for depositing nickel- and chromium (VI) -free metal matte layers |
| 08/18/2005 | US20050178667 Actively changing the first current distribution to produce a second current distribution different from the first in the electrolytic fluid while the microelectronic workpiece is in contact therewith |
| 08/18/2005 | US20050178666 to effectively provide a surface having a desired pattern; masking; electrochemical deposition; conductive base structure comprises a fabric layer; woven conductive fiber material or a woven dielectric fiber at least partially covered with a conductive material |
| 08/17/2005 | EP1564314A1 Metal plating structure and method for production thereof |
| 08/17/2005 | EP1564311A1 Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereon |
| 08/17/2005 | EP1563119A1 Apparatus and method for deposition of an electrophoretic emulsion |
| 08/17/2005 | EP0859686B1 Fabricating interconnects and tips using sacrificial substrates |
| 08/17/2005 | CN1655893A Process for electrolytic coating of a strand casting mould |
| 08/17/2005 | CN1655072A Developing apparatus |
| 08/17/2005 | CN1215202C Porous nickel foil for alkaline battery cathode, production method and device therefor |
| 08/16/2005 | US6929734 Overcoating wire with dielectrics; electrodeposition from bath |
| 08/16/2005 | US6929723 Electroplating apparatus using a non-dissolvable anode and ultrasonic energy |
| 08/16/2005 | US6929722 Substrate plating apparatus |
| 08/11/2005 | WO2005074347A1 Electromagnetic shielding film and method for producing same |
| 08/11/2005 | WO2005073437A1 Composite chromium plating film, and sliding member having the film and method for manufacture thereof |
| 08/11/2005 | WO2005073435A1 Sealing agent, method of sealing and printed circuit board treated with the sealing agent |
| 08/11/2005 | WO2004099460B8 Method for producing galvanically enhanced moulded elements optionally lighted by transparency,made of thermoplastic,thermosetting plastic,elastomer or silicone, as well as moulded elements optionally lighted by transparency made of thermoplastic,thermosetting plastic,elastomer or silicone with galvanically enhanced surface |
| 08/11/2005 | US20050176267 Press-fit terminal |
| 08/11/2005 | US20050175378 Developing apparatus |
| 08/11/2005 | US20050174722 Flexible printed circuit board and process for producing the same |
| 08/11/2005 | US20050173253 Minimizing voids and cracks from thermal shock; dispensing heat processing fluid onto substrate prior to annealing; high throughput |
| 08/11/2005 | US20050173252 electroplating the copper ions from the plating solution directly onto the barrier layer of a microelectronic workpiece; microstructure vias can be filled, forming a uniform layer; annealing at low temperatures |
| 08/11/2005 | US20050173251 Hydrophilic treatment method and wiring pattern forming method |
| 08/11/2005 | US20050173250 Preventing voids during metal electrodeposition on integrated circuits; simultaneously regulating voltage between anode and cathode to reference electrode |
| 08/11/2005 | US20050173241 In an electroplating cell, providing an anode chamber with at least two concentric anodes, generating a computer generated model with a simulation computer program; and selecting at least one current ratio from the model |
| 08/10/2005 | EP1562412A2 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate |
| 08/10/2005 | EP1562409A2 Hydrophilic treatment and wiring pattern formation including It |
| 08/10/2005 | EP1562229A2 Method for manufacturing metal structures having different heights |
| 08/10/2005 | EP1560949A1 Integrated plating and planarization process and apparatus therefor |
| 08/10/2005 | CN2716295Y Immersion pre-processing electrolytic cell for continuous plating line electrode roller |
| 08/10/2005 | CN1653211A Electropolishing and/or electroplating apparatus and methods |
| 08/10/2005 | CN1652667A Hydrophilic treatment method and wiring pattern forming method |
| 08/10/2005 | CN1652311A Semiconductor device and manufacturing process therefor as well as plating solution |
| 08/10/2005 | CN1652310A Semiconductor device and manufacturing process therefor as well as plating solution |
| 08/10/2005 | CN1214134C Conditioning composition for improving adhesion and covering rate of conductive coating on surface with through hole and method for making welding surface non-air hole |
| 08/10/2005 | CN1214133C Method and apparatus for electrochemical mechanical deposition |
| 08/09/2005 | US6927940 Method for seed layer removal for magnetic heads |
| 08/09/2005 | US6926817 Solution processing apparatus and solution processing method |
| 08/09/2005 | US6926816 computer simulation in the pattern plating |
| 08/04/2005 | WO2005072040A1 Electromagnetic shielding film and method for manufacturing same |
| 08/04/2005 | WO2002004715A3 Deposition uniformity control for electroplating apparatus, and associated method |
| 08/04/2005 | US20050170645 Metal plating using seed film |
| 08/04/2005 | US20050167280 Method of forming a metal-containing layer over selected regions of a semiconductor substrate |
| 08/04/2005 | US20050167279 Forming a first and second electrically conductive materials semiconductor substrate; flowing electrical current; selectively oxidizing first electrically conductive material relative to second electrically conductive material during the flowing of telectrical current to form stable oxide layer |
| 08/04/2005 | US20050167278 Methods of forming capacitor constructions |
| 08/04/2005 | US20050167277 forming capacitor which has a thicker platinum substance on the first electrically conductive material relative to the substance on the second electrically conductive material; selectively deposition |
| 08/04/2005 | US20050167276 Process for electrolytic coating of a strand casting mould |
| 08/04/2005 | US20050167275 Method and apparatus for fluid processing a workpiece |
| 08/04/2005 | US20050167265 System for electrochemically processing a workpiece |
| 08/03/2005 | CN1649676A Minimizing whisker growth in tin electrodeposits |